JPH02106874U - - Google Patents

Info

Publication number
JPH02106874U
JPH02106874U JP1404989U JP1404989U JPH02106874U JP H02106874 U JPH02106874 U JP H02106874U JP 1404989 U JP1404989 U JP 1404989U JP 1404989 U JP1404989 U JP 1404989U JP H02106874 U JPH02106874 U JP H02106874U
Authority
JP
Japan
Prior art keywords
wiring board
bonding pad
wire bonding
inner layer
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1404989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1404989U priority Critical patent/JPH02106874U/ja
Publication of JPH02106874U publication Critical patent/JPH02106874U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】
第１図は本考案の一実施例を示す要部斜視図、
第２図は第１図の平面図である。 図中、１は多層配線基板、２，３，４は層、５
は導体配線、６はワイヤボンデイングパツドであ
る。

Claims (1)

    【実用新案登録請求の範囲】
  1. 多層配線基板の表裏面以外の内層の配線基板の
    導体配線を部分的に露出させると共にその露出部
    にワイヤボンデイングパツドを設けたことを特徴
    とする配線基板。
JP1404989U 1989-02-10 1989-02-10 Pending JPH02106874U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1404989U JPH02106874U (ja) 1989-02-10 1989-02-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1404989U JPH02106874U (ja) 1989-02-10 1989-02-10

Publications (1)

Publication Number Publication Date
JPH02106874U true JPH02106874U (ja) 1990-08-24

Family

ID=31224894

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1404989U Pending JPH02106874U (ja) 1989-02-10 1989-02-10

Country Status (1)

Country Link
JP (1) JPH02106874U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057999A (ja) * 1983-09-09 1985-04-03 日本電気株式会社 多層配線板
JPS61154152A (ja) * 1984-12-21 1986-07-12 フィリップス　エレクトロニクス　ネムローゼ　フェンノートシャップ 電子装置用ハウジング

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057999A (ja) * 1983-09-09 1985-04-03 日本電気株式会社 多層配線板
JPS61154152A (ja) * 1984-12-21 1986-07-12 フィリップス　エレクトロニクス　ネムローゼ　フェンノートシャップ 電子装置用ハウジング

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