JPH02120708A - Optical fiber device - Google Patents

Abstract

PURPOSE:To decrease the number of parts and to improve reliability by applying a creamy welding material onto the exothermic part atop a heat insulator fixed onto a substrate, then imposing an optical fiber adjusted in optical axis thereon and energizing the exothermic part so that the exothermic part is fixed by the welding material. CONSTITUTION:The heat insulator 11 having the exothermic part 12 is fixed onto the substrate 1 and after the creamy welding material 8 is applied on this exothermic part 12, the optical fiber 7 adjusted in the optical axis with respect to a photosemiconductor element 3 fixed onto the substrate is imposed on the substrate and the exothermic part 12 is energized to melt the welding material 8, by which the optical fiber 7 is fixed. The number of parts in the optical fiber part and the adhesive parts between these parts are then decreased and, therefore, the misalignment of the optical axis by a secular change, etc., are decreased. The long-term reliability is thus improved and the cost is reduced.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to an optical fiber device that transmits and receives signals via an optical fiber. [Prior Art] In recent years, the high speed and 2. Description of the Related Art Due to electrical insulation, electrical signals are converted into optical signals, or optical signals are converted into electrical signals for communication and measurement.

In particular, when signal transmission with high stability, density, or non-interference is required, optical fibers are used as the transmission path.

For this purpose, there have conventionally been optical fiber devices that combine an optical fiber with a light emitter or a light receiver to transmit and receive signals.

Figures 2 (a) and (b) were proposed earlier (Patent Application 1986-1).
20635) are a plan view and a side view showing an optical fiber device. In these figures, 1 is the substrate ζ 2 is the substrate 1
A submount fixed to one end of the upper surface; 3 an optical/semiconductor element attached to the upper surface of the submount 2; 4 a material fixed to the upper surface of the substrate 1, with low thermal conductivity and low linear expansion coefficient; 6 is a heat generating part that is placed above the heat insulating body 4 and generates heat when energized. 6 is a holding member provided with the heat generating part 5. 7 is an optical fiber fixed to the upper surface of the holding member 6. The tip 7a thereof is processed into a spherical shape. Reference numeral 8 is applied to the upper surface of the heat insulating body 4 and fixes the holding material 6 on the heat insulating body 4 using a fusing material (for example, creamy solder such as paste) that melts due to the heat generated by the heat generating part 5.

When installing, place the submount 2 at a predetermined position on the board 1.
The optical semiconductor element 3 is mounted and fixed via the. Next, a heat insulator 4 is adhesively fixed at a predetermined distance from the sub-mount l-2, and a welding material 8 is previously applied to its upper surface. Next, the holding material 6 to which the optical fiber 7 is fixed is placed on the heat insulator 4 after aligning the optical axis of the tip 7a of the optical fiber 7 with the optical axis of the optical semiconductor element 3, and the heat generating part is 5 is energized (step 7 melts the fusing material 8 and fixes the holding material 6 to the heat insulator 4.

Note that only a small amount of the heat of the fusing material 8 melted by the heat generating part 5 is transferred to the substrate 1 due to the heat insulation effect of the heat insulator 4.

As shown in Part B, the optical fiber 7 is fixed so as to coincide with the optical axis of the optical semiconductor element 3, and the light No. 48 emitted from the optical semiconductor element 3 is transmitted to the tip 7a of the optical fiber 7 for communication. and measurements will be taken.

[Problem to be solved by the invention]

In the optical fiber device as described above, the optical fiber 7 is fixed to the holding material 6, and this holding material 6 is fixed to the heat insulating body 4 with the fusion material 8. Therefore, the number of parts and the bonded parts between the parts are small. As a result, there is a problem in that the optical axis shifts due to changes over time, resulting in a decrease in long-term reliability.

This invention was made to solve the above problems, and is an optical fiber device that improves reliability by reducing the number of parts and the adhesive parts between parts, thereby reducing the influence of changes over time. The purpose is to obtain.

[Means to solve the problem]

The optical fiber device according to the present invention includes a substrate, an optical semiconductor element fixed on the substrate, a heat insulating body fixed on the substrate and having a heat generating part on the upper surface, and an optical axis of the tip of the optical fiber device. It consists of an optical fiber arranged so as to coincide with the axis and fixed by a fusion material melted by heat generated by the heat generating part of the heat insulator.

[Effect]

In this invention, when the heat generating part generates heat, the fusion material melts and the optical fiber is fixed to the heat insulator. In the plan view and side view shown, the same reference numerals as in Fig. 2 indicate the same parts, and 1
1 is a heat insulating body fixed on the substrate 1; 12 is a heat generating part formed integrally with the heat insulating body 11; and is provided on the upper surface of the heat insulating body 11.

The optical fiber device configured as described above has a heat generating section 1
2 is fixed on the substrate 1, and a cream-like fusion material 8 is applied on the heat generating part 12, and then the optical axis is adjusted with respect to the optical semiconductor element 3. fiber 7
is placed, and electricity is applied to the heat generating part 12 to melt and fix the fusing material 8.

Note that when a semiconductor laser is used as the optical semiconductor element 3 to align the optical axes between the optical semiconductor element 3 and the optical fiber 7, the optical axis alignment is performed by emitting light from the semiconductor laser. Optical axis alignment can be performed by emitting light from the side and using a semiconductor laser as a light receiver.

Furthermore, if the optical semiconductor element 3 is placed in a light receiver, it can be used as a module for the light receiver, and it can also be applied to aligning the optical axis of an LED or a leading waveguide with an optical fiber.

〔Effect of the invention〕

As explained above, the present invention includes a substrate, an optical semiconductor element fixed on the substrate, a heat insulator fixed on the substrate and having a heat generating part on the upper surface, and an optical axis of the tip of which the optical semiconductor element is fixed. Since the optical fiber is arranged in line with the axis and is fixed by a fusion material that is melted by the heat generated by the heat generating part of the insulator, there are fewer parts in the optical fiber part and fewer adhesive parts between the parts. Therefore, there are advantages such as less deviation of the optical axis due to changes over time, improved long-term reliability, and reduction in costs.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are a plan view and a side view showing an embodiment of the present invention, and FIGS. 2(a) and 2(b) are diagrams of a conventional optical fiber, in which 1 is a conductor element, is a heat insulator, FIG. 3 is a plan view and a side view showing the IP address device. 3 is a substrate, 2 is a submount, 3 is an optical fiber, 8 is a fusion material, and 11 and 12 are heat generating parts. 17 Ta C' Retsuna

Claims (1)

[Claims] a substrate, an optical semiconductor element fixed on the substrate, a heat insulator fixed on the substrate and having a heat generating part on the upper surface, arranged so that the optical axis of the tip part coincides with the optical axis of the optical semiconductor element. and an optical fiber fixed by a fusion material melted by heat generated by the heat generating part of the heat insulating body.