JPH021224B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus for a crystal resonator, in particular, to provide excitation electrodes on a plurality of crystal pieces at the same time, and then
The present invention relates to a vacuum evaporation device that allows frequency adjustment to be performed sequentially on each crystal piece.

In general, a crystal resonator 1 has a crystal piece 2 cut out at a predetermined angle, as shown in FIG.
A metal material such as silver or aluminum is deposited in multiple layers such as two or three layers by vacuum deposition to form excitation electrodes 3 (one not shown) and terminals 4, and this crystal piece 2 is After holding the holding members 7, 7 connected to the lead-out terminals 6, 6 implanted in the base 5, the holding members 7, 7 and the terminals 4, 4 are bonded with a conductive adhesive, and the crystal piece is The vibration energy of 2 is taken out to the outside via the terminals 4, 4, the holding members 7, 7, and the lead-out terminals 6, 6.

By the way, the vibration frequency of the crystal resonator 1 described above depends on the thickness and size of the crystal piece 2 or the excitation electrode 3,
3. This is determined by the quality and quantity of the terminals 4, 4, but since it is difficult to accurately cut out the thickness of the crystal piece 2, the crystal piece 2 of a predetermined shape is simply coated with a predetermined material (chromium, gold, gold, etc.). It is difficult to obtain a crystal resonator that vibrates at a predetermined accurate frequency f ₀ by simply depositing a predetermined amount of silver (silver, aluminum) in a vacuum evaporation device. 1, once the excitation electrodes 3, 3 are deposited in two or three layers on the crystal piece 2 in a vacuum evaporation apparatus, and then taken out from the vacuum evaporation apparatus, held between the holding members 7, 7 as described above, and crystal oscillator 1
As shown in the figure or FIG.
After that, by the method described below, a minute amount of material is continued to be deposited on the excitation electrodes 3, 3 of the crystal piece 2 in several steps, and the frequency changes as a result of the deposition.
A point where f ₁ becomes equal to a predetermined frequency f ₀ is determined, and the vapor deposition is stopped to obtain a crystal resonator 1 having a reference frequency f ₀ .

In addition, in the third illustration, the crystal resonators 1 are stored in a tray 8' via individual storage stands 9.

When adjusting the frequency, tray 8,
Terminal insertion parts 11, 11 provided on turntables 10, 10' in a vacuum deposition chamber (not shown) for adjusting the frequency of the crystal oscillators 1 on 8' one by one.
Alternatively, it is replaced with the storage hole 11' of the storage stand 9, and then the turntables 10, 10' are rotated intermittently to remove chromium, gold, silver, etc. from the evaporation sources 12, 12'.
A method in which a minute amount of a substance such as aluminum is deposited on the excitation electrode 3 of the opposing crystal oscillator 1, and the deposition is performed in several steps until the frequency f ₁ of the crystal oscillator 1 becomes the reference frequency f ₀ . It is. The reason why the evaporation is performed in several steps is to prevent the reference frequency f ₀ from being exceeded in the middle of the evaporation if the evaporation is performed at once.
Generally, the second evaporation is performed in an even smaller amount than the first, and the third evaporation is performed in an even smaller amount, and during this third evaporation, the reference frequency f ₀
Many of them reach this point.

In addition, whether or not the reference frequency f ₀ has been reached can be determined by connecting the lead-out terminals 6, 6 of the crystal resonator 1 to be adjusted to an oscillation circuit (not shown) and oscillating it, separately from the signal from the oscillation circuit. It is sufficient to detect the zero beat with respect to the signal from the oscillator that oscillates at the reference frequency f ₀ .

After the adjustment, the vacuum state in the vacuum deposition chamber is released, and the crystal resonator 1 is stored in the trays 8 and 8' again.
Again, from other trays 8, 8', other crystal units 1
, and perform the same work.

By the way, the above-mentioned conventional crystal resonator is first stored and taken out in a vacuum deposition chamber in order to deposit the excitation electrodes 3, 3 on the crystal piece 2, and then returned to the vacuum deposition chamber (in the same or another vacuum chamber) for frequency adjustment. The process is complicated because the crystal resonators stored in the trays 8, 8' must be taken out one by one, and the turntables 10, 10' inside the vacuum deposition chamber must be taken out one by one. After adjusting the device,
Since it is to be stored in trays 8 and 8' again,
There were disadvantages such as poor working efficiency, the crystal resonator 1 being moved in and out a lot, and the crystal piece 2 being damaged during the movement.

