JPH0211322Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a series of chip-shaped electronic components containing a plurality of chip-shaped electronic components.

When so-called chip-shaped electronic components, such as multilayer capacitors, which do not have lead wires for electrical connection, are continuously handled by automatic machines, a form in which they are continuously held on a band-shaped tape is becoming widely used. An example of this will be explained with reference to FIGS. 1 and 2.

1 and 2, in the conventional chip-shaped electronic component series, a strip-shaped base tape 1
A holding member is constituted by the band-shaped front and back seal tapes 2 and 3 bonded to both sides of the base tape 1. The base tape 1 is made of a thick fibrous material, such as cardboard, and has openings 1a, 1a, 1a for storing the chip-shaped electronic components 4 at regular intervals in the longitudinal direction, approximately at the center in the width direction. It is formed. Further, near one side of the base tape 1 in the width direction, perforations 1b, 1b, 1b are formed at regular intervals in the longitudinal direction.

The front and back seal tapes 2 and 3 are each made of a thermoplastic material.

Front and back seal tapes 2 and 3 are base tape 1
are bonded together using thermal adhesive. In particular, when attaching the front seal tape 2, apply the front seal tape 2 to the base tape 1 and line 5a, 5b shown in FIG.
Add heat along the lines. Then, the front seal tape 2
is melted and softened in the region along the line and welded to the base tape 1, and the front seal tape 2 is bonded to the surface of the base tape 1. In this case, the molten seal tape member will also penetrate between the fiber materials of the base tape 1.

The above-mentioned series of chip-shaped electronic components is based on base tape 1.
This is a punching type in which openings 1a, 1a, 1a are formed in the openings, but there is also an embossed type in which recesses 1c, 1c, 1c are formed in place of the openings, as shown in FIG.

The chip-shaped electronic component series configured as described above is
It is mainly mounted on machines for automatic attachment to printed circuit boards, etc. The automatic machine performs predetermined operations to remove the front sealing tape 2, take out the chip-shaped electronic component 4 from the cavity using a suction arm, etc., and attach it to the circuit board.

By the way, in the case of a conventional series of chip-shaped electronic components, the density of the fiber material in the base tape 1 is not dense as a whole, and therefore the surface of the base tape 1 is not smooth. Therefore, a large amount of the melted and softened front seal tape member penetrated deeply between the fiber materials, increasing the bonding strength between the base tape 1 and the front seal tape 2. Furthermore, the density of the fiber material is uneven, and there are localized areas where it is dense and areas where it is not.
There were also local differences in bonding strength.

For this reason, when the front sealing tape 2 is peeled off using an automatic machine or the like, as shown in FIG. This was an obstacle to the removal of electronic components.

Furthermore, since the bonding strength varies, the force for peeling off the front seal tape 2 is not constant, and the feeding speed of the series of chip-shaped electronic components is not stable.

In order to eliminate the above-mentioned drawbacks, it is possible to apply resin, paint, etc. to the surface of the base tape 1 to make the surface smooth, but this increases the manufacturing cost and causes the resin to evaporate when punching the base tape 1. It may peel off or the resin may spill into the cavity, adversely affecting chip-shaped electronic components. Furthermore,
Since an extra load is placed on the punching tool, there is a risk that the punching accuracy will be reduced and the life of the punching tool will be shortened.

The purpose of this invention is to maintain a constant bonding strength between the base tape and the front seal tape, while also preventing the base tape from peeling off in layers when the front seal tape is removed, making it easier to remove chip-shaped electronic components. It is an object of the present invention to propose a series of chip-shaped electronic components constructed in such a manner that the fuzzing of the base tape can be suppressed to the extent that it does not interfere with the process.

In order to achieve the above object, the present invention provides hole-shaped component insertion portions at equal intervals along the longitudinal direction in the widthwise center of a band-shaped base tape containing a fiber material, and chips-shaped components are inserted into the insertion portions. After insertion, a chip-shaped electronic component is formed by covering the insertion opening of the base tape with a band-shaped sealing tape made of thermoplastic and thermally bonding the portions of the sealing tape near both ends in the width direction to the surface of the base tape. Continuously, the part of the base tape made of cardboard etc. to which the sealing tape is to be thermally bonded is compressed through a roller or the like to a smoother value of about 30 to 40, and the melted and softened sealing tape is applied between the fiber materials. The fiber density is made dense so that the fibers do not penetrate deeply, and the fiber density is made uniform so that the fibers penetrate uniformly, so that the bonding strength between the base tape and the seal tape is constant, and when the seal tape is removed, the fiber material of the base tape is The present invention provides a series of chip-shaped electronic components characterized by a structure that is so weak that it will not stand up if it falls over a wall.

Hereinafter, one embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 5 is an exploded perspective view of a series of chip-shaped electronic components according to the present invention. In FIG. 5, 11 is a strip-shaped base tape, 12 is a front seal tape, 13 is a back seal tape, and 14 is a chip-shaped electronic component.
The base tape 11 is made of a thick fiber material, such as cardboard, and has openings 11a, 11a, 11a at regular intervals in the longitudinal direction approximately at the center in the width direction for storing the chip-shaped electronic components 14. It is formed. Furthermore, near one side of the base tape 11 in the width direction, at regular intervals in the longitudinal direction,
Perforations 11b, 11b, 11b are formed.

In the present invention, the base tape 11 is previously subjected to compression treatment such as calendar finishing. For example, when the base tape 11 is made of cardboard,
The surface layer of this cardboard is compressed by passing it through a roller or the like to make the fiber density dense and uniform. According to this method, the surface of the base tape 11 can be made smooth at low cost. The compression treatment may be applied to the entire surface of the base tape 11, that is, the surface to which the front seal tape 12 is bonded, but it may be applied at least along a pair of parallel lines 16a and 16b to which the front seal tape 12 is welded. It is enough if it is done.

