JPH0211981Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention relates to a solder tank pull-out mechanism, and in particular, it is capable of quickly, accurately and easily setting the height position of the solder tank after dust removal work. , relates to a solder tank drawer mechanism that improves usability.

[Conventional technology]

Some soldering devices have solder tanks weighing about 1 ton. Then, there is a method in which the solder solution overflowing from a solder tank is applied to a necessary location on the lower surface of the semiconductor substrate to solder the substrate.

[Problem that the invention attempts to solve]

By the way, in a conventional soldering tank, dust such as solder scum and oxide film from the soldering work floats on the top surface of the solder solution in the soldering tank, and the dust reduces the accuracy and reliability of the soldering work. There is an inconvenience that the finished surface is poor.

For this reason, a conventional method has been to pull out the solder tank outside the soldering apparatus, remove dust and oxide film floating on the top surface of the solder solution, and then return the solder tank back into the apparatus after removing the dust.

However, since the solder tank is installed close to the bottom surface of the board, it is necessary to move the solder tank slightly downward when pulling out the solder tank, and when the solder tank is returned to the device again, it is necessary to move the solder tank slightly downward. It is necessary to move it upward to readjust the distance from the substrate, that is, the height position of the solder bath.

For this reason, it is extremely difficult to adjust the height position of the solder tank to a predetermined height position, and the change in the height position of the solder tank makes it impossible to perform the soldering work accurately. This has the disadvantage that the reliability of the device is reduced.

[Purpose of invention]

Therefore, in order to eliminate the above-mentioned inconvenience, the purpose of this invention is to provide a pedestal at the bottom of the solder tank, provide a horizontal moving part to move the pedestal and the solder tank in the horizontal direction, and provide a rotating part on the bottom surface of the pedestal. An eccentric moving part is provided, which includes an eccentric cam rotatably provided to move the pedestal and the solder tank slightly in the vertical direction, and an outer ring loosely fitted with a bearing interposed on the outer circumference of the eccentric cam. As a result, it is possible to easily set the height position of the solder tank, to maintain good accuracy in setting the height position, and to realize a solder tank draw-out mechanism that can improve usability.

[Means for solving problems]

In order to achieve this purpose, this invention provides a stand at the bottom of the solder tank in which the solder solution overflows from the top of the solder tank and the solder on the top surface of the solder tank is attached to the necessary places on the bottom surface of the board. , a horizontal moving part for horizontally moving the pedestal and the solder tank is provided, and an eccentric cam is rotatably provided on the bottom surface of the trestle to move the mount and the solder tank in the vertical direction by a rotational movement. The present invention is characterized in that an eccentric moving portion is provided, which includes an outer ring that is loosely fitted to the outer circumferential portion of the eccentric cam with a bearing interposed therebetween.

[Effect]

With the above configuration, when pulling out the solder tank, the eccentric cam of the eccentric moving part is rotated, the pedestal and the solder tank are moved slightly downward, the pedestal and the solder tank are pulled out, and the solder tank is removed. After removing the dust, remove the dust floating on the top of the solder solution. After removing the dust, push the stand and solder tank to a specified position, rotate the eccentric cam to move the stand and solder tank slightly upward, and raise the solder tank to a specified height. This makes it extremely easy to set the height position of the solder tank, and also allows accurate maintenance of a good condition when setting the height position, resulting in improved usability.

〔Example〕

Embodiments of this invention will be described in detail below based on the drawings.

1 to 7 show examples of this invention. In Figures 3 and 4, 2 is a soldering device;
4 is a solder tank, 6 is a semiconductor substrate, and 8 is a conveyor for conveying the substrate 6. A pedestal 10 is provided at the bottom of the solder bath 4, and this pedestal 10 has a horizontal moving part 12.
A pull-out mechanism 16 is provided, which includes an eccentric moving section 14.

The horizontal moving section 12 includes a first rack 18 formed on the side surface of the pedestal 10, and a first rack 18 formed on the side surface of the pedestal 10.
8, and a first motor 22 that drives the first gear 20.
0 horizontally. At this time, even if the pedestal 10 is slightly moved in the vertical direction by the eccentric moving section 14, the first rack 1
There is no possibility that the meshing between the gear 8 and the first gear 20 will be disengaged.

Furthermore, the eccentric moving section 14 includes, for example, six eccentric cams 24 provided on the lower surface of the pedestal 10, and an outer ring 26 that is loosely fitted to the outer circumference of the eccentric cams 24 with a bearing (not shown) interposed therebetween. , and a drive section 28 that rotates the eccentric cam 24, and is configured to move the pedestal 10 and the solder bath 4 in a small vertical direction by the rotation of the eccentric cam 24. That is, the eccentric cam 24 is provided eccentrically by a distance S, and the pivoting action of the eccentric cam 24 moves the mount 10 and the solder tank 4 by 2S in the vertical direction.

Further, as shown in FIGS. 5 to 7, the drive section 28 of the eccentric moving section 14 includes a total of three rotation shafts 30 connecting the rotation centers of the two eccentric cams 24, and a total of three rotation shafts 30 connecting the rotation centers of the two eccentric cams 24. 3 second connected to each end of the
a gear 32, a second rack 34 that meshes with the second gear 32, and a third gear 36 that meshes to move the second rack 34 and rotate the eccentric cam 24;
A second motor 38 drives this third gear 36.

Furthermore, the soldering tank 4 of the soldering device 2
The supply of solder solution to the solder tank 4 is automatically controlled by a control section (not shown), and the amount of solder solution in the solder tank 4 is always kept constant.