In view of the above points, the present invention stores a plurality of crystal pieces in the same vacuum deposition chamber, simultaneously applies basic vapor deposition for excitation electrodes to each crystal piece, and then sequentially applies the basic vapor deposition for the excitation electrode to each crystal piece while maintaining the vacuum state. It is an object of the present invention to eliminate the above-mentioned drawbacks by adjusting each frequency one by one, and to provide a device that improves work efficiency and does not cause damage to the crystal piece.

Hereinafter, one embodiment of the present invention will be described in detail based on the drawings. FIG. 7 is a front view showing the state in which the crystal piece 2 is attached to the base 5. As shown in FIG. As is clear from the figure, in this state, the excitation electrodes 3, 3 and terminals 4, 4 are not provided on both surfaces of the crystal piece 2, and are merely temporarily fixed to the holding members 7, 7. In the figure, 20 is a mask, which is fitted onto the base 5, and holes 21, 21 are provided on the front and back surfaces of the mask to allow vapor deposition. Note that 6 and 6 are lead-out terminals. Note that this state is referred to as a sample. FIG. 8 is a partially sectional side view of the vacuum deposition chamber 22. 23 is a surface plate of the vacuum deposition chamber 22, and a plurality of support columns 24 are provided on the surface plate 23. The support columns 24 are provided with stepped portions 24a, 24b, for positioning the upper and lower plates, which will be described later. 26 is an upper plate, and the step part 2 of the support column 24...
4b..., and the support column 24 is located at the nut 25...
installed on. 27 is a motor held at the lower center of the upper plate 26, 28 is a rotating shaft of the motor 27, 29 is a transmission shaft attached to the rotating shaft 28,
The transmission shaft 29 has a large diameter portion 29a and a small diameter portion 29b, and the tip of the small diameter portion 29b is provided with a threaded portion so as to be able to engage with a nut 30. Reference numeral 31 denotes a first deposit shielding plate attached to the narrow diameter portion 29b of the transmission shaft 29, and the deposit shielding plate 31 has a mounting hole 31a in its center, as is particularly clear from the plan view shown in FIG. Holes 32a for allowing vapor deposition are provided at equal distances from the mounting hole 31a and at regular intervals.
A plurality of holes 32f (six in the embodiment) are provided, and an adjustment hole 33 for frequency adjustment is provided between the holes 32a and 32f. Note that the adjustment hole 33 is also provided at a position equidistant from the attachment hole 31a. 34 is a locking piece provided on the deposit shielding plate 31. Reference numeral 35 designates a second deposit shielding plate, and as is particularly clear from the plan view shown in FIG. A hole 32 provided in the first vapor deposit shielding plate 31 is provided.
Although holes 36a to 36f are provided at positions corresponding to holes a to 32f, no hole corresponding to adjustment hole 33 is provided. The first vapor deposit shielding plate 31 is rotatably mounted to the transmission shaft 29, and the second vapor deposit shielding plate 35 is non-rotatably mounted to the transmission shaft 29. To explain this with reference to FIG. 8, first, the coil spring 37 is inserted into the narrow diameter portion 29b, and then the first vapor deposit shielding plate 3 is inserted.
Insert 1. At this time, the mounting hole 31a is
Since it has a larger diameter than 9b, it is loosely fitted. Next, a friction plate 38 made of felt or the like
is inserted, and then the second vapor deposit shielding plate 35 is tightly fitted into the narrow diameter portion 29b, and the nut 30 is engaged. Since the first vapor deposit shielding plate 31 is appropriately compressed by the second vapor deposition shielding plate 35 through the media, the first vapor deposition shielding plate 31 rotates with the rotation of the transmission shaft 29 without idling unless a certain torque or more is applied. It is something that can be done. 39 is the upper plate 2
6, the sample mounting member 39 has a cylindrical shape as clearly seen from the plan view shown in FIG. Attachment portions 40a to 40f, the number of which is equivalent to the number of holes 36a to 36f, are provided at equal intervals and with their tips slanted downward. Then, the sample shown in FIG. 7 is attached to the attachment parts 40a to 40f. The details will be explained using FIG. 12. As shown in the figure, the mounting portion 40a is provided with a lead-out terminal insertion hole 41a.
When the sample lead-out terminals 6, 6 are inserted into the lead-out terminals 6, 6, the detection piece 43 that advances into the insertion hole 41a from the hole 42a provided in the mounting portion 40a of the lead-out terminals 6, 6 comes into contact with the lead-out terminals 6, 6. . Reference numeral 44 denotes a lower plate, and the lower plate 44 is positioned and fixed on the step portion 24a of the support column 24. 45 is a motor provided on the surface plate 23, and the rotating shaft 45a of the motor 45 is connected to the lower plate 4.
It protrudes upward from the hole 44a of No. 4, and a rotary table 46 is attached to its tip. Further, the center of rotation of the rotary table 46 is arranged eccentrically from the center of rotation of the transmission shaft 29. 8 and 13 on the rotary table 46.
As shown in the figure, a plurality of saucers 4 are provided as evaporation sources.
7, 48 (two types in the example) are stacked,
When the rotary table 46 is rotated and the saucer 47 or 48 is positioned at a predetermined position, the position is directly below the transmission shaft 29 as shown in FIG. Therefore, as shown by the dashed line in FIG. 8, the incident angle α for each sample (crystal piece 2) is
are at equal angles from the transmission axis, that is, the saucers containing the metal to be deposited are positioned at the same position with respect to each sample. The saucers 47 and 48 are made of tungsten, molybdenum, etc.
7 contains chromium 49 as a metal substance, and the other saucer 48 contains gold 50. Therefore, two layers of chromium 49 and gold 50 are deposited on the surface of the crystal blank 2 in this embodiment. Reference numeral 51 denotes an electrode, and the electrode 51 is provided to be movable up and down, and when the rotary table 46 rotates and is positioned at a predetermined position, it rises and energizes a predetermined saucer.
This evaporates metal such as chromium 49 in the saucer. 52 is a solenoid plunger for raising or lowering the electrode 51, and the electrode 51 is moved up and down by the reciprocating motion of a plunger 53 provided on the solenoid plunger 52. That is, a cam surface 53a is provided at the tip of the plunger 53, and the cam surface 53a presses the pin 51a provided on the electrode 51. Reference numeral 54 denotes a movable member that engages with the locking piece 34 provided on the first vapor deposit shielding plate 31 to rotate the first vapor deposit shielding plate 31 against the elasticity of the coil spring 37; 54 is movable by a solenoid plunger 55 provided on the lower surface of the lower plate 44. In addition,
56... are lead wires connected to the detection pieces 43... 57 is a removable cover.

