JPH02114941U - - Google Patents
Info
- Publication number
- JPH02114941U JPH02114941U JP2225189U JP2225189U JPH02114941U JP H02114941 U JPH02114941 U JP H02114941U JP 2225189 U JP2225189 U JP 2225189U JP 2225189 U JP2225189 U JP 2225189U JP H02114941 U JPH02114941 U JP H02114941U
- Authority
- JP
- Japan
- Prior art keywords
- mounting surface
- semiconductor chip
- insulating package
- electrode
- chip carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例の正面図、第２図は
第１図の裏面図である。
１……セラミツクパツケージ、２……セラミツ
クベース、３……セラミツクキヤツプ、４……側
面電極、８……裏面電極、６……バンプ。
FIG. 1 is a front view of an embodiment of the present invention, and FIG. 2 is a back view of FIG. 1. 1... Ceramic package, 2... Ceramic base, 3... Ceramic cap, 4... Side electrode, 8... Back electrode, 6... Bump.
Claims (1)
くとも実装面に、該半導体チツプに電気接続され
た電極を形成してなるリードレスチツプキヤリア
において、前記絶縁パツケージの実装面における
前記電極の表面に柔軟な導電体からなるバンプを
一体に形成したことを特徴とするリードレスチツ
プキヤリア。 In a leadless chip carrier comprising an electrode electrically connected to the semiconductor chip formed on at least the mounting surface of an insulating package in which a semiconductor chip is sealed, a flexible conductor is provided on the surface of the electrode on the mounting surface of the insulating package. A leadless chip carrier characterized by integrally formed bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2225189U JPH02114941U (en) | 1989-02-28 | 1989-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2225189U JPH02114941U (en) | 1989-02-28 | 1989-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02114941U true JPH02114941U (en) | 1990-09-14 |
Family
ID=31240199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2225189U Pending JPH02114941U (en) | 1989-02-28 | 1989-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02114941U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004022840A (en) * | 2002-06-17 | 2004-01-22 | Kyocera Corp | Wiring board |
-
1989
- 1989-02-28 JP JP2225189U patent/JPH02114941U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004022840A (en) * | 2002-06-17 | 2004-01-22 | Kyocera Corp | Wiring board |