JPH02117959A - Sealing resin composition - Google Patents

Abstract

PURPOSE:To obtain a resin composition high in glass transition temperature, low in stress, improved in soldering heat resistance, thus suitable for semiconductor sealing use by incorporating a bismaleimide resin with a specific addition polymer and inorganic filler. CONSTITUTION:The objective composition can be obtained by incorporating (A) 100 pts.wt. of a bismaleimide resin of formula I (X is -CH2-, -O-, etc.; Y is -CH2-, -O-, -SO2-, etc.; R is H, CH3, etc.), prepared by reaction between bismaleimide and/or its derivative and aromatic diamine, with (B) 10-50 pts.wt. of an addition polymer prepared by reaction in the presence of a platinum-based catalyst between (1) a hydrogenorganopolysiloxane of formula II (R1 and R2 are each alkyl, etc.; n is 10-200) and (2) a polyfunctional aromatic polyallyl compound of formula III (R3 is H, halogen, etc.; m is 0-10) and (C) 50-400 pts.wt. of an inorganic filler (e.g., silica powder).

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a resin composition for semiconductor encapsulation that has a high glass transition point (hereinafter referred to as Tg) and low stress.

(Prior Art) Currently, as a method for sealing semiconductor elements, resin sealing by transfer molding using an epoxy resin molding material is generally performed.

However, as semiconductor elements become more highly integrated, devices become larger and flatter, cured encapsulation materials become thinner, and mounting on substrates becomes more surface-mounted, the performance required of encapsulation materials has significantly increased. Things are starting to change.

Particularly with the shift to surface mounting, solder heat resistance has become a focus.

To address these problems, it is desired that the cured resin has low stress and a Tg equal to or higher than the high-X solder bath temperature.

It is difficult to meet these performance requirements with conventional epoxy resins or silicone-modified epoxy resins.

On the other hand, bismaleimide resin is attracting attention as a high Tg resin to replace epoxy resin, but the cured product of this resin has a high elastic modulus and is brittle, so it may crack during heat cycle tests or have poor adhesion to devices. It also had the disadvantage of poor moisture resistance.

(Problems to be Solved by the Invention) The present invention has been made through intensive studies to improve the soldering heat resistance, which is a drawback of conventional epoxy resins or silicone-modified epoxy resins, and its purpose is to It is an object of the present invention to provide a resin composition for semiconductor encapsulation which has the following properties and low stress properties.

(Means for Solving the Problems) The present invention relates to a bismaleimide resin (A) obtained by reacting bismaleimide and/or its derivative with an aromatic diamine, and a hydrogen organoporin loxane represented by the following formula (1). and a polyfunctional aromatic polyallyl compound represented by [■] in the presence of a platinum-based catalyst to obtain an addition polymer (B) and an inorganic filler as essential components, a resin composition for semiconductor encapsulation. .

(In the formula, R is an alkyl group or a phenyl group, n is an integer of 10 to 200) (In the formula, R1 is a hydrogen atom, a halogen atom, a hydroxyl group, or an alkyl group, =so, Tsutsumi-0-m is 0- (integer of 10) The bismaleimide resin used in the present invention is a compound represented by the general formula [■].

However, n≧O, ml (i is an integer of O−n).

m*+++I'ns+x+Z1+ ff1l+l+
l, et is I or X is -CH2-, -〇-, -8o,
, -3-, -3-3-.

Or it shows that the benzene nuclei are directly bonded to each other.

Yl -CH,, -0-, -8O,,,S-,-,S
This indicates that 屹-5 or benzene nuclei are directly bonded to each other, and Y indicates that benzene nuclei are bonded to each other by a mixture of one or more of the above-mentioned bonding groups.

R represents H, CH, or C, H5.

Examples of these compounds include 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ester, 3,3'-diaminodiphenylsulfone, 2,2'-
Di(p-aminophenyl)propane, 3°4.3',4
'-Tetraamyptadiphenylmethane is a maleimide of an aromatic polyamine such as an aniline resin obtained from aniline and formaldehyde.

The polysiloxane-aromatic polyallyl compound addition polymer used in the present invention is a reaction product obtained by reaction in the presence of a platinum catalyst.

The hydrogenorganoborisiloxane used is a polysiloxane represented by the following formula (1), and its degree of polymerization is in the range of 10 to 200.

(In the formula, R,,R, is an alkyl group or a phenyl group, and n is an integer from 10 to 200.) If the degree of polymerization is less than IO, the low stress effect of the cured resin will decrease, and if it is more than 200, it will be difficult to combine with the aromatic polyallyl compound. Hydrosilylation reaction is difficult to complete.

Further, the amount of the aromatic polyallyl compound added to the polysiloxane is preferably 2 to 10 allyl groups in the aromatic polyallyl compound per hydrolyl group lWA in the polysiloxane.

If it is too small, unreacted polysiloxane will remain, causing mold fogging during molding, and if it is too large, it will not be effective in reducing stress.

