JPH02120331A - Production of phenol resin laminate - Google Patents

Production of phenol resin laminate

Info

Publication number
JPH02120331A
JPH02120331A JP27227688A JP27227688A JPH02120331A JP H02120331 A JPH02120331 A JP H02120331A JP 27227688 A JP27227688 A JP 27227688A JP 27227688 A JP27227688 A JP 27227688A JP H02120331 A JPH02120331 A JP H02120331A
Authority
JP
Japan
Prior art keywords
varnish
phenol resin
oil
emulsion
impregnated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27227688A
Other languages
Japanese (ja)
Other versions
JPH0564976B2 (en
Inventor
Akinori Sekimoto
関本 明紀
Kazunori Mitsuhashi
光橋 一紀
Shigeru Ito
繁 伊藤
Tsuneo Kawamura
川村 常雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP27227688A priority Critical patent/JPH02120331A/en
Publication of JPH02120331A publication Critical patent/JPH02120331A/en
Publication of JPH0564976B2 publication Critical patent/JPH0564976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To improve electrical characteristics, humidity resistance and punchability by drying a paper base material impregnated with a specified emulsion varnish, impregnating with an oil-modified phenol resin varnish, drying and molding under heat and pressure. CONSTITUTION:An emulsion varnish is obtd. by dispersing an oil-modified phenol resin, a methylol-phenol resin, a curing accelerator (e.g., benzylmethylamine) and a surface active agent in water and emulsifying the mixture. After a paper base material is impregnated with this emulsion varnish and dried, it is impregnated with an oil-modified phenol resin varnish and dried to obtain a prepreg. Then, these prepregs of a specified number are laminated and molded under heat and pressure.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電気絶縁用の紙基材フェノール樹脂積層板の
製造法に関する。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for producing paper-based phenolic resin laminates for electrical insulation.

従来の技術 フェノール樹脂積層板は、特に民生用電子機器分野にお
いてプリント回路用絶縁基板として広く用いられており
、特に近年の電子部品の高密度実装化、高機能化が進む
につれて積層板に対する電気特性及び機械加工性の要求
が益々強くなっている。
Conventional technology Phenolic resin laminates are widely used as insulating substrates for printed circuits, especially in the field of consumer electronics.Especially in recent years, as electronic components have become more densely packaged and highly functional, the electrical properties of laminates have improved. and requirements for machinability are becoming increasingly strong.

上記市場ニーズに対応するために、従来は、メチロール
フェノール樹脂を有機溶剤(メタノール、アセトン、ド
ルオール等)に10〜30重量%程度の濃度で希釈した
下塗り用のワニスを用意し、これを紙基材に含浸乾燥し
、次いで上塗り用ワニス(油変性フェノール樹脂ワニス
または可ヅ剤を添加したメチロールフェノール樹脂ワニ
ス)を含浸乾燥させる2段含浸乾燥方法が実施されてい
るが、基材処理能力(樹脂の基材への浸透性)が低く、
打抜き加工性を向上させるために上塗りワニスの油変性
量を増加する方法や可塑剤を多量に添加する手段等が採
られているが、積層板の層間密着力が低下して、密集小
穴打抜き性が劣る。
In order to meet the above market needs, conventionally, a varnish for undercoating was prepared by diluting methylolphenol resin in an organic solvent (methanol, acetone, doluol, etc.) at a concentration of about 10 to 30% by weight, and this was applied to paper. A two-step impregnation-drying method has been implemented in which the base material is impregnated and dried, and then a top coat varnish (oil-modified phenolic resin varnish or methylol phenolic resin varnish with a binder added) is impregnated and dried. (penetration of the resin into the base material) is low,
In order to improve the punching workability, methods such as increasing the amount of oil modification in the top coat varnish or adding a large amount of plasticizer have been adopted, but the interlayer adhesion of the laminate decreases, making it difficult to punch out dense small holes. is inferior.

