JPH02120823U - - Google Patents
Info
- Publication number
- JPH02120823U JPH02120823U JP2610690U JP2610690U JPH02120823U JP H02120823 U JPH02120823 U JP H02120823U JP 2610690 U JP2610690 U JP 2610690U JP 2610690 U JP2610690 U JP 2610690U JP H02120823 U JPH02120823 U JP H02120823U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- lead wires
- resin layer
- exterior resin
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図Ａ，Ｂは本考案に係る実施例を示す底面
図と正面図、第２図Ａ，Ｂはそれぞれ従来例を示
す側断面図と正面図である。
図中、１，１Ｃ……チツプ形電解コンデンサ、
２……アルミニウムケース、３……コンデンサ素
子、４……ゴム封口体、５……アルミニウム電解
コンデンサ、６……外装樹脂層、７，８……リー
ド線、７ａ，８ａ……偏平部、Ｐ１……第１折曲
加工、Ｐ２……第２折曲加工。
1A and 1B are a bottom view and a front view showing an embodiment of the present invention, and FIGS. 2A and 2B are a side sectional view and a front view, respectively, showing a conventional example. In the figure, 1,1C...chip type electrolytic capacitor,
2... Aluminum case, 3... Capacitor element, 4... Rubber sealing body, 5... Aluminum electrolytic capacitor, 6... Exterior resin layer, 7, 8... Lead wire, 7a, 8a... Flat part, P 1 ...First bending process, P2 ...Second bending process.
Claims (1)
素子を組込み、ゴム封口体にて封口したアルミニ
ウム電解コンデンサ全体を外装樹脂層にて被覆し
、ゴム封口体および外装樹脂層を介して導出され
たコンデンサ素子からのリード線を折曲加工によ
り外部端子としたチツプ形電解コンデンサにおい
て、２本のリード線は外装樹脂層から導出された
箇所で同電解コンデンサの周側（底面）に向けて
「八」の字形に第１折曲加工され、その周側端（
底面の一側）で両リード線が同電解コンデンサの
両側から突出することなく、かつ周側（底面）に
沿うように周側の他端（底面の他側）に向けて「
八」の字形に第２折曲加工されていると共に、両
リード線の先端は上記周側端と相対する他端（底
面の他側）付近に位置し、両リード線の先端に偏
平部が形成されていることを特徴とするチツプ形
電解コンデンサ。 At least a capacitor element is assembled in an aluminum case, the entire aluminum electrolytic capacitor is sealed with a rubber sealing body, and the entire aluminum electrolytic capacitor is covered with an exterior resin layer, and the lead wire from the capacitor element led out through the rubber sealing body and the exterior resin layer is In chip-type electrolytic capacitors that have external terminals formed by bending, the two lead wires are folded into the first fold in a figure-eight shape toward the circumference (bottom) of the electrolytic capacitor at the point where they are led out from the exterior resin layer. The peripheral edge (
One side of the bottom surface) so that both lead wires do not protrude from both sides of the electrolytic capacitor and run along the periphery (bottom surface) toward the other end of the periphery (other side of the bottom surface).
The second bending process is carried out in an ``8'' shape, and the tips of both lead wires are located near the other end (the other side of the bottom surface) opposite to the circumferential end, and the tips of both lead wires have a flat part. A chip-type electrolytic capacitor characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2610690U JPH0632670Y2 (en) | 1990-03-16 | 1990-03-16 | Chip type electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2610690U JPH0632670Y2 (en) | 1990-03-16 | 1990-03-16 | Chip type electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02120823U true JPH02120823U (en) | 1990-09-28 |
| JPH0632670Y2 JPH0632670Y2 (en) | 1994-08-24 |
Family
ID=31247432
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2610690U Expired - Lifetime JPH0632670Y2 (en) | 1990-03-16 | 1990-03-16 | Chip type electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0632670Y2 (en) |
-
1990
- 1990-03-16 JP JP2610690U patent/JPH0632670Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0632670Y2 (en) | 1994-08-24 |
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