JPH02122016A - Groove hardening equipment using laser light - Google Patents
Groove hardening equipment using laser lightInfo
- Publication number
- JPH02122016A JPH02122016A JP63274771A JP27477188A JPH02122016A JP H02122016 A JPH02122016 A JP H02122016A JP 63274771 A JP63274771 A JP 63274771A JP 27477188 A JP27477188 A JP 27477188A JP H02122016 A JPH02122016 A JP H02122016A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- laser
- groove
- hardening
- laser light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は摺動面として利用されるV字型溝部等をレーザ
光により焼入れする装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for hardening V-shaped grooves and the like used as sliding surfaces with laser light.
[在米技術l
従来、■字型溝ff1SkIfの焼入れ装置としては、
高周波焼入れによるものが主で、他に浸炭焼入れ、水、
油焼入れなども用いられている。[U.S.-based technology] Conventionally, as a hardening device for ■-shaped grooves ff1SkIf,
The main method is induction hardening, but other methods include carburizing, water,
Oil quenching is also used.
しかしながら、高周波焼入れ、浸炭焼入れ、水、油焼入
れなどにおいては焼入れ歪が大きく後加工に多(の時間
が費やされていた。However, in induction hardening, carburizing hardening, water, oil hardening, etc., quenching distortion is large and a large amount of time is wasted in post-processing.
そのため、レーザ光により焼入れをしたものも利用され
ている。これは、第4図に示すように基材1の溝部に吸
収剤を塗布してレーザ光の吸収特性を良くした後、溝部
の各壁面に対し個別にレーザ光2を照射して焼入れを行
うものである。この場合、IKW出力の炭酸〃スレーブ
により入射角45°で行った場合、被焼入物の搬送速度
を0゜3メ一トル/分程度にしていた。For this reason, materials that have been hardened with laser light are also used. As shown in Fig. 4, an absorbent is applied to the grooves of the base material 1 to improve the absorption characteristics of the laser beam, and then each wall surface of the groove is individually irradiated with the laser beam 2 for hardening. It is something. In this case, when the carbon dioxide slave with IKW output was used at an incident angle of 45°, the conveyance speed of the material to be quenched was approximately 0°3 m/min.
[発明が解決しようとする課題1
しかしながら、レーザ光を焼入れに利用する場合におい
ても焼入れ前にレーザの吸収剤を塗布し、焼入れ後除去
するという工程が増え、作業環境、コストの面であまり
大きなメリットが得られなかった。さらに、各壁面を一
面毎1こレーザ焼入れを行なうため第4図に示すように
1パスめの焼入れ硬化層6は、2パスめ(反対側斜面焼
入れ)の焼入れ硬化M7を形成する時、レーザビーム2
の斜面での反射光により焼戻され硬度が低下する現象が
起きるといった問題点があった。[Problem to be Solved by the Invention 1] However, even when laser light is used for hardening, the process of applying a laser absorbent before hardening and removing it after hardening increases, which is too big in terms of work environment and cost. No benefits were obtained. Furthermore, since each wall surface is laser hardened one by one, as shown in FIG. beam 2
There was a problem in that the hardness decreased due to tempering caused by light reflected from the slope of the steel.
本発明は上記問題点を解決するためになされたもので、
その目的は、簡単な構成且つ工程により均一に溝部の焼
入が可能で、工程中に焼戻しが起きることのないレーザ
光による溝部焼入装置を提供することである。The present invention has been made to solve the above problems,
The object is to provide a groove hardening device using a laser beam that can harden the groove uniformly through a simple configuration and process, and does not cause tempering during the process.