発明が解決しようとする課題 前述のように、従来の技術では、特に打抜き加工性に関
して密集小穴形成時の層間密着性及び電気特性、耐湿特
性等のレベルが低いという問題がある。これらの積層板
特性を向上させるためには、樹脂の紙基材への浸透性を
高める必要がある。その方法として、ワニス中に水を多
量に使用することにより含浸時に紙基材の繊維を膨潤さ
せ、樹脂の浸透をし易くすることが提案されているが、
前記のメチロールフェノール樹脂は水に溶解せず分離し
、含浸不可能となる。この問題を解決するため、樹脂を
エマルジョン化したワニスを使用することもできるが、
乾燥工程の乾燥能力の点より生産効率がダウンする。
Problems to be Solved by the Invention As mentioned above, in the conventional technology, there is a problem in that the level of interlayer adhesion, electrical properties, moisture resistance properties, etc. when forming dense small holes is low, especially with regard to punching workability. In order to improve the properties of these laminates, it is necessary to increase the permeability of the resin into the paper base material. As a method, it has been proposed to use a large amount of water in the varnish to swell the fibers of the paper base material during impregnation, making it easier for the resin to penetrate.
The aforementioned methylolphenol resin does not dissolve in water and separates, making impregnation impossible. To solve this problem, it is possible to use a varnish made of a resin emulsion.
Production efficiency decreases due to the drying capacity of the drying process.

本発明は、これらの観点より、電気特性、耐湿特性、打
抜き加工性に優れた紙基材フェノール樹脂積層板を効率
よく製造することを目的とする。
From these viewpoints, the present invention aims to efficiently produce a paper-based phenolic resin laminate having excellent electrical properties, moisture resistance properties, and punching workability.

課題を解決するための手段 上記の目的を達成するために、本発明は、次の(イ)〜
(ハ)の工程を経て得たプリプレグを加熱加圧成形する
点に特徴を有する。
Means for Solving the Problems In order to achieve the above objects, the present invention provides the following (a) to
The method is characterized in that the prepreg obtained through the step (c) is molded under heat and pressure.

(イ)油変性フェノール樹脂、メチロールフェノール樹
脂、硬化促進剤を、界面活性剤により水を分散媒として
エマルジョン化したワニスを用意する。
(a) A varnish is prepared in which an oil-modified phenol resin, a methylol phenol resin, and a hardening accelerator are emulsified with a surfactant and water as a dispersion medium.

(0)前記エマルジョンワニスを紙基材に含浸し乾燥す
る(下塗り工程)。
(0) The emulsion varnish is impregnated into a paper base material and dried (undercoating step).

(ハ)さらに、油変性フェノール樹脂ワニスを含浸し乾
燥する(上塗り工程)。
(c) Furthermore, it is impregnated with an oil-modified phenol resin varnish and dried (top coating step).

作用 本発明では、水を分散媒とするエマルジョンワニスを用
いるので、紙基材の繊維を膨潤させ、そこへエマルジョ
ン化した樹脂を浸透させていくことができる。そして、
下塗り工程の油変性フェノール樹脂の存在は、上塗り工
程の油変性フェノール樹脂との親和性を高め、特性の優
れた積層板の製造に寄与する。
Function: In the present invention, since an emulsion varnish using water as a dispersion medium is used, the fibers of the paper base material can be swollen and the emulsified resin can be infiltrated therein. and,
The presence of the oil-modified phenolic resin in the undercoating process increases the affinity with the oil-modified phenolic resin in the topcoating process, contributing to the production of a laminate with excellent properties.

