JPH02102726U - - Google Patents
Info
- Publication number
- JPH02102726U JPH02102726U JP1056889U JP1056889U JPH02102726U JP H02102726 U JPH02102726 U JP H02102726U JP 1056889 U JP1056889 U JP 1056889U JP 1056889 U JP1056889 U JP 1056889U JP H02102726 U JPH02102726 U JP H02102726U
- Authority
- JP
- Japan
- Prior art keywords
- etching
- liquid
- hole
- etching liquid
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Weting (AREA)
Description
第１図は本考案になるエツチング装置の一実施
例を示す側断面図、第２図は本考案になる装置の
動作を説明する側断面図、第３図は従来のエツチ
ング装置の主要部を示す側断面図、である。図に
おいて、
２は液溜部、４は基板、５は基板ホルダ、６は
エツチング液、７は装置本体、８，９はエツチン
グ液噴出孔、をそれぞれ表す。
Fig. 1 is a side sectional view showing an embodiment of the etching apparatus according to the present invention, Fig. 2 is a side sectional view illustrating the operation of the etching apparatus according to the present invention, and Fig. 3 shows the main parts of a conventional etching apparatus. FIG. In the figure, 2 is a liquid reservoir, 4 is a substrate, 5 is a substrate holder, 6 is an etching liquid, 7 is an apparatus main body, and 8 and 9 are etching liquid jet holes, respectively.
Claims (1)
置であつて、上面に開口し開口部が基板４より大
きい円錐形の液溜部２と、第１のエツチング液噴
出孔８と、第２のエツチング液噴出孔９とを具え
てなる装置本体７を有し、 エツチング液を交互に該液溜部２に供給するよ
う構成された、第１のエツチング液噴出孔８が該
液溜部２の中央に配設され、第２のエツチング液
噴出孔９が該液溜部２の周囲に沿つて、配設され
てなることを特徴とする基板エツチング装置。[Claims for Utility Model Registration] An apparatus for etching one main surface of a substrate for a semiconductor device, which comprises: a conical liquid reservoir 2 which is opened at the top surface and whose opening is larger than the substrate 4; and a first etching liquid jet. The apparatus main body 7 includes a hole 8 and a second etching liquid spouting hole 9, and the first etching liquid spouting hole 8 is configured to alternately supply etching liquid to the liquid reservoir 2. A substrate etching apparatus characterized in that a second etching liquid jetting hole 9 is arranged at the center of the liquid reservoir 2 and a second etching liquid jetting hole 9 is arranged along the periphery of the liquid reservoir 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056889U JPH0710494Y2 (en) | 1989-01-31 | 1989-01-31 | Substrate etching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1056889U JPH0710494Y2 (en) | 1989-01-31 | 1989-01-31 | Substrate etching equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02102726U true JPH02102726U (en) | 1990-08-15 |
| JPH0710494Y2 JPH0710494Y2 (en) | 1995-03-08 |
Family
ID=31218346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1056889U Expired - Lifetime JPH0710494Y2 (en) | 1989-01-31 | 1989-01-31 | Substrate etching equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710494Y2 (en) |
-
1989
- 1989-01-31 JP JP1056889U patent/JPH0710494Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710494Y2 (en) | 1995-03-08 |
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