JPH02106865U - - Google Patents
Info
- Publication number
- JPH02106865U JPH02106865U JP1568689U JP1568689U JPH02106865U JP H02106865 U JPH02106865 U JP H02106865U JP 1568689 U JP1568689 U JP 1568689U JP 1568689 U JP1568689 U JP 1568689U JP H02106865 U JPH02106865 U JP H02106865U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- solder
- wiring board
- thickness
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1568689U JPH02106865U (2) | 1989-02-13 | 1989-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1568689U JPH02106865U (2) | 1989-02-13 | 1989-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02106865U true JPH02106865U (2) | 1990-08-24 |
Family
ID=31227948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1568689U Pending JPH02106865U (2) | 1989-02-13 | 1989-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02106865U (2) |
-
1989
- 1989-02-13 JP JP1568689U patent/JPH02106865U/ja active Pending