JPH02118965U - - Google Patents
Info
- Publication number
- JPH02118965U JPH02118965U JP2798689U JP2798689U JPH02118965U JP H02118965 U JPH02118965 U JP H02118965U JP 2798689 U JP2798689 U JP 2798689U JP 2798689 U JP2798689 U JP 2798689U JP H02118965 U JPH02118965 U JP H02118965U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- reinforcing plate
- mounting
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案の一実施例に従つて構成された
可撓性回路基板と回路部品との半田なし接続構造
の概念的な要部拡大断面構成図、第2図1,2及
び3は可撓性回路基板の実装部に於ける接続用ラ
ンド部に形成した開切部形状の具体例を説明する
図、第3図は本考案の他方の実施例に従つて補強
板の実装用透孔に嵌着自在なデインプル状成形部
を接続用ランド部に設けた可撓性回路基板に於け
る接続構造の概念的な要部拡大断面構成図、第4
図は補強板側にゴム質弾性部材の使用により接続
用ランド部と実装ピンとの接触力増強手段を付与
するように構成した同様な可撓性回路基板に於け
る接続構造の概念的な要部拡大断面構成図、第5
図は可撓性回路基板に半田付けで回路部品を実装
する周知の接続構造の説明図、そして、第6図は
可撓性回路基板の接続用ランド部に対しスリツト
等の挿入部を設けた公知例による半田接続構造の
説明図である。
10……可撓性回路基板、11……回路部品の
実装部、12……接続用ランド部、13……表面
被覆材、14……実装部の補強板、15……実装
用透孔、16……面取り部、17……回路部品、
18……回路部品の実装ピン、19……ゴム質弾
性部材、20……デインプル状成形部。
FIG. 1 is a conceptual enlarged sectional view of the essential parts of a solderless connection structure between a flexible circuit board and circuit components constructed according to an embodiment of the present invention, and FIG. FIG. 3 is a diagram illustrating a specific example of the shape of the opening formed in the connection land in the mounting part of the flexible circuit board, and FIG. 4th conceptual enlarged cross-sectional configuration diagram of main parts of a connection structure in a flexible circuit board in which a dimple-shaped molded part that can be freely fitted into a hole is provided in a connection land part;
The figure shows the conceptual main parts of a connection structure in a similar flexible circuit board configured to provide means for increasing the contact force between the connection land and the mounting pin by using a rubber elastic member on the reinforcing plate side. Enlarged cross-sectional configuration diagram, 5th
The figure is an explanatory diagram of a well-known connection structure in which circuit components are mounted on a flexible circuit board by soldering, and Figure 6 is an illustration of a well-known connection structure in which circuit components are mounted on a flexible circuit board by soldering, and Figure 6 shows a structure in which an insertion part such as a slit is provided in the connection land part of the flexible circuit board. FIG. 2 is an explanatory diagram of a solder connection structure according to a known example. DESCRIPTION OF SYMBOLS 10... Flexible circuit board, 11... Circuit component mounting part, 12... Connection land part, 13... Surface covering material, 14... Reinforcement plate for mounting part, 15... Mounting through hole, 16... Chamfered portion, 17... Circuit component,
18... Circuit component mounting pin, 19... Rubber elastic member, 20... Dimple-shaped molded part.
Claims (1)
装の為の補強板を備える可撓性回路基板に於いて
、可撓性回路基板の上記実装部に形成された回路
部品接続用ランド部に回路部品の実装ピンで該ラ
ンド部の一部を上記補強板に形成した実装用透孔
に圧入させる為の開切部を設け、該開切部周域の
上記ランド部を回路部品の上記実装ピンの外周に
圧接状態で補強板の上記実装用透孔に圧入可能に
構成したことを特徴とする回路部品実装の為の可
撓性回路基板の接続構造。 (2) 前記ランド部の開切部をスリツト状又は小
さ円孔状に形成した請求項(1)の可撓性回路基板
の接続構造。 (3) 前記補強板の実装用透孔に嵌着可能なデイ
ンプル状成形部を上記ランド部に形成した請求項
(1)又は(2)の可撓性回路基板の接続構造。 (4) 前記ランド部の裏面に位置する上記補強板
の実装用透孔端部周域に面取り部を形成した前記
各請求項の可撓性回路基板の接続構造。 (5) 前記補強板の実装用透孔の内壁部若しくは
該補強板自体を弾性質絶縁部材で構成した前記各
請求項の可撓性回路基板の接続構造。[Scope of Claim for Utility Model Registration] (1) In a flexible circuit board that is provided with a reinforcing plate for mounting circuit components on the back side of the mounting part of the flexible circuit board, A cutout is provided in the formed circuit component connecting land for press-fitting a part of the land with a mounting pin of the circuit component into the mounting hole formed in the reinforcing plate, and the area around the cutout is A connection structure for a flexible circuit board for mounting a circuit component, characterized in that the land portion is configured to be press-fitted into the mounting hole of the reinforcing plate while in pressure contact with the outer periphery of the mounting pin of the circuit component. . (2) The connection structure for a flexible circuit board according to claim (1), wherein the cutout portion of the land portion is formed in the shape of a slit or a small circular hole. (3) A dimple-shaped molded part that can be fitted into the mounting hole of the reinforcing plate is formed in the land part.
(1) or (2) flexible circuit board connection structure. (4) The connection structure for a flexible circuit board according to each of the above claims, wherein a chamfer is formed around the end of the mounting hole of the reinforcing plate located on the back surface of the land portion. (5) The flexible circuit board connection structure according to each of the above claims, wherein the inner wall of the mounting hole of the reinforcing plate or the reinforcing plate itself is made of an elastic insulating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2798689U JPH02118965U (en) | 1989-03-11 | 1989-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2798689U JPH02118965U (en) | 1989-03-11 | 1989-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02118965U true JPH02118965U (en) | 1990-09-25 |
Family
ID=31250963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2798689U Pending JPH02118965U (en) | 1989-03-11 | 1989-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02118965U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198618A (en) * | 2000-12-27 | 2002-07-12 | Aiwa Raito:Kk | Wiring board and game machine |
| JP2006210779A (en) * | 2005-01-31 | 2006-08-10 | Victor Co Of Japan Ltd | Board assembly |
| JP2006351795A (en) * | 2005-06-15 | 2006-12-28 | Daito Electron Co Ltd | Insulating sheet |
-
1989
- 1989-03-11 JP JP2798689U patent/JPH02118965U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002198618A (en) * | 2000-12-27 | 2002-07-12 | Aiwa Raito:Kk | Wiring board and game machine |
| JP2006210779A (en) * | 2005-01-31 | 2006-08-10 | Victor Co Of Japan Ltd | Board assembly |
| JP2006351795A (en) * | 2005-06-15 | 2006-12-28 | Daito Electron Co Ltd | Insulating sheet |