Next, to explain the operation of the present invention, first, the cover 57 is removed, the sample is attached to the attachment parts 40a to 40f of the sample attachment member 39, and the metal for evaporation is placed on the saucers 47 and 48 on the rotary table 46. A hole 32a is formed in the first vapor deposit shielding plate 31 by storing chromium 49 and gold 50 in respective trays 47 and 48 and moving the movable member 54.
32f correspond to the holes 36a to 36f provided in the second vapor deposit shielding plate 35 as shown in FIG. 14, and the motor 27 is slightly rotated.
Each of the holes 32a to 32f is positioned at a position corresponding to the sample attached to the attachment parts 40a to 40f. In addition, the rotary table 46 is also rotated so that the chrome 49
The tray 47 containing the evaporation chamber is set so as to be positioned directly below the transmission shaft 29, and then the cover 57 is placed on the chamber to evacuate the inside of the vacuum evaporation chamber. and,
By operating the solenoid plunger 52, the electrode 5
1 is raised and the saucer 47 is energized, chromium 4
9 evaporates, holes 32a to 32f (36a to 36f)
Each sample (each crystal piece 2) is simultaneously metal-deposited (chromium-deposited) through the hole 21 of the mask 20 provided in each sample. When the specified amount of chromium deposition is completed,
The solenoid plunger 52 is operated again to lower the electrode 51. Then, the motor 45 is rotated, the rotary table 46 is rotated half a turn, this time the saucer 48 containing the gold 50 is set so as to be positioned directly below the transmission shaft 29, the electrode 51 is raised again, and the saucer is set. When 48 is energized, the gold 5 in the saucer 48
0 evaporates and more gold is deposited on top of the chromium deposit on each sample. After the entire vapor deposition is completed, although not particularly shown, the mounting parts 40a to 40f are rotated half a turn, or the vacuum state is once released, the cover 57 is removed, the sample is rotated half a turn, and then mounted again. The cover 57 is put on to create a vacuum state, and the rotary table 46 is rotated half a turn again to set the tray 47 containing the chromium 49 directly below the transmission shaft 29, and as before, first chromium vapor deposition is performed. Next, the rotary table 46 is turned half a turn to perform gold vapor deposition, so that the basic vapor deposition is completed so that each of the stored samples becomes the excitation electrodes 3, 3 at the same time. The saucers 47 and 48 containing the metal to be evaporated are always positioned directly below the transmission shaft 29 so that the evaporation source (the saucer) and each sample are at the same position. It is possible to prevent uneven deposition when metal is deposited on a layer.

