JPH02123791A - Fixture for part - Google Patents

Abstract

PURPOSE:To attain lightening, thinning and shortening by installing a casing part onto solder attached onto a plurality of independent conductive patterns formed onto the part mounting surface of a printed board. CONSTITUTION:Solder is bonded with a plurality of independent conductive patterns 1c shaped onto the part mounting surface of a board 1 in constant height, and casing parts 2 are set up onto the solder 1d. Consequently, clearances among the casing parts 2 fitted to the printed board and the part mounting surface of the printed board 1 can be held by solder 1d attached onto the independent conductive patterns 1c. Accordingly, the casing parts can be sustained in height lower than legs formed to the casing parts, thus attaining the lightening, thinning and shortening of an electronic equipment while eliminating the need for a tape and a sheet for preventing a short circuit, then reducing cost and mandays.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is directed to the application of a casing component (
Component mounting (hereinafter referred to as "components") in a manner that prevents short-circuiting with the copper foil pattern is related to the device.

Conventional technology When a component is mounted on a copper foil pattern on the surface of a printed circuit board of an electronic device, there is an electrode part or metal surface on the surface of the component, and it is necessary to prevent that part from shorting to the copper foil pattern on the surface of the printed circuit board. It is necessary to

Resist ink is usually applied to the surface of a printed circuit board containing a copper foil pattern to prevent insulation, but if a component comes into close contact with the surface of the copper foil pattern, the resist ink may peel off, resulting in a short circuit. There was a case. In addition, in the case of a double-sided through-hole printed circuit board, the solder is sucked into the through-hole from the back side to the front side and swells up, and this swelled solder often short-circuits with the component. In particular, when attaching a casing component with a large surface area like a tuner to the surface of a printed circuit board, there are many @ foil patterns passing through the surface of the printed circuit board, and if the tuner's body is made of metal, Some kind of short-circuit prevention measure is required.

FIG. 3 is a side view showing an example of a conventional example. In Fig. 3, 1 is a printed circuit board, on which a copper foil pattern 1a is placed.
A resist ink is applied to the surface of the printed circuit board 1 including the copper foil pattern 1a, and a short-circuit prevention tape or sheet 3 is interposed between the printed circuit board 1 and the component 2. Note that 1f is solder that has swelled up at the through-hole portion.

FIG. 4 is a side view showing another example of the conventional example.

In Fig. 4, 4 is the tuner body, l! 14a are provided, and the tuner main body 4 is attached to the printed circuit board 1 in a floating state via the legs 4a. At this time, a space 5 is formed between the tuner body 4 and the fl foil pattern 1a on the printed circuit board 1.

Problems to be Solved by the Invention In electronic devices that aim to be lighter, thinner, and smaller, when a component such as a tuner is attached to a printed circuit board, it is possible to attach legs to the tuner so that it floats above the printed circuit board, thereby reducing the volume occupied by the tuner within the electronic device. is becoming larger, and electrons are becoming a factor that prevents vessels from becoming lighter, thinner, shorter, and smaller.

Furthermore, if a tape or sheet is used to prevent short circuits, the cost and man-hours will increase accordingly.

The present invention solves the above-mentioned problems, and aims to provide a device that can be made lighter, thinner, shorter, and smaller, and which can be used to attach parts without increasing costs or man-hours.

Means for Solving the Problems In order to solve the above problems, the present invention provides a method for mounting components on a printed circuit board by providing independent four-conductor patterns on the surface and attaching solder to these independent conductive patterns at a constant height. When the casing parts are mounted on the solder and the parts of the printed circuit board are mounted, a gap is created between the surfaces by the solder.

Effect With the above configuration, for example, solder can be applied to independent conductive patterns provided at multiple locations from which resist ink has been removed in a certain area on a printed circuit board, and solder can be applied to protrusions at a substantially constant height from the surface of the copper foil pattern using, for example, reflow soldering. When a casing component such as a tuner is placed on this solder protrusion, the tuner is kept at a constant distance from the printed circuit board surface, allowing it to be lower than the conventional solder leg, and with tape to prevent short circuits. There is no need for a seat or a seat.

Example Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is a perspective view showing the main parts of the device in which parts are attached according to an embodiment of the present invention, and FIG. 2 is a side view of the device in which the same parts are attached.

In FIGS. 1 and 2, 1 is a printed circuit board, and 1a is! Ii4 foil pattern, 1b is resist ink. 1
C is a conductive pattern part formed by peeling off the resist ink 1b, 1d is a solder part where solder is attached to the conductive pattern part 1C by reflow soldering, 1e is a through hole part, 1
f is solder raised at the through-hole portion 1e, and 2 is a casing component such as a tuner to be attached. This part 2 consists of the copper foil pattern surface and the through hole part 1e.
The copper foil pattern 1a on the surface of the printed circuit board 1 is caused by the raised solder 1f and the further raised solder part 1d.
It is held at a constant height from the surface of the printed circuit board 1 without contacting (short circuiting) the printed circuit board 1.

With the above configuration, the component 2 can be held on the printed circuit board at a lower level than the legs provided on conventional components, so it does not interfere with the miniaturization of electronic equipment, and it is also used to prevent short circuits. Since there is no need to use tape or sheets, there is no need to increase costs or man-hours.

Effects of the Invention As described above, according to the present invention, the gap between the casing component to be attached to the printed circuit board and the mounting surface of the printed circuit board can be maintained by the solder attached to the independent conductive pattern. It can be held lower than the legs provided on the component, so it does not interfere with the miniaturization of electronic equipment, and there is no need to use short-circuit prevention tapes or sheets to prevent short-circuits, which reduces costs and man-hours. There will also be no close-ups.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the main parts of the device in which parts are installed according to an embodiment of the present invention, FIG. 2 is a side view of the device in which the same parts are installed, and FIGS. 3 and 4 are side views showing conventional examples, respectively. It is a diagram. 1... Printed circuit board, 1a... Copper foil pattern, 1b
...Resist ink, 1C...Conductive pattern, 1d
...Solder part, 1e...Through hole part, 1f...
・Solder for through-hole part, 2...Casing parts. Agent Yoshihiro MorimotoFigure 4Figure 4

Claims (1)

[Claims] 1. A plurality of independent conductive patterns are provided on the component mounting surface of a printed circuit board on which conductive patterns are formed, solder is applied to these independent conductive patterns, and casing parts and printed circuit board components are mounted so as to be positioned on top of the solder. A component mounting device configured to provide a gap between the mounting surface and the mounting surface using the solder.