JPH0195721U - - Google Patents
Info
- Publication number
- JPH0195721U JPH0195721U JP19183687U JP19183687U JPH0195721U JP H0195721 U JPH0195721 U JP H0195721U JP 19183687 U JP19183687 U JP 19183687U JP 19183687 U JP19183687 U JP 19183687U JP H0195721 U JPH0195721 U JP H0195721U
- Authority
- JP
- Japan
- Prior art keywords
- component body
- external lead
- lead
- resin material
- lead member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Details Of Resistors (AREA)
Description
第１図は、本考案に係るチツプ型電子部品の側
断面図、第２図は、従来のチツプ型電子部品の側
断面図である。
１……部品本体、５……第１の外部リード部材
、５ａ……導出部、５ｂ……導出端、６……第２
の外部リード部材、８……樹脂材、９……凹部。
FIG. 1 is a side sectional view of a chip-type electronic component according to the present invention, and FIG. 2 is a side sectional view of a conventional chip-type electronic component. DESCRIPTION OF SYMBOLS 1... Part main body, 5... First external lead member, 5a... Leading out part, 5b... Leading end, 6... Second
external lead member, 8... resin material, 9... recessed portion.
Claims (1)
なる方向に導出して、第１の外部リード部材の導
出部を、樹脂材でモールドするとともに、導出端
を樹脂材の下面に沿うように折曲し、一方、第２
の外部リード部材を、部品本体の下面に沿うよう
に折曲し、部品本体の下面に、部品本体と第１の
外部リード部材の導出端とを離隔する凹部を形成
したことを特徴とするチツプ型電子部品。 The first and second external lead members are led out in different directions from the component body, the lead-out portion of the first external lead member is molded with a resin material, and the lead-out end is folded along the lower surface of the resin material. bend, while the second
A chip characterized in that the external lead member is bent along the lower surface of the component body, and a recess is formed on the lower surface of the component body to separate the component body and the lead-out end of the first external lead member. type electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19183687U JPH0423315Y2 (en) | 1987-12-16 | 1987-12-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19183687U JPH0423315Y2 (en) | 1987-12-16 | 1987-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0195721U true JPH0195721U (en) | 1989-06-26 |
| JPH0423315Y2 JPH0423315Y2 (en) | 1992-05-29 |
Family
ID=31482727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19183687U Expired JPH0423315Y2 (en) | 1987-12-16 | 1987-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423315Y2 (en) |
-
1987
- 1987-12-16 JP JP19183687U patent/JPH0423315Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423315Y2 (en) | 1992-05-29 |
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