Incidentally, the reaction method can be appropriately selected, and a platinum-based catalyst is preferably used as a catalyst, and an inpropatol solution of a hydrate of platinum chlorate is particularly preferably used.

After the reaction is completed, a liquid brown addition polymer is obtained at room temperature.

The polysiloxane-aromatic polyallyl compound addition polymer (B) is preferably used in an amount of 10 to 50 parts by weight per 100 parts by weight of the bismaleimide resin (A).

If it is less than 10 parts by weight, it is not effective in reducing stress;
If it is more than part by weight, Tg will decrease.

Examples of the inorganic filler used in the present invention include silica powder, alumina, antimony trioxide, aluminum hydroxide hydrate, and titanium oxide, and these can be used alone or in combination of two or more.

Among these inorganic fillers, silica powder is preferably used as a semiconductor sealing material composition.

In addition, the blending amount of the inorganic filler is bismaleimide resin (A)
It is preferable to mix 50 to 4001ii parts with respect to the total amount.

If it is less than 50 parts by weight, the performance of the cured resin is insufficient;
If it is more than 0.00 parts by weight, moldability will deteriorate and it will not be suitable for practical use.

In addition to these essential components, curing accelerators, lubricants, flame retardant agents, release agents, run-camping agents, etc. can be added as appropriate when preparing the molding material.

A general method for producing the resin composition for semiconductor encapsulation of the present invention as a molding material is to add various additives to these essential components and mix the composition uniformly in a kneader.
The mixture is mixed and purified using hot rolls, etc., and after cooling, it is pulverized to form a molding material.

If the obtained molding material is used for encapsulating semiconductors, high T
It is possible to obtain an extremely reliable sealing resin composition that has both low stress properties and low stress properties.

(Example) Reference Example 1 (Synthesis of bismaleimide resin) 18 parts by weight of 4.4-diaminodiphenylmethane (DDM) was added to 150 parts by weight.
Heating and melting with 'O' and stirring this, then N, N '-4
,4'-'; phenylmethane bismaleimide (BMI)
Gradually add 82 parts by weight to make bismaleimide resin (A).
I got it.

The melting point of the resulting resin was 100°C.

Reference Example 2 (Synthesis of addition polymer) 40 parts by weight of hydrogen dimethylpolysiloxane (Oil D) having an average degree of polymerization of 150 and having hydroxyl groups at both ends, and hydrogen borine loxane having an average degree of polymerization of 50 and having hydroxyl groups at both ends. (Oil F) 60! After adding 2 parts by weight of a 1% heavy metal chloroplatinic acid isopropanol solution to the mixture with part ffi, the mixture was heated to 80°C.

0 for this. 15 parts by weight of O'-diallylbisphenol A were added dropwise over 2 hours over a period of 1 hour, after which the thread was heated to 100°C and the reaction continued for 3 hours.

Addition polymer with a viscosity of 12,500 cps at 25°C after cooling (
B) was obtained.

Example 1 With the formulation shown in Table 1, the bismaleimide resin (A) obtained in Reference Examples 1 and 2, the addition polymer (B), and silica powder were combined with a curing accelerator, aminosilane, colorant, and mold release agent. were blended and kneaded with hot rolls to obtain a molding material. This was molded by transfer molding at 180°C for 3 minutes and further post-cured at 180°C for 8 hours.

Its characteristics are shown in Table 1.

Comparative Example 1.2 Molding was performed in the same manner as in Example 1 except that the amount of addition polymer (B) added was changed to the amount shown in Table 1, and the performance was evaluated.

The results are shown in Table 1.

Comparative Example 3 Performance evaluation was performed in the same manner as in Example 1 except that the addition polymer (B) was replaced with an orthocresol type epoxy resin. The results are shown in Table 1.

(The following is a blank space) (Effects of the invention) The cured resin using the sealing resin composition according to the present invention has a high T.
g, the sealing body has excellent solder crack resistance and reliability, and has low stress and excellent heat cycle resistance, making it an excellent and extremely reliable resin composition for semiconductor element sealing.

Claims (1)

[Claims] (1) (A) Bismaleimide resin obtained by reaction of bismaleimide and/or its derivative with aromatic diamine (B) Hydrodiene organopolysiloxane represented by the following formula [I] and [II] Addition polymer obtained by reacting a polyfunctional aromatic polyallyl compound in the presence of a platinum-based catalyst ▲ Numerical formulas, chemical formulas, tables, etc. are available▼……[I] (In the formula, R_1 and R_2 are an alkyl group or a phenyl group,
n is an integer from 10 to 200) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (In the formula, R_3 is a hydrogen atom, halogen atom, hydroxyl group, or alkyl group, R_4 is -O-, -CH_2-, ▲ Numerical formulas, chemical formulas, tables, etc.) etc.▼, -SO_2- ▲Mathematical formulas, chemical formulas, tables, etc.▼m is an integer from 0 to 10) (C) A sealing resin composition containing an inorganic filler as an essential component.