JPH021274U - - Google Patents
Info
- Publication number
- JPH021274U JPH021274U JP7727988U JP7727988U JPH021274U JP H021274 U JPH021274 U JP H021274U JP 7727988 U JP7727988 U JP 7727988U JP 7727988 U JP7727988 U JP 7727988U JP H021274 U JPH021274 U JP H021274U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- substrate portion
- vibrator
- explanatory diagram
- resin liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000007598 dipping method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示すコーテイング
装置の全体構成図、第２図は被覆層の一部を切欠
いた状態を示すワークの外観図、第３図はワーク
支持具の構成説明図、第４図は第３図の−断
面図、第５図は反転部の構成説明図、第６図はワ
ークをワーク載置部から反転部に移行させるため
の機構を示す説明図、第７図は反転部の作動状態
を示す作動説明図、第８図は液面センサの構成説
明図、第９図は樹脂液槽の構成説明図、第１０図
はワークの揺動機構の構成説明図、第１１図は第
１０図の要部拡大平面図、第１２図は作用説明図
である。
１：ワーク、１ａ：基板部、１ｂ：リード部、
２：回路部品、３：被覆層、１０：ワーク載置部
、１１：反転部、１２：ワーク支持トレー、１６
：反転台、１７：バイブレータ、３１：樹脂液槽
。
Fig. 1 is an overall configuration diagram of a coating device showing an embodiment of the present invention, Fig. 2 is an external view of a workpiece showing a state in which a part of the coating layer is cut away, and Fig. 3 is an explanatory diagram of the structure of a workpiece support. , FIG. 4 is a cross-sectional view of FIG. 3, FIG. 5 is an explanatory diagram of the configuration of the reversing section, FIG. 6 is an explanatory diagram showing a mechanism for transferring the workpiece from the workpiece placement section to the reversing section, and FIG. Figure 8 is an explanatory diagram showing the operating state of the reversing section, Figure 8 is an explanatory diagram of the configuration of the liquid level sensor, Figure 9 is an explanatory diagram of the configuration of the resin liquid tank, and Figure 10 is an explanatory diagram of the configuration of the workpiece swing mechanism. , FIG. 11 is an enlarged plan view of the main part of FIG. 10, and FIG. 12 is an explanatory diagram of the operation. 1: Workpiece, 1a: Board part, 1b: Lead part,
2: Circuit component, 3: Covering layer, 10: Work placement section, 11: Inversion section, 12: Work support tray, 16
: Inversion table, 17: Vibrator, 31: Resin liquid tank.
Claims (1)
から延在させたリード部とを有する電子部品を、
前記基板部を樹脂液槽にデイツピングすることに
よつて該基板部をそれに搭載した回路部品と共に
樹脂コーテイングするためのものにおいて、前記
電子部品のおける基板部を下方に向けて鉛直状態
に支持する支持部材にバイブレータを装着し、該
電子部品を前記樹脂液槽に浸漬させたときに、該
バイブレータを作動させて、前記電子部品を振動
させるようにしたことを特徴とする電子部品の樹
脂コーテシング装置。 An electronic component having a board part on which various circuit parts are mounted and a lead part extended from the board part,
A support for vertically supporting the substrate portion on which the electronic component is placed, facing downward, in a device for resin coating the substrate portion together with the circuit components mounted thereon by dipping the substrate portion in a resin liquid bath. A resin coating device for an electronic component, characterized in that a vibrator is attached to the member, and when the electronic component is immersed in the resin liquid tank, the vibrator is operated to vibrate the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7727988U JPH021274U (en) | 1988-06-13 | 1988-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7727988U JPH021274U (en) | 1988-06-13 | 1988-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021274U true JPH021274U (en) | 1990-01-08 |
Family
ID=31302275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7727988U Pending JPH021274U (en) | 1988-06-13 | 1988-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021274U (en) |
-
1988
- 1988-06-13 JP JP7727988U patent/JPH021274U/ja active Pending
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