JPH02114932U - - Google Patents
Info
- Publication number
- JPH02114932U JPH02114932U JP1989022308U JP2230889U JPH02114932U JP H02114932 U JPH02114932 U JP H02114932U JP 1989022308 U JP1989022308 U JP 1989022308U JP 2230889 U JP2230889 U JP 2230889U JP H02114932 U JPH02114932 U JP H02114932U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- wiring board
- electrodes
- electrode
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/221—Structures or relative sizes
Landscapes
- Wire Bonding (AREA)
- Credit Cards Or The Like (AREA)
Description
第１図は本考案による配線基板を用いた情報カ
ードの一実施例を示す略線的側面図、第２図はチ
ツプ部品の電極及びバンプの接合状態を示す略線
図、第３図は従来の情報カード読取システムの構
成を示す略線図、第４図はその情報カードの電気
的構成を示す略線的ブロツク図、第５図は従来の
配線基板を示す略線的側面図、第６図は問題点の
説明に供する略線的側面図である。
４，３０……情報カード、４Ａ……基板、４Ｅ
……配線パターン、１５……チツプ部品、１６…
…電極、１７，１８……バンプ、２１，３１……
配線基板。
Fig. 1 is a schematic side view showing an embodiment of an information card using a wiring board according to the present invention, Fig. 2 is a schematic diagram showing the bonding state of electrodes and bumps of chip components, and Fig. 3 is a conventional diagram. FIG. 4 is a schematic block diagram showing the electrical configuration of the information card; FIG. 5 is a schematic side view showing a conventional wiring board; FIG. The figure is a schematic side view for explaining the problem. 4, 30... Information card, 4A... Board, 4E
...Wiring pattern, 15...Chip parts, 16...
...Electrode, 17,18...Bump, 21,31...
wiring board.
Claims (1)
ぞれ対応する接合部材によつて当該電極に対向す
る配線パターンに接合するようになされた配線基
板において、 上記チツプ部品の表面の上記電極の形成位置を
、上記チツプ部品の側端面から上記接合部材の平
面形状の大きさと同等又はそれ以上の長さ分だけ
内側に形成した ことを特徴とする配線基板。[Claims for Utility Model Registration] In a wiring board in which a plurality of electrodes formed on the surface of a chip component are bonded to wiring patterns facing the electrodes by respective bonding members, the surface of the chip component The wiring board is characterized in that the electrode is formed inward from the side end surface of the chip component by a length equal to or greater than the planar size of the bonding member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989022308U JPH02114932U (en) | 1989-02-28 | 1989-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989022308U JPH02114932U (en) | 1989-02-28 | 1989-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114932U true JPH02114932U (en) | 1990-09-14 |
Family
ID=31240303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989022308U Pending JPH02114932U (en) | 1989-02-28 | 1989-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114932U (en) |
-
1989
- 1989-02-28 JP JP1989022308U patent/JPH02114932U/ja active Pending
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