JPH025873U - - Google Patents
Info
- Publication number
- JPH025873U JPH025873U JP8427888U JP8427888U JPH025873U JP H025873 U JPH025873 U JP H025873U JP 8427888 U JP8427888 U JP 8427888U JP 8427888 U JP8427888 U JP 8427888U JP H025873 U JPH025873 U JP H025873U
- Authority
- JP
- Japan
- Prior art keywords
- cooling medium
- attached
- disk
- cooling
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002826 coolant Substances 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 3
Description
第１図は、この考案の一実施例に係るウエハデ
イスクを部分的に示す平面図である。第２図は、
第１図の線−に概ね沿う拡大断面図である。
第３図は、従来のウエハデイスクの一例を示す平
面図である。第４図は、第３図の線−に概ね
沿う断面図である。
１２……円板部、１４……ウエハ取付座、１６
……冷却媒体の通路、２０……ボス部、２２……
冷却媒体の往路、２４……冷却媒体の復路、２６
……冷却パイプ、２８……パツキン、３０，３２
……ボルト（締結手段）、４０……実施例に係る
ウエハデイスク。
FIG. 1 is a plan view partially showing a wafer disk according to an embodiment of the invention. Figure 2 shows
FIG. 2 is an enlarged sectional view taken generally along the line - of FIG. 1;
FIG. 3 is a plan view showing an example of a conventional wafer disk. FIG. 4 is a sectional view generally taken along the line - in FIG. 3. 12...Disc part, 14...Wafer mounting seat, 16
...Cooling medium passage, 20...Boss part, 22...
Outward path of cooling medium, 24...Return path of cooling medium, 26
...Cooling pipe, 28...Patzkin, 30,32
... Bolt (fastening means), 40 ... Wafer disk according to the embodiment.
Claims (1)
結手段によつて円板部を取り付け、この円板部に
締結手段によつて複数のウエハ取付座であつて冷
却媒体の通路をそれぞれ有するものを取り付け、
かつこの円板部に、冷却媒体を通す冷却パイプを
取り付けてこれで各ウエハ取付座の冷却媒体の通
路間を直列に接続すると共にその両端をボス部の
冷却媒体の往路および復路にそれぞれ接続し、そ
して冷却パイプと他との接続部をパツキンでシー
ルした構造のウエハデイスク。 A disk portion is attached to a boss portion having an outward path and a return path for a cooling medium by means of a fastening means, and a plurality of wafer mounting seats each having a passage for a cooling medium are attached to this disk portion by means of a fastening means. ,
Moreover, a cooling pipe for passing a cooling medium is attached to this disk part, and this pipe connects the cooling medium passages of each wafer mounting seat in series, and both ends thereof are connected to the outward and returning paths of the cooling medium of the boss part, respectively. , and a wafer disk with a structure in which the connection between the cooling pipe and other parts is sealed with a gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084278U JPH0728692Y2 (en) | 1988-06-25 | 1988-06-25 | Wafer disk |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988084278U JPH0728692Y2 (en) | 1988-06-25 | 1988-06-25 | Wafer disk |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH025873U true JPH025873U (en) | 1990-01-16 |
| JPH0728692Y2 JPH0728692Y2 (en) | 1995-06-28 |
Family
ID=31308974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988084278U Expired - Lifetime JPH0728692Y2 (en) | 1988-06-25 | 1988-06-25 | Wafer disk |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0728692Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919518U (en) * | 1972-05-18 | 1974-02-19 | ||
| JP2009266391A (en) * | 2008-04-22 | 2009-11-12 | Sumco Corp | Oxygen ion implanter |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61116746A (en) * | 1984-09-19 | 1986-06-04 | アプライド マテリアルズ インコ−ポレ−テツド | Apparatus and method for ion plantation of semiconductor wafer |
-
1988
- 1988-06-25 JP JP1988084278U patent/JPH0728692Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61116746A (en) * | 1984-09-19 | 1986-06-04 | アプライド マテリアルズ インコ−ポレ−テツド | Apparatus and method for ion plantation of semiconductor wafer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4919518U (en) * | 1972-05-18 | 1974-02-19 | ||
| JP2009266391A (en) * | 2008-04-22 | 2009-11-12 | Sumco Corp | Oxygen ion implanter |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0728692Y2 (en) | 1995-06-28 |
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