[、#!題を解決するための手段)
上記目的を達成するために本発明は、P波を含むレーザ
光を発光するレーザ光発光手段と、該レーザ光発光手段
の発光するレーザ光を少なくとも2本以上のレーザ光に
分割するレーザ光分割手段と、該レーザ光分割手段によ
り分割された各レーザ光を屈折或いは反射し、各レーザ
光を被焼入溝部に対しブリュースター角と略凹−の入射
角で照射する向きに誘導するレーザ光誘導手段とを有す
ることを要曾とする。[,#! Means for Solving the Problem) In order to achieve the above object, the present invention provides a laser beam emitting means that emits a laser beam containing P waves, and a laser beam emitting means that emits at least two laser beams. A laser beam splitting means that splits the laser beam into laser beams, and a laser beam splitting means that refracts or reflects each laser beam split by the laser beam splitting means, and directs each laser beam to the groove to be hardened at an incident angle substantially concave to the Brewster's angle. It is essential to have a laser beam guide means for guiding the laser beam in the direction of irradiation.
[作用[
上JC端成を有する本発明において、前記レーザ光発光
°F−段より照射されるレーザ光は、レーザ光分割手段
により分割された後、レーザ光誘導手段により誘導され
て被焼入溝部に入射する。このレーザ光の入射角はブリ
ュースター角と略凹−であり、レーザ光中のP波が被焼
入溝部に吸収され壁部が焼入れされる。[Function] In the present invention having the above JC termination, the laser beam irradiated from the laser beam emitting °F-stage is divided by the laser beam splitting means and then guided by the laser beam guiding means to the hardened object. enters the groove. The incident angle of this laser beam is substantially concave with the Brewster's angle, and the P wave in the laser beam is absorbed by the groove to be hardened, thereby hardening the wall portion.
E実施例]
以下に本発明を具体化した一実施例を図面を参照しで説
明する6
まず本実施例のaft!により焼入れされるV字型溝を
有すスライド10の形状について説明する。Example E] An example embodying the present invention will be described below with reference to the drawings.6 First, the aft! The shape of the slide 10 having a V-shaped groove that is hardened will be explained.
第2図に示すように本スライド10は、水平面11に対
し45°及び135°の角度を有す斜面によりv字型溝
が形成されている。この装置は、この斜面の部分に対し
焼入れを行なうように設計されている。As shown in FIG. 2, this slide 10 has V-shaped grooves formed by slopes having angles of 45° and 135° with respect to the horizontal surface 11. This device is designed to harden this sloped portion.
次に本V装置の構成を第1図を参照して説明する。Next, the configuration of this V device will be explained with reference to FIG.
前記スライド10を固定する治具(図示せず)は、前記
スライド10を固定した状態で該スライド10の溝方向
(第2図における矢印Aの方向)に移動可能である。こ
の治具の移動経路途中における一点の上部には、炭酸ガ
スレーザ発振器21が取付けられている。この炭酸ガス
レーザ発振器21は1キロワツトの直線偏光のレーザ光
を、前記スライド10の溝部の対称線に沿って照射する
。A jig (not shown) for fixing the slide 10 is movable in the direction of the groove of the slide 10 (in the direction of arrow A in FIG. 2) while the slide 10 is fixed. A carbon dioxide laser oscillator 21 is attached to the upper part of the jig at a point along its moving path. This carbon dioxide laser oscillator 21 irradiates a linearly polarized laser beam of 1 kilowatt along the line of symmetry of the groove of the slide 10.
この炭Fin’スレーザ発振器21とスライド10との
間には分割ミラー22が取付けられている。A split mirror 22 is attached between the carbon Fin' laser oscillator 21 and the slide 10.
この分割ミラー22は、平板ミラーの上側を反射面とし
、逆V字型に折曲したもので、前記対称線に対して対称
に取付けられている。従って、前記炭酸〃スレーザ発振
器21の照射するレーザ光は図中に示されるように前記
対称線に対し対称な2方向に分割される。The split mirror 22 is a flat mirror bent in an inverted V shape, with the upper side of the mirror serving as a reflective surface, and is mounted symmetrically with respect to the line of symmetry. Therefore, the laser beam emitted by the carbon dioxide laser oscillator 21 is divided into two directions symmetrical with respect to the line of symmetry, as shown in the figure.
