JPH02121843A - Liquid jet recording head and method for manufacturing the head - Google Patents

Abstract

PURPOSE:To simplify and reduce manufacturing steps, and to obtain a recording head having high reliability by providing a first board formed with discharge energy generator, and a second board integrally having a groove for forming a recording liquid passage and a discharge port forming member reduced in thickness at the discharge forming part. CONSTITUTION:A recording head is formed of a heater board 100 formed with a heater and wirings, and a ceiling plate 400 formed with a partition wall for limiting an ink passage and a common liquid chamber, etc., and integrally has a resin orifice plate 404. When the plate 404 is radiated with a laser light from an excimer laser oscillator 450 through a mask 453 formed with a rectangular hole, a thin groovelike part 465 is formed. Then, it is replaced with a mask having a hole corresponding to the orifice, radiated with the laser to form an orifice 466. The board 100 adheres to the plate 404 to obtain a recording head. Thus, there is no apprehension of closure of the orifice and the ink passage for facilitating overall positioning and assembling.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a liquid jet recording head and a method for manufacturing the same, and more specifically, it is used in a liquid jet recording device in which recording is performed using droplets ejected from an ejection port. The present invention relates to a liquid jet recording head and a method of manufacturing the same.

[Prior Art] Conventional liquid jet recording devices of this type include those that eject minute droplets by generating a pressure change in a liquid flow path by deforming a piezoelectric element, or those that eject minute droplets by further providing a pair of electrodes. Various methods have been proposed in which air bubbles are generated by deflecting the liquid droplets and rapidly generating heat in a disposed heating element, and the generation of the air bubbles causes the liquid droplets to be ejected from the ejection port.

Among these, 91? A liquid ejecting recording head according to a method of ejecting & has a high density arrangement of liquid ejection openings (hereinafter also referred to as orifices) such as orifices for ejecting recording liquid droplets to form flying droplets. It is possible to perform high-resolution recording due to the ability to perform high-resolution recording, it is easy to make the overall recording head compact, and recent advances in technology and reliability in the semiconductor field have been remarkable, such as IC technology and micro It is possible to fully utilize the advantages of processing technology, making it possible to lengthen the length and make it planar (2
It is attracting particular attention because it is easy to make multi-nozzles and high-density packaging, and also because it has good productivity during mass production and can reduce manufacturing costs.

FIGS. 9A and 9B show an example of a conventional liquid jet recording head of this type.

In these figures, reference numeral 1 denotes a first substrate made of Si or the like, on the upper surface of which a group of electrothermal transducers and their wiring parts as ejection energy generating elements are provided. Reference numeral 8 denotes a second substrate made of glass, metal, etc., and ink channels 11 are formed by cutting, etching, etc. in correspondence with an inlet 9 for a recording liquid such as ink (hereinafter simply referred to as ink) and an electrothermal converter. A groove 11^ for forming the ink flow path wall 10, and a recess 12 serving as a common liquid chamber for storing the introduced ink and communicating with each flow path are formed.

Then, as shown in (8) of the same figure, the first and second substrates are adhesively fixed to each other with the adhesive 13, and as shown in (B) of the same figure.
The recording head is assembled as shown in .

However, the head obtained by the above method has the drawback that the straightness of the ejected ink droplets is often impaired. This is particularly due to the fact that the orifice of the head is formed from different materials, resulting in a difference in wettability for ink at the periphery of the orifice. Conventionally, in order to eliminate such defects, orifice plates were created by etching metal plates or photosensitive glass plates to form orifices, or orifice plates were made by drilling holes in resin films or the like to form orifices. It has been proposed to create an inkjet head by attaching it to the head body.

[Problems to be Solved by the Invention] However, the following problems have occurred in the liquid jet recording head (hereinafter also referred to as an inkjet recording head or simply a recording head) having such a configuration.

The above-described inkjet recording head includes a step of bonding an orifice plate during its manufacture, and upon said bonding, it is also necessary to precisely align the orifice and the flow path portion. Furthermore, if the end surfaces of the orifice plates of the first and second substrates to be bonded are not flush, the bonding becomes difficult, and this may also cause difficulty when bonding the two substrates.