Next, frequency adjustment after basic plating on both sides of the sample (crystal blank 2) will be explained. First, when the basic plating is completed, the movable member 54 is moved by the solenoid plunger 55, and the first deposit shielding plate 31 is slightly rotated against the elasticity of the coil spring 37. Adjustment hole 3 provided
3 is a second deposit shielding plate 3 as shown in FIG.
5, for example, 36f.
Therefore, the other holes 36a to 36e provided in the second vapor deposit shielding plate 35 are closed by the first vapor deposit shielding plate 31, and the first vapor deposit shielding plate 31
The holes 32a to 32f provided in are closed by the second vapor deposit shielding plate 35. Therefore, only the adjustment hole 33 (36f) is opened in both the deposit shielding plates 31 and 35, and the frequency adjustment is performed by sequentially corresponding to each sample with this adjustment hole 33. .

That is, first, the adjustment hole 33 is made to correspond to the sample attached to the attachment part 40f, and then the rotary table 46
The saucer 48 housed in the gold 50 is energized, and the gold 50 is energized.
When a small amount of gold is evaporated, the gold passes through the adjustment hole 33 and the hole 21 of the mask 20 and is deposited on the base plating (excitation electrode). At this time, the excitation electrode of the crystal piece 2 is led out from the holding members 7, 7 and the lead-out terminals 6, 6 via the detection piece 43 to a lead wire 56, and the lead wire 56 is connected to an oscillation circuit (not shown). Using the signal from the oscillation circuit and a separate signal from an oscillator that oscillates the reference frequency f ₀ , fine adjustments are made several times as in the conventional example, and the zero beat is detected to complete the adjustment of one sample. let After completing the adjustment of one sample, rotate the motor 27 by a predetermined amount, and
Rotating the two vapor deposition shielding plates 31 and 35 at the same time,
The adjustment hole 33 is made to correspond to the next sample, and the same adjustment as described above is performed. Then, by rotating the motor 27 approximately once, frequency adjustment for all samples is completed. After finishing, release the vacuum state and close the cover 57.
When the crystal blank 2 is removed and each sample is removed, a crystal piece 2 with excitation electrodes 3 and frequency adjustment completed will be created.

In addition, six holes 32a to 32f, 36a to 36f are provided in both the deposit shielding plates 31 and 35, and
The sample mounting member 39 has six mounting parts 40a to 40.
f is provided, but the number is not necessarily limited to six, and the number is arbitrary in terms of design.

In addition, two saucers 4 are placed on the rotary table 46.
Although 7 and 48 types are stacked, the number is not necessarily limited to two, and by stacking 3, 4 to 10 types, it is possible to deposit 2 to 10 layers or more.

Further, the adjustment hole 33 is connected to the first vapor deposit shielding plate 31.
However, on the contrary, it may be provided on the second vapor deposit shielding plate 35.