この分割された2本のレーザ光のそれぞれの経路には、
反射ミラー23.24が取付けられている。これらの反
射ミラー23.24は前記分割されたレーザ光を反射し
、前記スライド10の斜面の部分に入射角80°乃至8
5°で入射するようにその位置及び角度が調整されてい
る。In each path of these two divided laser beams,
Reflection mirrors 23, 24 are installed. These reflecting mirrors 23 and 24 reflect the divided laser beams and form an incident angle of 80° to 80° on the inclined surface of the slide 10.
Its position and angle are adjusted so that it is incident at 5°.
この80°乃至85°の入射角はブリュースター角に対
応し、第3図に示すようにこの付近の角度で入射したP
波は略80%の効率で吸収され、熱にかわる。This angle of incidence of 80° to 85° corresponds to the Brewster angle, and as shown in Figure 3, P
Waves are absorbed with approximately 80% efficiency and converted into heat.
以上のように構成された本装置の作用を以下に説明する
。The operation of this device configured as above will be explained below.
被焼入物である前記スライド10は治具に固定され、そ
の溝方向に0.2メ一トル/分の速度で移動していく。The slide 10, which is the object to be hardened, is fixed to a jig and moves in the direction of the groove at a speed of 0.2 meters/min.
このスライド10の先端が前記炭酸ガスレーザ発振器2
1の直下を通過すると、該炭酸がスレーザ発振器21か
ら発光された直線偏波のに一ザ光は第1図に示すように
、前記分割ミラー22によって2方向に分割された後、
それぞれ反射ミラー23.24により前記スライド10
の3斜面に入射角8()°乃至85゛で入射する。The tip of this slide 10 is the carbon dioxide laser oscillator 2.
1, the linearly polarized light emitted from the laser oscillator 21 is split into two directions by the splitting mirror 22, as shown in FIG.
Said slide 10 by reflective mirrors 23, 24 respectively.
The light is incident on the three slopes at an angle of incidence of 8()° to 85°.
この斜面に入射したレーザ光のP波成分は、略80%の
効率で吸収され、熱エネルギーに変化し斜面の焼入れを
行なう。また反射した略20%のレーザ光についても、
他方の斜面に入射する。この時その部分についても同様
にレーザ光により熱せられている最中であり、前記反射
された略20%のレーザ光のエネルギーにより焼戻しさ
れることはない。The P-wave component of the laser beam incident on this slope is absorbed with approximately 80% efficiency and is converted into thermal energy to harden the slope. Also, regarding approximately 20% of the reflected laser light,
incident on the other slope. At this time, that portion is also being heated by the laser beam, and is not tempered by the approximately 20% energy of the reflected laser beam.
この装置では、吸収剤等を用いていないにもかかわらず
従来と同程度の吸収特性を得ることができ、且つ各斜面
を同時に焼入れするので迅速に焼入れを行なうことがで
きる。With this device, although no absorbent or the like is used, it is possible to obtain absorption characteristics comparable to those of the conventional method, and since each slope is quenched at the same time, the quenching can be carried out quickly.
[発明の効果1
以上詳述したように本発明では、吸収剤を塗布しなくて
も高い効率で焼入れができ、且つ各斜面を同時に焼入れ
することができるため、処理工程の短縮ができるといっ
た優れた効果がある。[Effect of the invention 1 As detailed above, the present invention has the advantage of being able to harden with high efficiency without applying an absorbent, and also to shorten the treatment process because each slope can be hardened at the same time. It has a positive effect.
第1図乃至第3図は本発明の一実施例の装置を説明する
らので、第1図は本装置の構成を説明する説明図、第2
図は本装置により焼入れされるスライドの外形を説明す
る斜視図、第3図はP波における入射角と吸収率の関係
を説明するグラフで・ある。また第4図は従来の装置を
用いた場合の焼入れの様子を説明する説明図である。
図中、21はレーザ光発光手段に対応する炭酸がスレー
ザ発振器、22はレーザ尤分割手段に対応する分割ミラ
ー、23.24はレーザ光誘導手段に対応する反射ミラ
ーである。1 to 3 are used to explain an apparatus according to an embodiment of the present invention, therefore, FIG.