In addition, the orifice plate is also fixed using adhesive, but the pitch of the channel 11 and the height of the channel wall lO are several lOμ.
The amount of adhesive 13 applied (thickness) is small, about m.
If it is not controlled to about several μm, the pressure applied during bonding may cause the adhesive to overflow to the flow path side, causing variations in the flow path diameter or the discharge port diameter, or causing the risk of blockage. Furthermore, if the adhesive strength is not sufficient, there is a risk that the orifice plate may peel off.

Furthermore, in orifice plates using resin films, the resin film generally has a thickness of only about 20 to 50 μm, which not only makes handling complicated, but also causes wrinkles and air bubbles to form when attached. It is also conceivable that good adhesion cannot be achieved if the adhesive is stored away.

The complexity of the manufacturing process and the large number of steps described above lead to an increase in the cost of manufacturing the recording head. This has also been a problem in making a recording head configured as a disposable one.

An object of the present invention is to solve the above-mentioned problems and provide an inexpensive inkjet recording head that has a simple manufacturing process, requires fewer man-hours, and is highly reliable, as well as a method for manufacturing the same.

[Means for Solving the Problems] Therefore, a liquid jet recording head according to a first aspect of the present invention is formed by molding a resin and a first substrate on which an ejection energy generating element is formed, and is bonded to the first substrate. a second substrate having a groove for forming a flow path for the recording liquid corresponding to the location where the ejection energy generating element is disposed during the bonding, and a recording liquid ejection opening in front of the groove. and the second substrate integrally having an ejection port forming member whose thickness is reduced at least in the portion where the ejection port is formed.

Further, in the method of manufacturing a liquid jet recording head according to the second aspect of the present invention, a first substrate on which an ejection energy generating element is formed, and a flow path for recording liquid corresponding to a location where the ejection energy generating element is disposed. In the method for manufacturing a liquid jet recording head, the second substrate is made of resin and is integrally molded with a plate-like member for forming recording liquid ejection ports. It is characterized by forming ejection ports by irradiating the material with excimer laser light.

Further, in the method for manufacturing a liquid jet recording head according to the third aspect of the present invention, the first
In a method of manufacturing a liquid ejecting recording head comprising bonding a substrate and a second substrate for forming a flow path for recording liquid corresponding to a location where an ejection energy generating element is disposed, an ejection port for recording liquid is formed. A second substrate material made of resin, on which a plate-like member for forming a discharge port is integrally molded, is irradiated with excimer laser light to thin the plate-like member at least over the range where the discharge port is to be formed. The method is characterized in that it includes a first step and a second step of irradiating the thinned portion with excimer laser light to form an ejection port.

[Function] According to the present invention, the process of assembling the recording head does not include the step of separately adhering the ejection port forming member serving as the orifice plate, so not only is positioning at the time of adhesion completely unnecessary, but also this Since no adhesive is used in the part, inconveniences such as clogging of the flow path associated with its use can be eliminated.

That is, according to the present invention, the overall recording head manufacturing process is simplified.

Further, by partially thinning the ejection port forming member so that the ejection port is formed there, the length of the flow path in front of the ejection energy generating element can be shortened.

[Example] Hereinafter, the present invention will be described in detail with reference to the drawings.

FIGS. 1A and 1B show an inkjet recording head according to an embodiment of the present invention, which is a disposable type in which an ink storage section serving as an ink supply source is integrated.

In the same figure (A), 100 is a heater board in which an electrothermal converter (discharge heater) and first-class wiring for supplying electric power to this are formed on a Si substrate by film-forming technology; This corresponds to the first substrate 1 in the figure. The detailed structure will be described later with reference to FIG. Reference numeral 200 is a wiring board for the heater board 100, and corresponding wiring is connected by wire bonding, for example.

Reference numeral 400 denotes a top plate provided with a partition wall for limiting the ink flow path, a common liquid chamber, etc., and corresponds to the second substrate 8 in FIG. made of materials. The detailed form of this top plate 400 will be described later with reference to FIGS. 3 to 5.