また、下塗り工程での乾燥において、硬化促進剤の存在
は、樹脂のBステージへの硬化反応を促進し、効率アッ
プにつながる。さらに、このBステージへの硬化反応で
は、含まれている1核体フェノールや1核体メチロール
フェノールの多核体化をも促進するので、乾燥工程での
揮散分が減少することによる原材料歩留りの向上も図る
ことができる。
Further, in drying in the undercoating process, the presence of a curing accelerator promotes the curing reaction of the resin to the B stage, leading to increased efficiency. Furthermore, this B-stage curing reaction also promotes the conversion of mononuclear phenol and mononuclear methylolphenol into polynuclear compounds, which improves raw material yield by reducing volatile matter during the drying process. You can also aim for

実施例 本発明の一実施例を説明する。Example An embodiment of the present invention will be described.

実施例1 桐油変性フェノール樹脂ワニス(固型分80g)とメチ
ロールフェノール樹脂ワニス(固型分20g)を混合し
、これに対し界面活性剤1 (H,L、B、 =6)3
gと界面活性剤2 (11,L、B、=16) 3 g
及び硬化促進剤としてベンジルメチルアミン1g、水8
00gを加え、撹拌機で機械的に撹拌することにより均
一に乳化分散したフェノール樹脂エマルジョンワのクラ
フト祇)に含浸して乾燥しく樹脂量10重量%)次に桐
油変性フェノール樹脂ワニス(濃度60重量%)を含浸
して乾燥し、総樹脂量48重量%のプリプレグを製造し
た。このプリプレグを8桟積層し、その片側に接着剤付
き銅箔を重ね、圧力100kg / c4、温度160
°Cで90分間加熱加圧して厚さ1.6鴫の銅張積層板
を製造した。
Example 1 Tung oil modified phenolic resin varnish (solid content 80 g) and methylol phenolic resin varnish (solid content 20 g) were mixed, and surfactant 1 (H, L, B, = 6) 3
g and surfactant 2 (11, L, B, = 16) 3 g
and 1 g of benzylmethylamine and 8 ounces of water as a curing accelerator.
00g was added and mechanically stirred with a stirrer to uniformly emulsify and disperse the phenolic resin emulsion (KRAFT), which was then impregnated and dried. %) and dried to produce a prepreg with a total resin content of 48% by weight. 8 of these prepregs were stacked, a copper foil with adhesive was layered on one side, and the pressure was 100kg/c4 and the temperature was 160℃.
A copper clad laminate having a thickness of 1.6 mm was manufactured by heating and pressing at °C for 90 minutes.

比較例1 桐油変性フェノール樹脂ワニス(固型分80g)とメチ
ロールフェノール樹脂ワニス(固型分20g)を混合し
、こに対し界面活性剤1(11,L、B、 =6)3g
と界面活性剤2 (11,L、B、=16) 3 gと
水800gを加え、撹拌機で機械的に撹拌することによ
り均一に乳化分散したフェノール樹脂エマルジョンワニ
ス(濃度10重量%)を調製した。
Comparative Example 1 Tung oil modified phenolic resin varnish (solid content 80 g) and methylol phenolic resin varnish (solid content 20 g) were mixed, and 3 g of surfactant 1 (11, L, B, = 6) was mixed.
3 g of surfactant 2 (11, L, B, = 16) and 800 g of water were added and mechanically stirred with a stirrer to prepare a uniformly emulsified and dispersed phenolic resin emulsion varnish (concentration 10% by weight). did.

このエマルジョンワニスを使用して下塗り処理を行ない
、以下実施例1と同様にして銅張積層板を製造した。
This emulsion varnish was used for undercoating, and a copper-clad laminate was manufactured in the same manner as in Example 1.

比較例2 メチロールフェノール樹脂の固型分100gに対しメタ
ノール500gを加え撹拌を行ない、メチロールフェノ
ール樹脂ワニス(濃度15重量%)を調製した。
Comparative Example 2 A methylolphenol resin varnish (concentration 15% by weight) was prepared by adding 500g of methanol to 100g of solid content of methylolphenol resin and stirring.

