JPH02109277A - Electronic device - Google Patents
Electronic deviceInfo
- Publication number
- JPH02109277A JPH02109277A JP63261526A JP26152688A JPH02109277A JP H02109277 A JPH02109277 A JP H02109277A JP 63261526 A JP63261526 A JP 63261526A JP 26152688 A JP26152688 A JP 26152688A JP H02109277 A JPH02109277 A JP H02109277A
- Authority
- JP
- Japan
- Prior art keywords
- thermal expansion
- lead
- substrate
- solder
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子装置のリードと基板の接続構造に係り、
特に、自動車用電子装置などのように、きびしい熱的環
境におかれる装置に好適な構造に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a connection structure between a lead and a board of an electronic device.
In particular, it relates to a structure suitable for devices exposed to severe thermal environments, such as electronic devices for automobiles.
従来の装置は、特開昭５５−１．２７２８号公報に記載
のように、一種類の材質でできたリードを基板に半田で
接続していた。In the conventional device, as described in Japanese Patent Application Laid-open No. 55-1.2728, a lead made of one type of material is connected to a board by soldering.
上記従来技術は、リードと基板の熱膨張差の低減につい
ての配慮がされておらず装置使用中に温度変化が繰り返
し加わるとリードと基板を接続する半田にひずみが生じ
、疲労破壊が生じるという問題があった。The above conventional technology does not take into account the reduction of the difference in thermal expansion between the leads and the board, and when the device is repeatedly subjected to temperature changes during use, the solder that connects the leads and the board becomes strained, resulting in fatigue failure. was there.
本発明は、リードと基板の熱膨張差を低減することを目
的としており、さらに、両者を接続する゛ト田の熱疲労
破壊を防止した電子装置を提供することにある。An object of the present invention is to reduce the difference in thermal expansion between a lead and a substrate, and furthermore, to provide an electronic device in which thermal fatigue failure of the gate connecting the two is prevented.
一１―記目的を達成するために、リードの基板との接続
部分に熱膨張調整板を接合したものである。In order to achieve the above object, a thermal expansion adjusting plate is bonded to the connection portion of the lead to the substrate.
リードに接合された熱膨張調整板は、リードの熱膨張を
基板の熱膨張に一致させるように働く。A thermal expansion adjustment plate bonded to the leads serves to match the thermal expansion of the leads to the thermal expansion of the substrate.
これによって、リードと基板を接合する半ｌ］に生じる
歪みはきわめてノ１１くなるので、半田が疲労破壊する
ことがない。As a result, the strain caused in the half part where the lead and the board are joined is extremely reduced, so that the solder does not suffer from fatigue failure.
以ド、本発明の一実施例を第１図及び第２図により説明
する。Hereinafter, one embodiment of the present invention will be described with reference to FIGS. 1 and 2.
基板１は、基板４の４−に配線５１５’ ｇ ５“及び
パッド６．６′ を形成することにより作成される。The substrate 1 is made by forming the wiring 515'g 5'' and the pad 6.6' on the 4- of the substrate 4.
（：３）
基板４の材料としては、絶縁性の優れたアルミナなどの
セラミクスや、ガラスエポキシ等の樹脂系の材料が適し
ている。(:3) Suitable materials for the substrate 4 include ceramics such as alumina with excellent insulation properties, and resin-based materials such as glass epoxy.
配線５．５’ 、５“及びパッド６．６′の月料として
は、アルミナ基板の場合は、印刷焼成による配線形成に
適したΔｇ Ｉ〕ｄを用いるのが良い３、ガラスエポキ
シ基板の場合は、メツキによる配線形成に適したＣ ｕ
を用いるのが良い。As for the monthly charges for wiring 5.5', 5" and pad 6.6', in the case of an alumina substrate, it is best to use Δg I]d, which is suitable for wiring formation by printing and firing3. In the case of a glass epoxy substrate is Cu suitable for wiring formation by plating.
It is better to use
一方、リード２は、リード本体７の半１４１接続部分７
ａ、７ａ’に、熱膨張＠整板８，８′及び９゜９′を上
下から接合し、適当な表面処理を行うことにより作成さ
れる。On the other hand, the lead 2 is connected to the half 141 connecting portion 7 of the lead body 7.