For example, 300 is a metal support, and 500 is a pressing spring. By sandwiching the heater board 100 and the top plate 400 between them and engaging them, the urging force of the pressing spring 500 causes the heater board 100 to Top plate 40
0 and fixed by crimping. This aspect will be described with reference to FIGS. 6 and 7. Note that the support body 300 may be provided with the wiring board 200 by adhesion or the like, and may have a standard for attachment to a carriage for scanning the head. The support body 300 also functions as a member that radiates and cools the heat of the heater board 100 that is generated during driving.

A supply tank 600 functions as a sub-tank that receives ink supply from an ink reservoir serving as an ink supply source and guides the ink to a common liquid chamber formed by joining the heater board 100 and the top plate 400.

700 is a supply tank 6 near the ink supply port to the common liquid chamber
The filter 800 is a lid member of the supply tank 600, which is disposed at a position inside the filter 00.

Reference numeral 900 denotes an absorber for impregnating ink, and is disposed within the cartridge body 1000. Is 1200 from the above parts 100 to 800? This is a supply port for supplying ink to the unit shown in FIG. You can make it happen.

1100 is a lid member of the cartridge main body, and 1400 is an atmosphere communication port provided in the lid member for communicating the inside of the cartridge with the atmosphere. 1300 is a liquid material 18 disposed inside the atmosphere communication port 1400, and thereby the atmosphere communication port 1
Ink leakage from 400 is prevented.

When the ink filling through the supply port 1200 is completed, the unit consisting of each part 100 to 800 is positioned and disposed in the part 1010. Positioning or fixing at this time is
For example, a protrusion 1012 provided on the cartridge body 1000
This can be done by fitting the holes 312 formed in the support body 300 corresponding thereto, thereby completing the cartridge shown in FIG. 1(B).

The ink is supplied from inside the cartridge through the supply port 1200.
, a hole 320 provided in the support 300 and a supply tank 60
(A) The ink is supplied into the supply tank 600 through the inlet provided on the solid surface side, and after passing through the inside, the ink is supplied from the outlet to an appropriate supply pipe and the ink inlet of the top plate 400. 4
20 into the common liquid chamber. A packing made of, for example, silicone rubber or butyl rubber is disposed at the above-mentioned connection portion for ink communication, and this seals the ink supply path to ensure an ink supply path.

FIGS. 2A and 2B are a plan view and a partially enlarged view of the heater board 100 according to this embodiment.

In the same figure (8), 101 is a heater board base according to this example, and 103 is a discharge heater section. 104 is a terminal, which is connected to the outside by wire bonding. 102
is a temperature sensor, which is formed in the discharge heater section 3 by the same film forming process as the discharge heater section 103 and the like. Same figure (
B) is an enlarged view of part B including the senna 102 in FIG. 1A, and 105 and 106 are a discharge heater and wiring, respectively. Further, 108 is a heat-retaining heater for heating the head.

Like the other parts, the sensor 102 has extremely high precision because it is formed using a film formation process similar to semiconductors, and the sensor 102 is made of aluminum, titanium, tantalum, tantalum pentoxide, niobium, etc., which are the constituent materials of the other parts. It can be made from a material whose conductivity changes depending on temperature. For example, among these, titanium is a material that can be placed between the heat generating resistor layer and the electrode that make up the electrothermal conversion element in order to improve their adhesion, and tantalum is a material that can be placed between the heat generating resistor layer and the electrode to improve the cavitation resistance of the protective layer on the heat generating resistor layer. There is a material that can be placed on top of it to enhance it. In addition, to reduce process variations, the line width is made thicker,
In order to reduce the influence of wiring resistance etc., the meandering shape is used to increase the resistance.

Similarly, the heat-retaining heater 108 can be formed using the same material (for example, HfBz) as the heat-generating resistance layer of the discharge heater 105, but it can also be formed using other materials constituting the heater board, such as aluminum, tantalum, titanium, etc. You may do so.

FIG. 3 shows an example of the structure of a top plate material for forming the top plate 400 according to this example.

The top plate material 400' has ink channel grooves 411, 412 .・
. . . in a desired number (two for simplicity in the figure), and an orifice plate portion 404 is integrally provided.

