JPH02123760A - Manufacture of chip type semiconductor device - Google Patents
Manufacture of chip type semiconductor deviceInfo
- Publication number
- JPH02123760A JPH02123760A JP63278378A JP27837888A JPH02123760A JP H02123760 A JPH02123760 A JP H02123760A JP 63278378 A JP63278378 A JP 63278378A JP 27837888 A JP27837888 A JP 27837888A JP H02123760 A JPH02123760 A JP H02123760A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- lead frame
- type semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はり〜ドフレーム上に半導体基体を接続して樹脂
封止したチップ型半導体装置の製造方法に関するもので
特にパッケージ部より外側に露出しているリード部の樹
脂バリを容易に除去することの可能な製造法を提供する
ものである。第１図（ａ）、（ｂ）はこの種のチップ型
半導体装置の構造図で図中１は樹脂モールド部（パッケ
ージ部）２ａは、リード部で大々リード部の一部を折曲
げ所謂面実装用として供されている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a chip type semiconductor device in which a semiconductor substrate is connected to a beam frame and sealed with resin. The purpose of the present invention is to provide a manufacturing method that allows easy removal of. FIGS. 1(a) and 1(b) are structural diagrams of this type of chip-type semiconductor device. In the figure, 1 is a resin molded part (package part) 2a is a lead part with a part of the lead part bent. It is provided for surface mounting.
係るチップ型半導体装置は、第２図に示す様に、半導体
基体の組ｙか終了したリードフレーム２のノード部２ａ
を樹脂封止を行い、点線Ｂ、Ｂ′に沿って切断すること
により個々の装置を製造する所で樹脂封止を？テなう時
に使用するモールド金型とリードフレームの関係により
、リードフレーム及びリード部の一部分に不必要な樹脂
バリが発生する。このため従来あらたにバリ取工程を設
けて例えばバリのみを打抜き或いはデフラッシャ等によ
り除く方法が用いられているがこれでは工程が増加して
コストアップになることと、完全に樹脂バリを除去する
ことが出来ない。又、リード部を折り曲げ加工を行ない
完成品となるが、樹脂バリの残っている部分が、基板実
装時に半田付は不良となる欠点があった。Such a chip type semiconductor device, as shown in FIG.
Resin sealing is performed at a place where individual devices are manufactured by resin sealing and cutting along dotted lines B and B'. Due to the relationship between the molding die and the lead frame used during the process, unnecessary resin burrs are generated on the lead frame and a portion of the lead portion. For this reason, conventional methods have been used to add a burr removal process and remove only the burr, for example, by punching or using a deflasher, but this increases the number of steps and costs, and it is difficult to completely remove the resin burr. I can't. Furthermore, although the lead portion is bent to form a finished product, there is a drawback that the resin burr remains on the part, resulting in poor soldering when mounted on a board.
本発明は、前述の欠点を解消出来る生産性の高いノード
フレーム形状とし、完成品に樹脂バリの耐着していない
チップ型半導体装置を提供するもので、リードフレーム
のリード部に半導体基体を接続する工程と、前記半導体
基体を樹脂モールドする工程と、前記リードフレームを
切断して個々のチップ型半導体装置を形成する工程を含
み、且つ前記切断時に該リード部の内面を同時に切断す
ることにより前記樹脂モールド時に該リード部に付着し
た樹脂バリを除去するようにしたことを特徴とするもの
である。The present invention provides a chip-type semiconductor device that has a highly productive node frame shape that can eliminate the above-mentioned drawbacks and is free from resin burrs adhering to the finished product, and connects a semiconductor substrate to the lead portion of the lead frame. a step of resin-molding the semiconductor substrate; and a step of cutting the lead frame to form individual chip-type semiconductor devices; The present invention is characterized in that resin burrs attached to the lead portion during resin molding are removed.
第３図は、本発明の詳細な説明図であって、２はリード
フレーム、１はパッケージ（樹脂部）、３はランナ−１
４はゲート、５は樹脂バリである。本装置を製造するに
は、リードフレーム２に半導体基体を組み込んだ後、専
用の封止金型（図示しない）をもちいて、ランナー３か
らゲート４の順に封止樹脂を注入して、所定のパッケー
ジ１に樹脂成形を行なう。不要部分のランナー３とゲト
４は成形直後に分離して除却する。一方ｖＩ４脂封止さ
れたものは、封止金型とリードフレーム２のクリアラン
スの関係により、リード部にγＧって不必要な樹脂バリ
５が発生する。そこで本発明では樹脂バリ５を除去する
ために、リードフレーム及びリード部の内面を切断して
樹脂バリ５を分離、除去する。リードフレーム２のリー
ド部には、予めパッケージ１の外側に露出する部分に段
差部２ｂが設けである。これは、切断時にパッケージ１
と切断金型が接触しない為であり、パッケージ１と段差
部２ｂの寸法Ｓは０．１ｍｍ以上あれば良い＋１［が確
認されている。そして段差部に沿ってリドフレーム及び
リード部の内面Ｃを切断し、更に点線Ｂ、Ｂ′に沿って
切断することにより、個々の製品とし、二１−ザーの要
求に応じて端子２ａを成形して、製品（第１図）を完成
する。なお端子２ａ部分は、前述した様にパッケージ１
がら露出した：３而面板厚面を除く）が、樹脂封止後に
切断されるため、次工程のメツキ工程等で端子２ａの全
面に表面処理が施されるため、基板実装時の半田付は不
良が激減され、強度も向上するので信頼性の高いチップ
型半導体装置が提供出来る。FIG. 3 is a detailed explanatory diagram of the present invention, in which 2 is a lead frame, 1 is a package (resin part), and 3 is a runner 1.
