JPH02106871U - - Google Patents
Info
- Publication number
- JPH02106871U JPH02106871U JP1834390U JP1834390U JPH02106871U JP H02106871 U JPH02106871 U JP H02106871U JP 1834390 U JP1834390 U JP 1834390U JP 1834390 U JP1834390 U JP 1834390U JP H02106871 U JPH02106871 U JP H02106871U
- Authority
- JP
- Japan
- Prior art keywords
- pore
- holding member
- substrate
- circuit board
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案を適用した厚膜混成集積回路板
の要部拡大断面図、第２図は従来の厚膜混成集積
回路板の同上図である。 １……基板、２，７……金属化処理層、３……
部品保持部材、４，８……半田、５……細孔。
の要部拡大断面図、第２図は従来の厚膜混成集積
回路板の同上図である。 １……基板、２，７……金属化処理層、３……
部品保持部材、４，８……半田、５……細孔。
Claims (1)
- 回路部品の金属の部品保持部材が、基板に明け
られた細孔の内表面およびそれに続く基板面の細
孔の周辺に形成された金属化処理層に、半田で接
合している厚膜混成集積回路板において、該金属
化処理層は該細孔の内周全体に渡り該細孔の半径
と同寸法程度乃至基板層の１／２程度に設けられ
ており、かつ該細孔の内径が部品保持部材の外径
より小さく、部品保持部材の端部が該細孔に対向
する位置に固定されていることを特徴とする厚膜
混成集積回路板。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990018343U JPH0325427Y2 (ja) | 1990-02-27 | 1990-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990018343U JPH0325427Y2 (ja) | 1990-02-27 | 1990-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02106871U true JPH02106871U (ja) | 1990-08-24 |
| JPH0325427Y2 JPH0325427Y2 (ja) | 1991-06-03 |
Family
ID=31232906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990018343U Expired JPH0325427Y2 (ja) | 1990-02-27 | 1990-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0325427Y2 (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025168U (ja) * | 1983-07-25 | 1985-02-20 | 富士通株式会社 | 電子部品の搭載構造 |
-
1990
- 1990-02-27 JP JP1990018343U patent/JPH0325427Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025168U (ja) * | 1983-07-25 | 1985-02-20 | 富士通株式会社 | 電子部品の搭載構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0325427Y2 (ja) | 1991-06-03 |