In the configuration example shown in the third diagram, the top plate material 400
′ is polysulfone with excellent ink resistance.

polyether sulfone, polyphenylene oxide,
It is made of a resin such as polypropylene and is simultaneously molded together with the orifice plate portion 404 in a mold. Note that the orifice plate portion 404 is made of the same resin material as the main body of the top plate material 400', or is made of a different type of resin material, and is manufactured separately from the main body of the top plate material 400'. Insert molding may be performed by inserting it into a mold.

As for the ink channel grooves, resin is molded using a mold in which fine grooves with a reverse pattern are formed by a method such as cutting, thereby forming channel grooves 411 and 412 on the top plate 400.

Orifice plate part 404 integrally molded in this way
has a thickness of approximately 50 to 100 μm due to molding. Although an orifice can be formed in this state, it is actually desirable that the flow path length in that portion be 20 μm or less. This is because if the length of the flow path from the discharge heater 105 is large, the discharge performance will be affected. Therefore, in this example, the orifice is formed after processing and thinning the orifice plate portion 404, particularly the portion corresponding to the grooves 411 and 412 and extending over the array range of the orifice to be formed. In this example, an excimer laser was used for processing.

This excimer laser is a laser that can emit ultraviolet light.It has high intensity, good monochromaticity, directivity, can emit short pulses, and can greatly increase energy density by focusing it with a lens. has advantages.

An excimer laser oscillator is a device that can oscillate short pulses (15 to 3 sns) of ultraviolet light by discharging and exciting a mixture of rare gas and halogen.

Xe-C1 and Ar-F lasers are often used. The oscillation energy of these is several 10,100 liters/pulse, and the pulse repetition frequency is 30 to 1,000 Hz.

When a polymer resin surface is irradiated with high-intensity short-pulse ultraviolet light such as excimer laser light, the irradiated area instantly decomposes and scatters with plasma emission and impact sound.
tive Photodecomposition (A
PD) process occurs, which allows processing of polymer resins.

In this way, when comparing the processing accuracy of excimer laser and that of other lasers, for example, polyimide (PI)
) Laser as excimer laser and other Y
When irradiated with AG laser and CO□ laser, the wavelength that absorbs PI light is in the UV region, so the F laser creates a clean hole, but the YAG laser, which does not have the UV region, creates a hole but the edge surface is rough. CO which is infrared
□Laser creates a crater around the hole.

Also, metals such as SUS, and opaque ceramics.

Since Sl and the like are not affected by excimer laser light irradiation in the τ atmosphere of the atmosphere, they can be used as a mask material in excimer laser processing.

FIG. 4 is a schematic diagram of an apparatus that performs processing using such an excimer laser. Here, 450 is an excimer laser oscillator (in this example, it is an r-F excimer laser oscillator)
, 451 is a lens with an f value of 500 mm, for example, for condensing the laser beam 452.

Reference numeral 453 denotes a mask made of a plate made of A42 or the like with a thickness of 1 mm, on which a hole pattern corresponding to the shape of the processed portion is formed. The top plate material 400' is appropriately positioned so that the surface to be processed is irradiated with a laser beam through a lens 451 and a mask 453.

In the process of thinning the orifice plate portion 404, the laser beam emitted from the r-F excimer laser oscillator 450 is passed through a mask 4 having rectangular holes, for example.
53 to the orifice plate section 404.

The orifice plate portion 404 is processed and becomes thinner only at the portion irradiated with the excimer laser.

FIG. 5(^) shows this state, and 465 is a groove-shaped portion made thin by the processing. At this point, by appropriately controlling the laser intensity and processing time,
The thickness of that portion was able to be approximately lθ to 20 μm.

Next, the orifice plate portion 404 was subjected to liquid-repellent treatment because a liquid-repellent surface is more effective against unnecessary ink wetting. In the wood example, DEFENSA manufactured by Dainippon Ink Co., Ltd. diluted to 1% with Daikin S-3 diluted was applied as a liquid repellent. Next, in order to harden the liquid repellent,
UV irradiation was performed.

