JPH02129287U - - Google Patents
Info
- Publication number
- JPH02129287U JPH02129287U JP3946589U JP3946589U JPH02129287U JP H02129287 U JPH02129287 U JP H02129287U JP 3946589 U JP3946589 U JP 3946589U JP 3946589 U JP3946589 U JP 3946589U JP H02129287 U JPH02129287 U JP H02129287U
- Authority
- JP
- Japan
- Prior art keywords
- coating material
- block
- annular
- attached
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は本考案の一実施例を示す構成図、第2
図は本考案の適用例の説明図、第3図はLSIの
搭載状態の一例を示す斜視図、第4図は従来のコ
ーテイング材塗布装置の説明図である。
図中、1……ノズル、2……基板、3……LS
I、4……端子、5……コーテイング材、20…
…塗布ブロツク、21……環状部、22……コー
テイング材吐出用穴、23……凹部、24……空
気抜き用穴である。
Fig. 1 is a configuration diagram showing one embodiment of the present invention;
FIG. 3 is a perspective view showing an example of an LSI mounted state, and FIG. 4 is an explanatory view of a conventional coating material application device. In the figure, 1...nozzle, 2...substrate, 3...LS
I, 4...terminal, 5...coating material, 20...
... application block, 21 ... annular portion, 22 ... coating material discharge hole, 23 ... recessed portion, 24 ... air vent hole.
Claims (1)
出するノズル1の先端に着脱自在に塗布ブロツク
20を取付け、該ブロツク20の先端面を基板2
に取付けられた電子部品に対し所定距離まで接近
させてコーテイング材を吐出し、該部品の端子部
を被覆するコーテイング材の塗布装置であつて、 該塗布ブロツク20の先端面を該部品の端子部
形状に適合する環状にしてその環状部21には複
数のコーテイング材吐出用穴22を配列し、該環
状部中央には不要部分へのコーテイング材の付着
を阻止する凹部23を形成し、さらに該環状部の
側壁には該凹部23をブロツク外に連通させる空
気抜き用穴24を設けてなることを特徴とするコ
ーテイング材の塗布装置。[Claims for Utility Model Registration] A coating block 20 is removably attached to the tip of the nozzle 1 that discharges the coating material 5 heated and made into a fluid state, and the tip surface of the block 20 is attached to the substrate 2.
This is a coating material applicator for dispensing a coating material close to a predetermined distance to an electronic component attached to the electronic component to cover the terminal portion of the component, the tip surface of the application block 20 being applied to the terminal portion of the component. A plurality of holes 22 for discharging the coating material are arranged in the annular part 21 of the annular shape that fits the shape, and a recess 23 is formed in the center of the annular part to prevent the coating material from adhering to unnecessary parts. A coating material application device characterized in that a side wall of the annular portion is provided with an air vent hole 24 for communicating the recess 23 with the outside of the block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3946589U JPH0621576Y2 (en) | 1989-04-03 | 1989-04-03 | Coating material application device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3946589U JPH0621576Y2 (en) | 1989-04-03 | 1989-04-03 | Coating material application device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02129287U true JPH02129287U (en) | 1990-10-24 |
| JPH0621576Y2 JPH0621576Y2 (en) | 1994-06-08 |
Family
ID=31548397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3946589U Expired - Lifetime JPH0621576Y2 (en) | 1989-04-03 | 1989-04-03 | Coating material application device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621576Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235243A (en) * | 1991-12-11 | 1993-09-10 | Internatl Business Mach Corp <Ibm> | Electronic package assembly and manufacturing method thereof |
-
1989
- 1989-04-03 JP JP3946589U patent/JPH0621576Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235243A (en) * | 1991-12-11 | 1993-09-10 | Internatl Business Mach Corp <Ibm> | Electronic package assembly and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621576Y2 (en) | 1994-06-08 |
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