A, 7a' are joined to thermal expansion @ fairing plates 8, 8', and 9°9' from above and below, and an appropriate surface treatment is performed.
リード本体７の材料としては、電気伝導性の良好な銅系
の材料が用いられる。熱膨張調整板８゜８’ 、９．９
’の材料としては、熱膨張係数の大きなリードの膨張を
おさえるために、熱膨張係数の小さなＦｅ−Ｎｉ系合金
やＭｏ、Ｗなどの材料が適している。As the material of the lead body 7, a copper-based material with good electrical conductivity is used. Thermal expansion adjustment plate 8°8', 9.9
In order to suppress the expansion of the leads having a large coefficient of thermal expansion, materials such as Fe--Ni alloy, Mo, W, etc., which have a small coefficient of thermal expansion, are suitable as the material for .
リードの表面処理としては、半［１１づ１性の向１゜の
ため、Ｎｉ、Ｓｕ、半田等のメツキを行うとよｂ）。As for the surface treatment of the leads, plating with Ni, Su, solder, etc. is recommended since the lead has a 1° diagonal of 11°.
リード本体７の折れ曲がった現状の加工法としては、機
械加［により削り出す方法も考えられるが、板を塑性加
工により折り曲げて作るのが、コスト上有利である。As a current method for forming the bent lead body 7, a method of cutting it out by mechanical processing may be considered, but it is advantageous in terms of cost to bend the plate by plastic processing.
リード本体と熱膨張調整板の間の接合方法としては、強
固な接合の得られろ銀ろうなどの硬ろうによる接合が考
えられるが、十分な強度が得られるとともに、コストの
低い方法として、圧接による接合が有効である。As a joining method between the lead body and the thermal expansion adjustment plate, joining using hard solder such as silver solder can provide a strong joint, but joining by pressure welding is a low-cost method that provides sufficient strength. is valid.
リード２は、基板１と半田３，３′により接続される。The leads 2 are connected to the substrate 1 by solders 3 and 3'.
このリード２の電気的な機能は、配線５と配線５′を、
両配線の間にある配線５＃にふれることなく接続するこ
とにある。The electrical function of this lead 2 is to connect the wiring 5 and the wiring 5'.
The purpose is to connect without touching the wiring 5# between the two wirings.
従来の熱膨張調整板がない場合は、温度ヒ９１６が加わ
ると、リードの大きな熱膨張と基板の小さな熱膨張の差
によ−）で、半［１１（こ大きな歪みがノセじ。In the absence of a conventional thermal expansion adjustment plate, when a temperature drop 916 is applied, the difference between the large thermal expansion of the leads and the small thermal expansion of the substrate causes a distortion of half [11].
このひずみの繰り返しにより、Ｖ＃ ＦｆＪの疲労破壊
が生し、電気的な接続が失われるという問題があつた。This repetition of strain caused a problem of fatigue failure of the V# FfJ and loss of electrical connection.
これに対して、本実施例では、リード本体７の大きな熱
膨張が、熱膨張調整板８．８’ 、９．９’により拘束
され、みかけ１−小さな熱膨張となるため、基板１との
熱膨張差が小さくなり、半Ｉｌｌ ３ 。On the other hand, in this embodiment, the large thermal expansion of the lead body 7 is restrained by the thermal expansion adjusting plates 8.8' and 9.9', resulting in an apparent small thermal expansion. The thermal expansion difference becomes smaller, half Ill 3 .
３′に生じる歪みも小さくなり、半１＋３の疲労破壊が
生じなくなるため、電気的な接続が失われろことも防止
できる。Since the strain generated at 3' is also reduced and half 1+3 fatigue failure does not occur, loss of electrical connection can also be prevented.
また、リード本体の片方にだけ、熱膨張調整板を接合す
る方法も考えられる。この場合、接合板と接合面の数を
減らせるというメリツ］−があるが。Another possible method is to bond a thermal expansion adjusting plate to only one side of the lead body. In this case, there is an advantage that the number of joint plates and joint surfaces can be reduced.
一方リード本体と熱膨張調整板の熱膨張差により、温度
変化が加わった場合に、そりが生じるという問題がある
。このそりにより、！ｔ’−［：Ｉ−１に大きな歪が生
じる場合がある。On the other hand, due to the difference in thermal expansion between the lead body and the thermal expansion adjusting plate, there is a problem that warping occurs when a temperature change is applied. With this sled! A large distortion may occur in t'-[:I-1.