Next, an orifice corresponding to the flow path is formed by processing with an excimer laser. This can be done by replacing the mask with the hole corresponding to the orifice in FIG. 4 with the mask described above. Then, after replacing the mask, alignment is performed, and laser irradiation is performed to form the orifice 406. In this way, a top plate 400 as shown in FIG. 5(n) can be received. In addition, the grooves 411 and 412 for forming flow paths and the common liquid chamber portion may also be processed using an excimer laser, and these may be used to form the discharge port (orifice) portion. It may be processed later. Further, depending on the configuration, the orifice plate portion 404 does not necessarily have to be partially thinned, such as when the length of the flow path in front of the discharge heater is not a problem.

Then, as shown in the - dotted chain line in the same figure, the heater board +0
0 to the orifice plate part 404 and join it,
Obtain the recording head body.

With the above configuration, there is no need to align or bond the top plate and the orifice plate as in the past, so there is no alignment error or misalignment during bonding, which reduces the number of defective products and shortens the process. , and was responsible for the mass production and cost reduction of recording heads. Furthermore, since there is no bonding process between the top plate and the orifice plate as in the conventional art, there is no risk of clogging the orifice or ink flow path due to adhesive flowing in. Furthermore, the heater board 100
and an orifice plate portion 404 integrated into a top plate 40.
0, positioning in the flow path direction can be achieved by abutting the heater board 100 against the end surface of the orifice plate section 404 on the opposite side to the discharge side end surface, thereby facilitating the overall positioning process and assembly process. In addition, there is no fear of the orifice plate peeling off as in the prior art.

FIG. 6 shows one mode of joining or fixing the heater board 100 and the top plate 400. In the figure, the orifice plate portion 404 of the top plate 400 is shown by a dashed-dotted line for the sake of simplification, and the wiring pattern on the heater board 100 is not shown.

As described above, the heater board 100 and the top plate 400 are positioned by abutting the end surface of the heater board 100 against the orifice plate portion 404, but when joining them, the heater board 100 and the top plate 400 are positioned along three sides of the outer periphery of the top plate 4QQ. Adhesive 405 was applied. This makes it possible to suppress the adhesive from flowing into the ink flow path. Furthermore, heater board 1
00 and the orifice plate portion 404 in a necessary and sufficient amount over an appropriate range.

In this example, a photocurable adhesive 11V-201 (Grace Javan ■) is used as the adhesive 405, and after positioning, it is irradiated with ultraviolet rays of, for example, 10 to 30 J/co+2 to harden and fix the two. did. Here, since the portion where the adhesive 405 is present is separated from the flow path or the discharge port, the allowable number of trials for positioning increases.

Next, the top plate 400 and the heater board 10 (
The recording head body obtained by integrating the recording head 1 is fixed onto a support 300 using an adhesive 306. This adhesive 306 is, for example, l! manufactured by Canon Chemical ■! P2R/
2) 1 can be used.

In this state, both boards (heater board 1θ
0 and the top plate 400) are only adhered at the outer peripheral portions other than the flow path portion, and sufficient adhesion is not obtained. Therefore, the urging force of the pressing spring 500 is applied from the upper side of the top plate 400. This pressing spring 500 can be formed using, for example, phosphor bronze or stainless steel for springs. Then, the claws 507 provided at the bottom of both ends are connected to the support body 30.
By fitting the top plate 400 into the hole 307 provided in the top plate 400 and engaging the two, mechanical pressure is applied from the top of the top plate 400.

This provides sufficient adhesion between both substrates. In addition, in this pressing spring 500, 520 is a hole,
It accepts insertion of a supply pipe that connects the ink introduction port 420 of the top plate 400 and the ink supply port on the supply tank 600 side.

In this example, a light-curing adhesive was used to join the top plate 400 and the heater board +00, but the adhesive may have any form, or the
It is not necessarily necessary to use an adhesive if sufficient fixing force or sealing force can be obtained at zero. For example, for the purpose of improving liquid sealing properties, an appropriate sealing material, ie, a sealing agent, a rubber packing, or the like can be used. Similarly, the adhesive 306 may not be used if sufficient fixing force of the head body can be obtained through engagement between the claw 50 of the presser spring 500 and the hole 307 of the support 300.