The figure is a perspective view illustrating the outer shape of a slide hardened by this device, and FIG. 3 is a graph illustrating the relationship between the incident angle and absorption rate for P waves. Further, FIG. 4 is an explanatory diagram illustrating the state of hardening when a conventional device is used. In the figure, 21 is a carbon dioxide laser oscillator corresponding to the laser beam emitting means, 22 is a dividing mirror corresponding to the laser beam dividing means, and 23 and 24 are reflecting mirrors corresponding to the laser beam guiding means.
Claims (1)
、 該レーザ光発光手段の発光するレーザ光を少なくとも2
本以上のレーザ光に分割するレーザ光分割手段と、 該レーザ光分割手段により分割された各レーザ光を被焼
入溝部に対しブリュースター角と略同一の入射角で照射
する向きに誘導するレーザ光誘導手段とを有することを
特徴とするレーザ光による溝部焼入装置。 2、請求項1記載のレーザ光による溝部焼入装置におい
て、前記レーザ光発光手段は直線偏光レーザ光を発光す
るものであることを特徴とするレーザ光による溝部焼入
装置。[Claims] 1. A laser beam emitting means that emits a laser beam containing P waves; and at least two laser beams emitted by the laser beam emitting means.
A laser beam splitter that splits the laser beam into more than one laser beam, and a laser that guides each laser beam split by the laser beam splitter in a direction to irradiate the groove to be hardened at an incident angle substantially the same as the Brewster angle. 1. A groove hardening device using a laser beam, comprising a light guide means. 2. A groove hardening device using a laser beam according to claim 1, wherein the laser beam emitting means emits a linearly polarized laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63274771A JPH02122016A (en) | 1988-10-31 | 1988-10-31 | Groove hardening equipment using laser light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63274771A JPH02122016A (en) | 1988-10-31 | 1988-10-31 | Groove hardening equipment using laser light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02122016A true JPH02122016A (en) | 1990-05-09 |
Family
ID=17546344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63274771A Pending JPH02122016A (en) | 1988-10-31 | 1988-10-31 | Groove hardening equipment using laser light |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02122016A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04210417A (en) * | 1990-12-12 | 1992-07-31 | Nissan Motor Co Ltd | Laser beam hardening method |
| JPH04272122A (en) * | 1991-02-28 | 1992-09-28 | Nissan Motor Co Ltd | Laser-beam machine |
| JPH04362119A (en) * | 1991-06-07 | 1992-12-15 | Nissan Motor Co Ltd | Laser hardening device |
| JPH04365810A (en) * | 1991-06-13 | 1992-12-17 | Nissan Motor Co Ltd | Working head for laser beam hardening |
| JPH04371514A (en) * | 1991-06-18 | 1992-12-24 | Nissan Motor Co Ltd | Laser beam quenching method |
| JPH0543932A (en) * | 1991-08-07 | 1993-02-23 | Nissan Motor Co Ltd | Laser hardening method |
-
1988
- 1988-10-31 JP JP63274771A patent/JPH02122016A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04210417A (en) * | 1990-12-12 | 1992-07-31 | Nissan Motor Co Ltd | Laser beam hardening method |
| JPH04272122A (en) * | 1991-02-28 | 1992-09-28 | Nissan Motor Co Ltd | Laser-beam machine |
| JPH04362119A (en) * | 1991-06-07 | 1992-12-15 | Nissan Motor Co Ltd | Laser hardening device |
| JPH04365810A (en) * | 1991-06-13 | 1992-12-17 | Nissan Motor Co Ltd | Working head for laser beam hardening |
| JPH04371514A (en) * | 1991-06-18 | 1992-12-24 | Nissan Motor Co Ltd | Laser beam quenching method |
| JPH0543932A (en) * | 1991-08-07 | 1993-02-23 | Nissan Motor Co Ltd | Laser hardening method |
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