The front and back sealing tapes 12 and 13 are each made of a thermoplastic material, and preferably have a width smaller than that of the base tape 11 so as not to cover the perforations 11b, 11b, 11b. The seal tapes 12 and 13 are then bonded to the base tape 11.

In the method of manufacturing a series of chip-shaped electronic components according to the present invention, first, a back seal tape 13 is applied to the back surface of a base tape 11, and heat is applied to the back seal tape 13. Then, the back seal tape 13 is melted and softened and welded to the base tape 11. Of course, the molten material of the back seal tape 13 penetrates into the spaces between the fibers of the base tape 11, and the back seal tape 13 is bonded to the back surface of the base tape 11. Next, the chip-shaped electronic component 14 is placed into the opening 11a, that is, the cavity, from the surface of the base tape 11. Next, as shown in FIG. 6, the front seal tape 12 is applied to the surface of the base tape 11, and heat is applied using a iron 17. The iron 17 has two parallel protrusions 17a, 17b.
b is the above-mentioned line 16a through the front seal tape 12,
16b. Then, when the base tape 11 is moved in the longitudinal direction, heat is intensively applied to the front sealing tape 12 in the area along the lines 16a and 16b by the iron 17, and the pasting of the front sealing tape 12 is performed along the lines 16a and 16b. This is done at positions along lines 16a and 16b.

The surface of the base tape 11, especially the lines 16a, 16
In the region along b, the fibers have become dense due to the calender finish, so the melted and softened seal tape 12 is prevented from penetrating deeply between the fiber materials, making the bonding strength weaker than that of conventional tapes. ing. Furthermore, since the fiber density is uniform, the bonding strength is stable.

FIG. 7 shows a state in which the front seal tape 12 of the chip-shaped electronic component series according to the present invention is peeled off. In the figure, 18 is the perforation 11
b, 11b, sprocket that engages with 11b, 1
Reference numeral 9 represents a suction arm that adsorbs and takes out the chip-shaped electronic component 14, and 20 represents a holding plate that prevents the storage container from floating when the front seal tape 12 is peeled off. As the sprocket 18 rotates in the direction of the arrow A1, the series of chip-shaped electronic components is fed at a constant speed, while the front seal tape 12 is pulled and peeled off in the direction of the arrow A2 by a device (not shown).

Regarding the chip-shaped electronic parts related to the present invention,
Since the bonding strength of the front seal tape 12 is stable, the front seal tape 12 can be peeled off with stable tensile strength (approximately 10 to 50 g), and therefore, the series of electronic components can be stably fed. I can do it.

Furthermore, when the front seal tape 12 is peeled off,
While the fuzz of the base tape 11 is suppressed to a certain amount or less, the surface layer of the base tape 11 does not peel off, so the chip-shaped electronic component can be taken out by the suction arm 19 without being disturbed. In addition, since the fiber density of the compressed lines 16a and 16b of the base tape 11 is uniform, the bonding strength with the sealing tape 12 is constant, so that the force for peeling off the sealing tape 12, that is, The tape can be moved smoothly while keeping the tensile strength of the tape constant, making it more suitable for automatic mounting. Although the above-mentioned embodiments have been described with respect to a punched type, it goes without saying that the present invention is also applicable to an embossed type.

As described in detail above, the chip-shaped electronic component series according to the present invention, after compressing the base tape 11,
Since the front seal tape 12 is attached, it is possible to suppress the fuzz that occurs when the front seal tape 12 is peeled off to a certain amount or less without increasing costs, and it is also possible to suppress peeling of the layers. Since the sealing tape can be stably peeled off with a constant peeling force, the efficiency of the work of removing chip-shaped electronic components can be improved.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of a conventional chip-shaped electronic component series, FIG. 2 is a cross-sectional view of a conventional punch-type chip-shaped electronic component series, and FIG. 3 is a conventional chip-shaped electronic component series. FIG. 4 is a cross-sectional view of an embossed type chip-shaped electronic component series, and FIG. 4 is a perspective view showing a conventional chip-shaped electronic component series with the front seal tape removed. FIG. An exploded perspective view of a series of chip-shaped electronic components according to an embodiment of
FIG. 6 is a perspective view showing the process of bonding the front seal tape of the chip-shaped electronic component series shown in FIG. 5, and FIG. 7 is the process of peeling off the front seal tape of the chip-shaped electronic component series shown in FIG. 5. FIG. 1, 11... Base tape, 2, 12... Front seal tape, 3, 13... Back seal tape, 4,
14... Chip-shaped electronic component.

Claims (1)

[Claims for Utility Model Registration] 1. Hole-shaped component insertion portions are provided at equal intervals along the longitudinal direction in the widthwise center of a band-shaped base tape containing a fiber material, and chip-shaped components are inserted into the insertion portions. After that, the opening of the insertion part of the base tape is covered with a band-shaped sealing tape made of thermoplastic, and the parts near both widthwise ends of the sealing tape are thermally bonded to the surface of the base tape to form a series of chip-shaped electronic components. Then, the surface layer of the base tape to which the sealing tape is to be thermally bonded is compressed using a roller or the like to make the fiber density dense and uniform so that the melted and softened sealing tape does not penetrate deeply between the fiber materials. It is characterized in that the fiber density is made uniform so that the fibers penetrate, so that the bonding strength between the base tape and the seal tape is constant and weak enough that the fibers of the base tape do not stand up when the seal tape is removed and peeled off. Chip-shaped electronic parts series. 2. The chip-shaped electronic component series according to claim 1, wherein the base tape is made of cardboard.