According to this example, a sufficient bonding state can be obtained without applying an adhesive to the surface of the channel wall of the top plate 400, so that the process of applying the adhesive can be simplified. In addition, if wrinkles occur during conventional alignment, adhesive may be present in the flow path of the heater board 100.
However, in this example, there is no such problem, and positioning can be performed as many times as necessary. Furthermore, since the top plate made of resin material is allowed to have some deformation, warpage, or manufacturing variation, the manufacturing process becomes simpler.

FIG. 7 shows a modification of the configuration shown in FIG. Note that the illustration of the orifice plate portion 404 on the top plate 400 is omitted in the figure.

In this example, as in the example shown in FIG. 6, a recording head main body consisting of a heater board 100 and a top plate 400 is joined to a support 300, and a planar leaf spring 500 is applied from the top surface of the top plate 400. By adding this, we created a structure that provides sufficient adhesion. The leaf spring 500 is further pressurized by another member above it (for example, the supply tank 600 in FIG. 1).

Also in this example, the same effect as the configuration shown in FIG. 6 could be obtained.

By assembling each part of the above-mentioned structure through the steps described above with reference to FIG. 1(A), a cartridge as shown in FIG. Printers, ie, inkjet printers using disposable cartridges, can be configured.

In addition, 14 in Fig. 8 corresponds to Fig. 1 (8) and (B).
This is the cartridge shown in , and this cartridge 1
4 is fixed on the carriage 15 by a presser member 41, and these can be reciprocated in the longitudinal direction along the shaft 21. Further, positioning with respect to the carriage 15 can be performed, for example, by a hole provided in the support body 300 and a dowel provided on the carriage 15 side. Furthermore, electrical connection can be made by connecting a connector on the carriage 15 to a connection bat provided on the wiring board 200.

The ink ejected by the recording head 1 reaches the recording medium 18 whose recording surface is regulated by the platen 19 at a slight distance from the recording head, and forms an image on the recording medium 18.

The recording head is supplied with an ejection signal corresponding to image data from an appropriate data supply source via a cable 16 and a terminal connected thereto. One or more cartridges 14 (two in the figure) can be provided depending on the color of ink used and the like.

In FIG. 8, 17 is a carriage motor for scanning the carriage 15 along the shaft 21;
2 is a wire that transmits the driving force of the motor 17 to the carriage 15. Further, 20 is a feed motor coupled to the platen roller 19 for conveying the recording medium 18.

In an inkjet printer using such a disposable cartridge 14, the cartridge 14 is replaced when the ink impregnated in the absorber 900 runs out, and for this reason, it is desirable that the cartridge 14 be inexpensive. Cartridge 1 described in the above embodiments
As mentioned above, since the manufacturing process is simple and the number of man-hours is small, it can be constructed at low cost, and is therefore extremely suitable for making it disposable. Furthermore, since it is important to perform accurate alignment when assembling the recording head body, and there will be no variation in dimensions or blockage of the flow path due to adhesive flowing in, reliability is extremely high and yield rate is very high. will also improve.

It goes without saying that the present invention is not limited to the above-described embodiments, and can take various configurations.

For example, on the upper side, the recording head main body, ink supply source, etc. may be integrated and made disposable, or they may be separate bodies, and each of them does not necessarily have to be made disposable. In other words, even if the recording head body is fixed and cannot be easily replaced,
This is because configuring this simply and inexpensively as described above also contributes to lowering the price of the printer itself.

In addition, regarding the recording/rad main body consisting of the heater board 100 and the top plate 400, recesses for forming ink channels and common liquid chambers were provided only on the top plate side on the upper side, but these were provided on both sides. Good too. In addition, regarding this recording head main body, a discharge heater 105 is used on the upper side to convert thermal energy into discharge energy, but an electro-mechanical transducer that deforms in response to energization is used to suppress the mechanical vibration. It may also be in the form of discharge energy.

Furthermore, although the orifice plate portion 404 itself has a portion abutting the heater board on the upper side, the shape of the abutting portion may be of any shape. For example, such an abutment may also be provided in the lateral direction to perform lateral positioning, or instead of providing such an abutment, positioning may be performed by a combination of a dowel and a hole. It may be done as desired. Moreover, if the positioning is not a problem, the abutting portion or the positioning member is not necessary. That is, the top plate may have a wall portion flush with the joint surface in front of the groove portion, and the discharge port may be formed therein.