これに対して本実施例では、リード本体６の１−と下の
両方に熱膨張調整板８，８′と９．（ｉ’ が接合され
ているため、そりを生じることがなく。In contrast, in this embodiment, the thermal expansion adjusting plates 8, 8' and 9. (Since i' is bonded, no warping occurs.
そりによる歪みの発生も防ぐことができる。Distortion due to warping can also be prevented.
本実施例において、リード本体７の材料として銅を用い
、熱膨張調整板８．８’ 、９．９’の材料として、４
２％Ｎ ｉ −Ｆ ｅ合金を用いた場合のリードのみか
けの熱膨張係数と、熱膨張調整板８゜８’、９．９’の
厚さのり−１く本体の半田接続部分７ａ、７ａ’ の厚
さに対する関係を解析した結果を、基板に用いられるガ
ラスエポキシ及びアルミナの熱膨張係数と比較して、第
；３図に示す。In this embodiment, copper is used as the material of the lead body 7, and the material of the thermal expansion adjustment plates 8.8' and 9.9' is 4.
Apparent thermal expansion coefficient of lead when using 2%Ni-Fe alloy, thickness of thermal expansion adjustment plates 8°8', 9.9', solder connection parts 7a, 7a of main body Figure 3 shows the results of analyzing the relationship between ' and the thermal expansion coefficients of glass epoxy and alumina used for the substrate.
図より、リートの、みかけの熱膨張係数をガラスエポキ
シにあオ〕せるためには、熱膨張ｇＩ整板の厚さをり一
１〜本体の厚さの０．１５ にすればよいことがわかる
。一方、アルミナの熱膨張係数と合せるためには、Ｊ、
７２ とすればよい。From the figure, it can be seen that in order to make the apparent coefficient of thermal expansion of the REET higher than that of the glass epoxy, the thickness of the thermal expansion gI plate should be set to 11 to 0.15 of the thickness of the main body. On the other hand, in order to match the thermal expansion coefficient of alumina, J,
72.
半１１の破壊を防ぐためには、熱膨張率の差を１．０Ｘ
ｉＯ−６°Ｃ−１以下とすればよいが、このためには、
ガラスエポキシ基板の場合は、その比率＆０．１０から
０．２２の間に、アルミナＪＡ板の場合は、１．１から
コ３．６の間に設定すればよいことが、同様な解析によ
りわかった。In order to prevent half-11 destruction, the difference in thermal expansion coefficient should be 1.0X.
The temperature should be less than iO-6°C-1, but for this purpose,
A similar analysis revealed that the ratio should be set between 0.10 and 0.22 for glass epoxy boards, and between 1.1 and 3.6 for alumina JA boards. Ta.
本実施例では、熱膨張調整板８．８’ 、９．９’をリ
ート７の接続部分７ａ、７ａ’のみに接合しく７）
ているが、リード７の全体に接合する構造も考えられる
。この場合、リートの水平部分７ｃと基板］との熱膨張
差の影響も低減できるという利点がある。しかし、この
熱膨張差の影響は、本実施例の構造においても、リード
７の接続部分７ａ。In this embodiment, the thermal expansion adjusting plates 8.8' and 9.9' are bonded only to the connecting portions 7a and 7a' of the lead 7, but a structure in which they are bonded to the entire lead 7 is also conceivable. In this case, there is an advantage that the influence of the difference in thermal expansion between the horizontal portion 7c of the REIT and the substrate can also be reduced. However, even in the structure of this embodiment, this difference in thermal expansion affects the connection portion 7a of the lead 7.
７ａ’ と水平部分７ｃの高さの差をある程度大きくと
ることにより、両各をつなぐ部分７ ）） 、 ７ ［
）’の弾性変形として、吸収することにより、実用」−
二問題のないレベルまで小さくすることができる。By increasing the difference in height between 7a' and the horizontal part 7c to a certain extent, the part 7)) that connects both parts 7)), 7[
) 'Practical by absorbing as elastic deformation'-
It is possible to reduce the size to a level that does not cause any problems.
