JPH02120849U - - Google Patents
Info
- Publication number
- JPH02120849U JPH02120849U JP1989029598U JP2959889U JPH02120849U JP H02120849 U JPH02120849 U JP H02120849U JP 1989029598 U JP1989029598 U JP 1989029598U JP 2959889 U JP2959889 U JP 2959889U JP H02120849 U JPH02120849 U JP H02120849U
- Authority
- JP
- Japan
- Prior art keywords
- strips
- lead frame
- island
- resin
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029598U JPH02120849U (th) | 1989-03-14 | 1989-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029598U JPH02120849U (th) | 1989-03-14 | 1989-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02120849U true JPH02120849U (th) | 1990-09-28 |
Family
ID=31253951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989029598U Pending JPH02120849U (th) | 1989-03-14 | 1989-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02120849U (th) |
-
1989
- 1989-03-14 JP JP1989029598U patent/JPH02120849U/ja active Pending
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