As described above in detail, according to the present invention, two deposit shielding plates 3 are provided in the vacuum deposition chamber 22.
1, 35 as crystal piece 2 and evaporation source (saucers 47, 48)
The two vapor deposition shielding plates each have a plurality of holes 32a to 32 at corresponding positions.
f and 36a to 36f are provided, and one adjustment hole 33 is provided in one of the two deposit shielding plates in addition to the hole, and each hole except the adjustment hole is made to correspond to each other during base plating, Although it is possible to deposit metal on each crystal piece at the same time, when adjusting the frequency, the facing of each hole is released, and the adjustment hole corresponds to one of the holes provided in the other vapor deposition shielding plate, and the metal deposition for frequency adjustment is sequentially performed. As a result, the basic vapor deposition process (excitation electrode) on the crystal blank and the frequency adjustment process can be performed continuously in the same vacuum deposition chamber, improving work efficiency and making it possible to easily move the crystal blank in and out. Because less is required, there is no damage to the crystal piece.
Furthermore, if the sample attachment parts 40a to 40f can be automatically rotated in half, the vacuum state will not be destroyed in the basic vapor deposition process and the frequency adjustment process, and the work will be simplified and the crystal resonator can be provided at low cost. There are other effects.

[Brief explanation of drawings]

Figure 1 is a front view of the crystal resonator 1, Figures 2 to 6
The figure shows a conventional example of frequency adjustment, Figure 2 shows the first tray 8, Figure A is a front view, Figure B is a side view,
Figure 3 shows the second tray 8', Figure A is a front view;
Figure B is a side view, Figure 4 is a front view of the adjustment device, Figure 5 is a front view of the adjustment device,
The figure is a plan view of the same, FIG. 6 is a plan view of an adjusting device of other shapes, and FIGS. 7 to 15 show embodiments of the present invention.
Figure 7 is a front view of the sample, Figure 8 is the vacuum deposition chamber 22.
FIG. 9 is a partially sectional side view of the first vapor deposit shielding plate 3.
1, and FIG. 10 is a plan view of the second vapor deposit shielding plate 35.
11 is a plan view of the sample attachment member 39, FIG. 12 is a partially sectional side view showing a state in which a sample is attached to the attachment part 40a, FIG. 13 is a plan view of the rotary table 46, and FIG. 15 is a plan view of the deposit shielding plates 31, 35 showing the basic vapor deposition state, and FIG. 15 is a plan view of the deposit shielding plates 31, 35 showing the frequency adjustment state. DESCRIPTION OF SYMBOLS 1...Crystal resonator, 2...Crystal piece, 3, 3...Excitation electrode, 22...Vacuum deposition chamber, 31...Deposit shielding plate, 3
2a to 32f...hole, 33...adjustment hole, 35...evaporation shielding plate, 36a to 36f...hole, 39...sample mounting member, 40a to 40f...attachment part, 46...rotary table, 47, 48...receptacle (evaporation source).

Claims (1)

[Scope of Claims] 1. A plurality of crystal pieces are housed in a vacuum deposition chamber, a basic vapor deposition of a metal to be an excitation electrode is simultaneously applied to the plurality of crystal pieces, and then, a basic vapor deposition is applied to each crystal piece one by one. In a vacuum evaporation device for crystal oscillators that allows for sequential frequency adjustment, there are two
Two vapor deposition shielding plates are rotatably provided between the crystal piece and the evaporation source, and each of the two vapor deposition shielding plates is provided with a plurality of holes at corresponding positions.
One adjustment hole is provided in one of the two evaporation material shielding plates in addition to the above-mentioned hole, and during basic evaporation, each hole except the adjustment hole is made to correspond to each other, so that metal evaporation can be performed on each crystal piece at the same time. However, when adjusting the frequency, the opposed holes are released, and the adjustment hole corresponds to one of the holes provided in the other vapor deposition shielding plate, thereby making it possible to sequentially perform metal vapor deposition for frequency adjustment. Vacuum deposition equipment for vibrators. 2. The vacuum evaporation apparatus for a crystal oscillator according to claim 1, wherein the two evaporated material shielding plates do not rotate during basic evaporation but can rotate only during frequency adjustment. 3. The vacuum evaporation apparatus for a crystal resonator according to claim 1, wherein the two evaporated material shielding plates are frictionally coupled.