一方、本実施例のように、リート７の接続部分７ａ、７
ａ’のみに熱膨張調整板を接合することのメリットとし
ては、材料の節約、リードの曲げ加工の容易さによるコ
ストの低減が挙げられる５゜また、装置が振動加速度を
受ける環境で使オ〕れる場合に、リード７の全質量が小
さくなるため、慣性が小さくなり、半田３．３’ に加
わる力も小さくなるため、振動による半［［３，３’
の破壊が防げる。On the other hand, as in this embodiment, the connecting portions 7a, 7 of the REIT 7
The advantages of joining a thermal expansion adjustment plate only to a' include saving on materials and reducing costs due to the ease of bending the leads. When the solder 3.3'
can be prevented from being destroyed.
第４図は、本発明の別の実施例の要部であり。FIG. 4 shows the main part of another embodiment of the present invention.
部品］Ｏと基板１を接続するリードに適用した例を示し
ている。部品１０では、その動作により発熱が生じる場
合が多く、この熱を逃がして部品の温度−１−昇を防ぐ
ためには、リード７の材料として銅系の材料を用いるこ
とが有効である。一方、銅系の材料の熱膨張率は基板１
の熱膨張率よりかなり大きいため、このマツチングをは
かるために、本発明の適用が特に有効である。Components] An example is shown in which the present invention is applied to a lead connecting O and the substrate 1. The component 10 often generates heat due to its operation, and it is effective to use a copper-based material as the material for the lead 7 in order to dissipate this heat and prevent the temperature of the component from increasing. On the other hand, the coefficient of thermal expansion of copper-based materials is
Since the coefficient of thermal expansion is considerably larger than that of
第５図は、本発明のまた別の実施例の要部であり、外部
端子１２と基板１を接続するリードに適用した例を示し
ている。外部端子１２は、ケース１１に埋め込まれるこ
とにより保持され、基板１は接着材１；３によりケース
】１に固定される。リード７は、外部端−ｔリート１２
と溶接点１４のスポット溶接にて接続される。FIG. 5 shows a main part of yet another embodiment of the present invention, and shows an example in which the present invention is applied to a lead connecting an external terminal 12 and a substrate 1. The external terminals 12 are held by being embedded in the case 11, and the substrate 1 is fixed to the case 1 with an adhesive 1; Lead 7 has outer end-t lead 12
and are connected by spot welding at welding point 14.
外部端子１２には、大きな電流が流れる場合が多く、こ
れと接続するり一ド７には電気伝導率の高い銅糸材料を
使うのが電気特性上有利である。A large current often flows through the external terminal 12, and it is advantageous in terms of electrical properties to use a copper thread material with high electrical conductivity for the lead 7 connected thereto.
この場合、前例と回し理由により、本発明の適用が有効
である。In this case, the application of the present invention is effective due to the precedent and the reason.
（発明の効果〕
（！Ｊ）
本発明によれば、リードの熱膨張率を基板の熱膨張とほ
ぼ等しくなるよう、に調整できるので、リードと基板を
接続する”ト田に生じる歪みを低減できる効果がある。(Effects of the Invention) (!J) According to the present invention, the coefficient of thermal expansion of the lead can be adjusted to be almost equal to the thermal expansion of the board, thereby reducing the distortion that occurs in the "toad" that connects the lead and the board. There is an effect that can be done.
これによって接続半田の疲労破壊を防止することができ
る。This can prevent fatigue failure of the connection solder.
第１図は本発明の一実施例の電子装置の側面断面図、第
２図は第１図の平面図、第３図はり−１−’のみかけの
熱膨張係数と熱膨張調整基板ノｖさのリード本体厚さに
対する比の関係を示す特性図、第４図は本発明の別の実
施例の″６１ｆ装置の側面図、第５図は本発明の更に別
の実施例の電子装置の側面断面図である。
１・・・基板、２・・・リード、３．３・・・はんだ、
４ ・基板、５．５’ 、５’・・配線、６，６′・・
・バラ１〜．７・・リード本体、７ａ、７ａ’ ・・リ
ー１〜本体接続部分、７ｃ・・リード水平部分、７ｂ、
７ｔ、＋’７ａ、７ａ’ と７０の接続部分、８．８’
、９゜９′・・・熱膨張調整板、１０・・・部品、１
１ ケース、１２・・外部端子、１；３・・接着材、１
４ ・溶接点、。FIG. 1 is a side sectional view of an electronic device according to an embodiment of the present invention, FIG. 2 is a plan view of FIG. FIG. 4 is a side view of a 61f device according to another embodiment of the present invention, and FIG. 5 is a characteristic diagram showing the relationship between the ratio of lead body thickness to lead body thickness. It is a side sectional view. 1... Board, 2... Lead, 3.3... Solder,
4 ・Board, 5.5', 5'...Wiring, 6,6'...