In addition, on the upper side, the top plate and the heater board are tightly joined together using a pressure spring, but if the use of only adhesive is not a problem for the connection, it is also possible to have a configuration that does not use a pressure spring. .

[Effects of the Invention] As explained above, according to the present invention, it is possible to construct an inkjet recording head with a simple manufacturing process, a small number of steps, and high reliability. .

[Brief explanation of drawings]

FIGS. 1A and 1B are an exploded perspective view and an external perspective view showing an example of the configuration of a cartridge including a recording head according to an embodiment of the present invention, and FIGS.
B) is a plan view and a partially enlarged view showing an example of a heater board applicable to the recording head according to this embodiment, and FIG. 3 is a perspective view showing an example of the configuration of a top plate material used in this embodiment. , FIG. 4 is a schematic diagram showing a configuration example of an excimer laser device for processing the orifice plate portion according to this example, and FIGS. An explanatory diagram for explaining the process of processing such a top plate; FIGS. 6 and 7 are explanatory diagrams for explaining two examples of the manner of joining or assembling the recording head main body; FIG. 8 is an illustration for explaining the process of processing the top plate; FIG. A perspective view showing an example of an inkjet printer constructed using a cartridge of the type shown in FIG. DESCRIPTION OF SYMBOLS 1... First substrate, 8... Second substrate, lO... Channel wall, 11... Ink channel, 12... Common liquid chamber forming recess, 13... Adhesive, DESCRIPTION OF SYMBOLS 14... Cartridge, 15... Carriage, 41... Cartridge holder, 100... Heater board, 105... Discharge heater, 200... Wiring board, 300... Support body, 400... ...Top plate, 400'...Top plate material, 404...Orifice plate portion, 405...Adhesive, 411.412...Ink channel forming groove, 420...
・Ink introduction port, 421.422... Orifice, 430... Common liquid chamber forming recess, 450... Kr-F excimer laser oscillator, 451.
...Lens, 453...Mask, 455...Groove portion, 456...Orifice, 500...Press spring, 600...Supply tank, 00...Filter, aOO...Lid member , 900... Ink absorber, 1000... Cartridge body, 1100... Lid member, 1200... Ink supply port, 1300... Liquid repellent material, 1400... Atmospheric communication port. Figure (A) Figure (B) Figure (A) Figure (B)

Claims (1)

[Scope of Claims] 1) A first substrate on which an ejection energy generating element is formed; and a second substrate formed by molding a resin and bonded to the first substrate, wherein the ejection energy generating element is formed at the time of the bonding. It has a groove for forming a flow path for the recording liquid corresponding to the location where the recording liquid is disposed, and a discharge port for the recording liquid is formed in front of the groove, and at least in the portion where the discharge port is formed. A liquid jet recording head comprising: the second substrate integrally having a thinner ejection port forming member; 2) The liquid jet recording head according to claim 1, wherein the ejection port forming member has the form of a plate member for positioning the first substrate by abutting against it during the bonding. 3) The liquid jet recording head according to claim 1, wherein the ejection energy generating element has the form of an electrothermal transducer that generates thermal energy for ejecting the recording liquid. 4) Liquid jet recording made by bonding a first substrate on which an ejection energy generating element is formed and a second substrate for forming a recording liquid flow path corresponding to the location where the ejection energy generating element is disposed. In the method for manufacturing a head, a second substrate material made of resin, on which a plate-like member for forming an ejection port for the recording liquid is integrally molded, is irradiated with an excimer laser beam to form the ejection port. A method of manufacturing a liquid jet recording head, characterized in that: 5) Liquid jet recording made by bonding a first substrate on which an ejection energy generating element is formed and a second substrate for forming a flow path for recording liquid corresponding to the location where the ejection energy generating element is disposed. In the method for manufacturing a head, a second substrate material made of resin, on which a plate-like member for forming the ejection ports for the recording liquid is integrally molded, is irradiated with excimer laser light to form at least the ejection ports. A liquid characterized by comprising: a first step of thinning the plate-like member over a range where the thinned portion is to be formed, and a second step of irradiating the thinned portion with excimer laser light to form the ejection port. A method of manufacturing an ejection recording head.