JPH0211334U - - Google Patents
Info
- Publication number
- JPH0211334U JPH0211334U JP1988089516U JP8951688U JPH0211334U JP H0211334 U JPH0211334 U JP H0211334U JP 1988089516 U JP1988089516 U JP 1988089516U JP 8951688 U JP8951688 U JP 8951688U JP H0211334 U JPH0211334 U JP H0211334U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- control device
- bonding
- amount control
- feeding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07168—Means for storing or moving the material for the connector
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089516U JPH0622986Y2 (ja) | 1988-07-07 | 1988-07-07 | ワイヤボンディング装置におけるワイヤ供給装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988089516U JPH0622986Y2 (ja) | 1988-07-07 | 1988-07-07 | ワイヤボンディング装置におけるワイヤ供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0211334U true JPH0211334U (cs) | 1990-01-24 |
| JPH0622986Y2 JPH0622986Y2 (ja) | 1994-06-15 |
Family
ID=31314065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988089516U Expired - Lifetime JPH0622986Y2 (ja) | 1988-07-07 | 1988-07-07 | ワイヤボンディング装置におけるワイヤ供給装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0622986Y2 (cs) |
-
1988
- 1988-07-07 JP JP1988089516U patent/JPH0622986Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0622986Y2 (ja) | 1994-06-15 |
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