Note that the reference numeral 40 is a caster provided at the end of the drawer side of the pedestal 10 for use when the pedestal 10 is pulled out and pushed in, and 42 is a lighting fixture.

Next, the effect will be explained.

When drawing out the solder tank 4, first, as shown in FIG.
8, and transmits this driving force from the third gear 36 to the second gear 32 via the second rack 34,
The eccentric cam 24 is rotated by rotating the rotation shaft 30 approximately 180 degrees. At this time, only the eccentric cam 24 rotates within the outer ring 26, which is loosely fitted to the outer circumferential portion of the eccentric cam 24 with a bearing (not shown) interposed therebetween. As shown, the pedestal 10 and the solder bath 4 are moved downward by a small amount, for example, 2S, from a predetermined height position.

Further, the first motor 22 of the horizontal moving section 12 is driven to rotate the first gear 20, and the first gear 20 moves the pedestal 10 and the solder bath 4 through the first rack 18 to the seventh In the direction of arrow A in the figure,
That is, it is pulled out of the soldering device 2.

When the frame 10 and the solder tank 4 are pulled out, dust floating on the upper surface of the solder solution in the solder tank 4 is removed.

After removing the dust floating on the upper surface of the solder solution in the solder bath 4, the first motor 22 of the horizontal moving section 12 is driven in the opposite direction to reversely rotate the first gear 20, and the first gear 20 1st rack 18
The pedestal 10 and the solder bath 4 are pushed in the direction of arrow B in FIG.

The second motor 38 of the eccentric moving section 14
is driven in the opposite direction, and this driving force is transferred to the third gear 36.
This is transmitted to the second gear 32 via the second rack 34, and the rotation shaft 30 is rotated approximately 180 degrees in the opposite direction, thereby rotating the eccentric cam 24. At this time, only the eccentric cam 24 rotates within the outer ring 26 that is loosely fitted to the outer circumferential portion of the eccentric cam 24.
As shown by the solid line in FIG. 2, the pedestal 10 and the solder tank 4 are moved slightly upward, thereby accurately reproducing the solder tank at a predetermined height position.

Thereby, there is no need to readjust the height position of the solder tank to a predetermined height position after dust removal, and the solder tank can be positioned at a predetermined height position by rotating the eccentric cam. It is extremely easy to set the height position of the solder bath, which is advantageous in practice, and the preset height position can be satisfactorily maintained, improving usability.

Furthermore, since the configuration of the pull-out mechanism can be simplified, manufacturing becomes easy, maintenance and inspection are easy, and costs can be reduced, which is economically advantageous.

Furthermore, since the height position of the soldering bath is set to a predetermined height position, the soldering work can be performed accurately and the reliability of the soldering apparatus can be improved.

[Effect of idea]

As explained in detail above, according to this invention, a pedestal is provided at the bottom of the solder tank, a horizontal moving part is provided for moving the pedestal and the solder tank in the horizontal direction, and the bottom surface of the pedestal is provided with a horizontal moving part that moves the pedestal and the solder tank in the horizontal direction. An eccentric moving part is provided, which includes an eccentric cam that is rotatably provided to move the solder bath in a vertical direction by a small amount, and an outer ring that is loosely fitted to the outer circumference of the eccentric cam with a bearing interposed therebetween. There is no need to readjust the height position of the solder tank to a predetermined height position after removing dust, and the solder tank can be positioned at a predetermined height position using the eccentric moving part, making it possible to set the height position of the solder tank. It is extremely easy to do this, which is advantageous in practice, and also allows a preset height position to be maintained well, thereby improving usability. In addition, by simplifying the structure of the drawer mechanism,
It is economically advantageous because manufacturing is easy, maintenance and inspection are easy, and costs are low.

[Brief explanation of drawings]

1 to 7 show an embodiment of this invention, FIG. 1 is a schematic explanatory diagram of a solder tank pull-out mechanism, FIG. 2 is a schematic explanatory diagram of an eccentric moving part consisting of an eccentric cam and an outer ring, and FIG. The figure is a schematic left side view of the soldering device, FIG. 4 is a schematic front view of the soldering device, FIG. 5 is a schematic perspective view of the operating state of the pull-out mechanism, and FIG. 6 is the state of movement by the eccentric moving part of the pull-out mechanism. FIG. 7 is a schematic perspective view of the drawing mechanism in a state of movement by the horizontal moving section. In the figure, 2 is a soldering device, 4 is a soldering bath, 6 is a semiconductor substrate, 8 is a conveyor, 10 is a pedestal, 12 is a horizontal moving part, 14 is an eccentric moving part, 16
18 is a first rack, 20 is a first gear, 22 is a first motor, 24 is an eccentric cam, 26 is an outer ring, 28 is a drive section, 30 is a rotation shaft, 32 is a second
gear, 34 is the second rack, 36 is the third gear, 38
is a second motor, 40 is a caster, and 42 is a lighting fixture.

Claims (1)

[Scope of utility model registration request] In a solder bath that allows the solder solution to overflow from the top of the solder bath and attaches the solder on the top surface of the solder bath to the necessary locations on the bottom surface of the board, a stand is provided at the bottom of the solder bath, and the stand and the solder bath are moved in the horizontal direction. In addition, an eccentric cam is rotatably provided on the lower surface of the pedestal so that the pedestal and the solder bath can be moved slightly up and down by rotational movement, and a bearing is provided on the outer periphery of the eccentric cam. 1. A pull-out mechanism for a solder tank, characterized in that it is provided with an eccentric moving part consisting of an outer ring which is loosely fitted into the solder tank.