4 is a gate, and 5 is a resin burr. To manufacture this device, after the semiconductor substrate is assembled into the lead frame 2, a special sealing mold (not shown) is used to inject sealing resin from the runner 3 to the gate 4 in order. Package 1 is molded with resin. The unnecessary portions of the runner 3 and the gate 4 are separated and discarded immediately after molding. On the other hand, in the case of vI4 resin sealed, unnecessary resin burrs 5 due to γG are generated on the lead portion due to the clearance relationship between the sealing mold and the lead frame 2. Therefore, in the present invention, in order to remove the resin burr 5, the inner surfaces of the lead frame and the lead portion are cut to separate and remove the resin burr 5. The lead portion of the lead frame 2 is provided with a stepped portion 2b in advance at a portion exposed to the outside of the package 1. This means that package 1 when cutting
This is because the cutting die does not come into contact with the package 1, and it has been confirmed that the dimension S of the package 1 and the stepped portion 2b should be 0.1 mm or more. Then, the inner surface C of the lid frame and lead portion is cut along the stepped portion, and further cut along the dotted lines B and B' to produce individual products, and the terminal 2a is formed according to the user's request. Then, the product (Fig. 1) is completed. Note that the terminal 2a part is connected to package 1 as mentioned above.
Since the exposed surface (excluding the thick side of the board) is cut after resin sealing, the entire surface of the terminal 2a is subjected to surface treatment in the plating process, etc. in the next process, so soldering during board mounting is difficult. Since the number of defects is drastically reduced and the strength is improved, a highly reliable chip type semiconductor device can be provided.
以上、説明した様に本発明によれば、リードフレムをも
ちいて樹脂封止した時に発生する不必要な樹脂バリをあ
らたにバリ取り工程を設けることなくリードフレームの
切断時に容易に除去でき、生産性の高いチップ型半導体
装置を提供でき、実用上の効果は大なるものである。As described above, according to the present invention, unnecessary resin burrs that occur when a lead frame is used for resin sealing can be easily removed when cutting the lead frame without requiring a new deburring process. It is possible to provide a chip type semiconductor device with high performance, and the practical effect is great.
第１図チップ型半導体装置の構造図、第２図は従来の製
造法の説明図、第３図は本発明の実施例を示す説明図で
ある。図中１は樹脂モールド（バッテ
ジ）部、
は
ノ
ドフレ
ム、
はそのリ
ド部及び段差部、
３はランナ
は
ゲ
ト
５は樹脂バリである。FIG. 1 is a structural diagram of a chip type semiconductor device, FIG. 2 is an explanatory diagram of a conventional manufacturing method, and FIG. 3 is an explanatory diagram showing an embodiment of the present invention. In the figure, 1 is a resin mold (batch) part, is a throat frame, is a lid part and a stepped part, 3 is a runner, and gate 5 is a resin burr.
Claims (2)
る工程と、前記半導体基体を樹 脂モールドする工程と、前記リードフレ ームを切断して個々のチップ型半導体装 置を形成する工程を含み、且つ前記切断 時に該リード部の内面を同時に切断する ことにより前記樹脂モールド時に該リー ド部に付着した樹脂バリを除去するよう にしたことを特徴とするチップ型半導体 装置の製造方法。(1) A step of connecting a semiconductor substrate to a lead portion of a lead frame, a step of resin molding the semiconductor substrate, and a step of cutting the lead frame to form individual chip-type semiconductor devices; 1. A method for manufacturing a chip-type semiconductor device, characterized in that resin burrs attached to the lead portion during the resin molding are removed by cutting the inner surface of the lead portion at the same time.
ド部内面を切断するようにした ことを特徴とする特許請求の範囲第（１ ）項記載のチップ型半導体装置の製造方 法。(2) A method for manufacturing a chip-type semiconductor device according to claim (1), characterized in that a stepped portion is provided in the lead portion and the inner surface of the lead portion is cut along the stepped portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63278378A JPH02123760A (en) | 1988-11-02 | 1988-11-02 | Manufacture of chip type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63278378A JPH02123760A (en) | 1988-11-02 | 1988-11-02 | Manufacture of chip type semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02123760A true JPH02123760A (en) | 1990-05-11 |
Family
ID=17596503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63278378A Pending JPH02123760A (en) | 1988-11-02 | 1988-11-02 | Manufacture of chip type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02123760A (en) |
-
1988
- 1988-11-02 JP JP63278378A patent/JPH02123760A/en active Pending
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