JPH0211367U

JPH0211367U -

Info

Publication number: JPH0211367U
Application number: JP8942488U
Authority: JP
Priority date: 1988-07-05
Filing date: 1988-07-05
Publication date: 1990-01-24

Description

[Brief explanation of drawings]

第１図は本考案の一実施例を示す構成図、第２
図、第３図は従来例を示す図である。１……半導体レーザウエハ、２……粘着テープ
、３……カバーテープ、４……フラツトリング、
５……ダブルリング内輪、６……ケガキキズ、７
……劈開用ブレード、８……顕微鏡、９……溝、
１０……スリツト板、１１……ダブルリング外輪
。 Fig. 1 is a configuration diagram showing one embodiment of the present invention;
FIG. 3 is a diagram showing a conventional example. 1... Semiconductor laser wafer, 2... Adhesive tape, 3... Cover tape, 4... Flat ring,
5... Double ring inner ring, 6... Scratches, 7
...Cleaving blade, 8...Microscope, 9...Groove,
10...Slit plate, 11...Double ring outer ring.

Claims

[Scope of utility model registration request]

In a semiconductor laser cleaving device that cleaves and divides a semiconductor laser wafer into elongated shapes along the cleavage plane, there is a jig that fixes the semiconductor laser wafer through an adhesive sheet to which the semiconductor laser wafer is pasted and tensioned, and the jig is connected in two orthogonal directions. and a stage that can be operated and positioned in the rotational direction; a cleavage blade that is set directly below the scribe scratch made on the edge of the semiconductor laser wafer in the previous process and that moves up and down by a motor; A monitoring means for monitoring the semiconductor wafer so that the scratches match, and a transparent slit plate located above the wafer and having a groove of an appropriate width to match the width of the cleavage bar in the part where the blade pushes up the wafer. A semiconductor laser wafer cleaving device characterized by having a mechanism for fixing and removing the tape using a separate jig without losing the tension applied to the tape after cleaving.