・Rose 1～. 7...Lead body, 7a, 7a'...Lee 1 to main body connection part, 7c...Lead horizontal part, 7b,
7t, +'7a, connection part of 7a' and 70, 8.8'
, 9°9'... Thermal expansion adjustment plate, 10... Parts, 1
1 Case, 12... External terminal, 1; 3... Adhesive, 1
4 ・Welding point.
Claims (5)
リードの基板との接続部分に熱膨張調整板を接合したこ
とを特徴とする電子装置。1. In electronic devices where the leads and the board are connected by soldering,
An electronic device characterized in that a thermal expansion adjustment plate is bonded to the connection portion of the lead to the substrate.
方に熱膨張調整板を接合したことを特徴とする電子装置
。2. 2. An electronic device according to claim 1, wherein thermal expansion adjusting plates are bonded to both the upper and lower surfaces of the leads.
ードの接続部分にのみ接合されていることを特徴とする
電子装置。3. 3. The electronic device according to claim 2, wherein the thermal expansion adjusting plate is bonded only to the connecting portion of the lead.
基板の基板がガラスエポキシで、熱膨張調整板が４２％
Ｎｉ−Ｆｅ合金でできており、前記熱膨張調整板の厚さ
がリード本体の接続部分の厚さの０．１０〜０．２２倍
の間にあることを特徴とする電子装置。4. 4. The lead body according to claim 3, wherein the lead body is made of copper;
The substrate of the board is glass epoxy, and the thermal expansion adjustment plate is 42%.
An electronic device made of a Ni-Fe alloy, wherein the thickness of the thermal expansion adjustment plate is between 0.10 and 0.22 times the thickness of the connecting portion of the lead body.
基板の基板がアルミナで、熱膨張調整板が４２％Ｎｉ−
Ｆｅ合金でできており、前記熱膨張調整板の厚さがリー
ド本体の接続部分の厚さの１．１から３．６倍の間にあ
ることを特徴とする電子装置。5. 4. The lead body according to claim 3, wherein the lead body is made of copper;
The substrate of the board is alumina, and the thermal expansion adjustment plate is 42% Ni-
An electronic device made of an Fe alloy, wherein the thickness of the thermal expansion adjusting plate is between 1.1 and 3.6 times the thickness of the connecting portion of the lead body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63261526A JP2651853B2 (en) | 1988-10-19 | 1988-10-19 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63261526A JP2651853B2 (en) | 1988-10-19 | 1988-10-19 | Electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02109277A true JPH02109277A (en) | 1990-04-20 |
| JP2651853B2 JP2651853B2 (en) | 1997-09-10 |
Family
ID=17363123
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63261526A Expired - Lifetime JP2651853B2 (en) | 1988-10-19 | 1988-10-19 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2651853B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218399A (en) * | 2007-01-02 | 2008-09-18 | Agc Automotive Americas R & D Inc | Electrical connector for window pane of vehicle |
| JP2009123359A (en) * | 2007-11-12 | 2009-06-04 | Asmo Co Ltd | Drive circuit device, and motor device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928996A (en) * | 1982-08-06 | 1984-02-15 | 三洋電機株式会社 | Balance ring of dehydrator |
-
1988
- 1988-10-19 JP JP63261526A patent/JP2651853B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5928996A (en) * | 1982-08-06 | 1984-02-15 | 三洋電機株式会社 | Balance ring of dehydrator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008218399A (en) * | 2007-01-02 | 2008-09-18 | Agc Automotive Americas R & D Inc | Electrical connector for window pane of vehicle |
| JP2009123359A (en) * | 2007-11-12 | 2009-06-04 | Asmo Co Ltd | Drive circuit device, and motor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2651853B2 (en) | 1997-09-10 |
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