このワニスを使用して下塗り処理を行ない、以不実施例
1と同様にして銅張積層板を製造した。
This varnish was used for undercoating, and a copper-clad laminate was manufactured in the same manner as in Example 1.

これらの銅張積層板の特性・性能試験を行なった結果を
第1表に示す。また、含浸乾燥工程での原材料歩留り、
効率の比較を第2表に示す。
Table 1 shows the results of characteristic and performance tests on these copper-clad laminates. In addition, the raw material yield in the impregnation drying process,
A comparison of efficiency is shown in Table 2.

第  1  表 第  2 表 発明の効果 上述したように、本発明によれば、油変性フェノール樹
脂とメチロールフェノール樹脂併用系に界面活性剤と硬
化促進剤と水を加えてエマルジョン化した下塗り用ワニ
スを使用することにより紙基材の処理効果を向上させる
ことができ上塗りワ交 ニスの含浸性を大きく向上色たことを可能とする。
Table 1 Table 2 Effects of the Invention As described above, according to the present invention, an undercoat varnish is prepared by adding a surfactant, a curing accelerator, and water to an oil-modified phenol resin and methylol phenol resin combination system to form an emulsion. By using it, it is possible to improve the processing effect of the paper base material, and it is possible to greatly improve the impregnation property of the top coat varnish.

その結果、第1表に示すように、フェノール樹脂積層板
の電気特性、耐湿特性及び打抜き加工性は従来品に比較
し大巾に改善することが出来た。
As a result, as shown in Table 1, the electrical properties, moisture resistance properties, and punching workability of the phenolic resin laminate were significantly improved compared to conventional products.

更に、含浸乾燥工程での効率(乾燥速度)アンプ、原材
料歩留りを向上することが出来る。
Furthermore, the efficiency (drying speed) and raw material yield in the impregnating and drying process can be improved.

また、水分散媒のエマルジョンワニスを使用スることは
、有機溶剤の使用量を低減することになり、作業安全性
を大幅に改善するものである。
Furthermore, the use of an emulsion varnish with an aqueous dispersion medium reduces the amount of organic solvent used, which greatly improves work safety.

Claims (1)

【特許請求の範囲】 次の(イ)〜(ハ)の工程を経て得たプリプレグを加熱
加圧成形するフェノール樹脂積層板の製造法。 (イ)油変性フェノール樹脂、メチロールフェノール樹
脂、硬化促進剤を界面活性剤により水を分散媒としてエ
マルジョン化したワニスを用意し、 (ロ)前記エマクジョンワニスを紙基材に含浸し乾燥す
る工程、 (ハ)さらに、油変性フェノール樹脂ワニスを含浸し乾
燥する工程を経る。
[Scope of Claims] A method for producing a phenolic resin laminate, in which a prepreg obtained through the following steps (a) to (c) is molded under heat and pressure. (a) Prepare a varnish made by emulsifying oil-modified phenol resin, methylol phenol resin, and hardening accelerator with a surfactant and using water as a dispersion medium, and (b) Impregnate a paper base material with the emulsion varnish and dry it. Step (c) Further, a step of impregnating with an oil-modified phenol resin varnish and drying is performed.
JP27227688A 1988-10-28 1988-10-28 Production of phenol resin laminate Granted JPH02120331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27227688A JPH02120331A (en) 1988-10-28 1988-10-28 Production of phenol resin laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27227688A JPH02120331A (en) 1988-10-28 1988-10-28 Production of phenol resin laminate

Publications (2)

Publication Number Publication Date
JPH02120331A true JPH02120331A (en) 1990-05-08
JPH0564976B2 JPH0564976B2 (en) 1993-09-16

Family

ID=17511594

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27227688A Granted JPH02120331A (en) 1988-10-28 1988-10-28 Production of phenol resin laminate

Country Status (1)

Country Link
JP (1) JPH02120331A (en)

Also Published As

Publication number Publication date
JPH0564976B2 (en) 1993-09-16

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