JPH02106842U - - Google Patents
Info
- Publication number
- JPH02106842U JPH02106842U JP1482689U JP1482689U JPH02106842U JP H02106842 U JPH02106842 U JP H02106842U JP 1482689 U JP1482689 U JP 1482689U JP 1482689 U JP1482689 U JP 1482689U JP H02106842 U JPH02106842 U JP H02106842U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component body
- flat
- view
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の表面実装型電子部
品を示す図で、イはその側面図、ロはその斜視図
、第２図は本考案の表面実装型電子部品の製作過
程で用いるリード線の側面図、第３図は本考案の
表面実装型電子部品の製作過程における組立斜視
図、第４図は本考案の他の実施例の表面実装型電
子部品を示す斜視図、第５図は本考案のさらに他
の実施例を表面実装型電子部品を示す図で、イは
その側面図、ロはその斜視図、第６図はその製作
過程で用いるリード線の側面図、第７図は本考案
のさらに他の実施例の表面実装型電子部品を示す
図で、イはその側面図、ロはその斜視図、第８図
はその製作過程で用いるリード線の側面図、第９
図は従来の表面実装型電子部品の斜視図である。
１……表面実装型電子部品、２……電子部品本
体、３……リード端子、４……垂直部、５……取
付け部、６……ホルダー部、７……配線パターン
、８……皮膜抵抗体、９……配線基板、１０……
折曲部。
Figure 1 shows a surface-mounted electronic component according to an embodiment of the present invention, where A is a side view thereof, B is a perspective view thereof, and Figure 2 is used in the manufacturing process of the surface-mounted electronic component of the present invention. A side view of a lead wire, FIG. 3 is an assembled perspective view of the surface mount type electronic component of the present invention in the manufacturing process, FIG. 4 is a perspective view showing a surface mount type electronic component of another embodiment of the present invention, and FIG. The figures show a surface-mounted electronic component according to yet another embodiment of the present invention, in which A is a side view thereof, B is a perspective view thereof, FIG. 6 is a side view of a lead wire used in the manufacturing process, and FIG. The figures show a surface-mounted electronic component according to still another embodiment of the present invention, in which A is a side view thereof, B is a perspective view thereof, FIG. 8 is a side view of a lead wire used in the manufacturing process, and FIG.
The figure is a perspective view of a conventional surface-mounted electronic component. DESCRIPTION OF SYMBOLS 1...Surface mounted electronic component, 2...Electronic component body, 3...Lead terminal, 4...Vertical part, 5...Mounting part, 6...Holder part, 7...Wiring pattern, 8...Coating Resistor, 9... Wiring board, 10...
Bending part.
Claims (1)
ら伸びている複数のリード端子とからなる電子部
品において、 平板状の電子部品本体の平面部が外部の回路基
板の取付け面に対して略垂直になるようにし、 前記リード端子が、前記電子部品本体の下面か
ら前記電子部品本体の平面部に沿つて伸びる垂直
部と、その先端を回路基板面に当接するように折
曲した取付け部とを有することを特徴とする表面
実装型電子部品。[Scope of claim for utility model registration] An electronic component consisting of a flat electronic component body and a plurality of lead terminals extending from the electronic component body, where the flat part of the flat electronic component body is connected to an external circuit board. The lead terminal is arranged to be substantially perpendicular to the mounting surface, and the vertical portion of the lead terminal extending from the bottom surface of the electronic component body along the flat surface of the electronic component body and its tip are in contact with the circuit board surface. A surface-mounted electronic component characterized by having a bent mounting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1482689U JPH02106842U (en) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1482689U JPH02106842U (en) | 1989-02-10 | 1989-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106842U true JPH02106842U (en) | 1990-08-24 |
Family
ID=31226363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1482689U Pending JPH02106842U (en) | 1989-02-10 | 1989-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106842U (en) |
-
1989
- 1989-02-10 JP JP1482689U patent/JPH02106842U/ja active Pending