JPH02108340U

JPH02108340U -

Info

Publication number: JPH02108340U
Application number: JP1675389U
Authority: JP
Priority date: 1989-02-14
Filing date: 1989-02-14
Publication date: 1990-08-29

Description

[Brief explanation of drawings]

第１図は、この考案の一実施例に係るウエーハ
デイスクの半分を示す平面図である。第２図は、
第１図の線Ａ−Ａに概ね沿う拡大断面図である。
第３図は、第１図の線Ｂ−Ｂに沿う拡大断面図で
ある。第４図は、デイスク本体の冷媒通路の部分
の一例を示す拡大断面図であり、第１図のＣ−Ｃ
断面に相当する。第５図は、従来のウエーハデイ
スクの一例を示す平面図である。第６図は、第５
図の線Ｄ−Ｄに沿う概ね沿う断面図である。２０……実施例に係るウエーハデイスク、２２
……デイスク本体、２４……ボス部、２６……冷
媒通路、３０……円板部、３２……貫通穴、３４
……冷媒通路、３８……ウエーハ装着座、４０…
…冷媒通路、４４……パツキン、４６……冷却パ
イプ、４８……パツキン。 FIG. 1 is a plan view showing half of a wafer disk according to an embodiment of this invention. Figure 2 shows
FIG. 2 is an enlarged cross-sectional view taken generally along line A-A in FIG. 1;
FIG. 3 is an enlarged cross-sectional view taken along line BB in FIG. 1. FIG. 4 is an enlarged sectional view showing an example of the refrigerant passage portion of the disk body, and is an enlarged sectional view taken along the line C-C in FIG.
Corresponds to a cross section. FIG. 5 is a plan view showing an example of a conventional wafer disk. Figure 6 shows the fifth
1 is a cross-sectional view taken generally along line D-D in the figure; FIG. 20...Wafer disk according to the example, 22
... Disk body, 24 ... Boss part, 26 ... Refrigerant passage, 30 ... Disc part, 32 ... Through hole, 34
... Refrigerant passage, 38 ... Wafer mounting seat, 40 ...
... Refrigerant passage, 44... Packing, 46... Cooling pipe, 48... Packing.

Claims

[Scope of utility model registration request]

A plurality of through holes with a conical peripheral surface are provided in the peripheral edge of a disc-shaped disk body having a boss portion, and a plurality of wafer mounting seats each having a refrigerant passage therein are fitted into each through-hole and machined into the disk body. Connecting the refrigerant passages in each wafer mounting seat in series with the refrigerant passage formed by the method, and connecting the refrigerant passages in the wafer mounting seats located at both ends to the refrigerant passage formed in the boss portion with a cooling pipe, A wafer disk having a structure in which the connecting portions thereof and the connecting portions between the refrigerant passages in each wafer mounting seat and the refrigerant passages in the disk body are each sealed with gaskets.