JPH02131202A - Manufacture of optical waveguide - Google Patents

Manufacture of optical waveguide

Info

Publication number
JPH02131202A
JPH02131202A JP28607088A JP28607088A JPH02131202A JP H02131202 A JPH02131202 A JP H02131202A JP 28607088 A JP28607088 A JP 28607088A JP 28607088 A JP28607088 A JP 28607088A JP H02131202 A JPH02131202 A JP H02131202A
Authority
JP
Japan
Prior art keywords
optical waveguide
substrate
pattern
stamper
ultraviolet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28607088A
Other languages
Japanese (ja)
Inventor
Shiro Ogata
司郎 緒方
Hayami Hosokawa
速美 細川
Masanobu Tanigami
昌伸 谷上
Maki Yamashita
山下 牧
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP28607088A priority Critical patent/JPH02131202A/en
Publication of JPH02131202A publication Critical patent/JPH02131202A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13Integrated optical circuits characterised by the manufacturing method
    • G02B6/138Integrated optical circuits characterised by the manufacturing method by using polymerisation

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

PURPOSE:To easily manufacture a ridge type optical waveguide by bringing a stamper which has a pattern recessed corresponding to the optical waveguide into contact with the surface of a substrate, and charging an organic high polymer material in the pattern, curing the material with external energy, then separating the stamper from the surface. CONSTITUTION:The stamper 2 is pressed against the substrate surface 3a and ultraviolet-ray setting resin 4 is charged in the reflection optical waveguide pattern 26. In such a state, the substrate 3 is irradiated with ultraviolet rays UV from the other surface 3b to polymerize and cure the ultraviolet-ray resin 4. The stamper 2 is separated from the substrate 3, then the projecting optical waveguide 5 is formed on the substrate surface 3a. Further, the sectional shape of the pattern 26 is altered to obtain an optional sectional shape of the optical waveguide 5. Consequently, the ridge type optical waveguide 5 is easily manufactured by using the organic high polymer material and the height of the optical waveguide 5 can be varied.

Description

【発明の詳細な説明】 (イ)産業上の利用分野 この発明は、有機高分子材料を用いてリッヂ形先導波路
を製造する方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (a) Industrial Application Field The present invention relates to a method of manufacturing a ridge-shaped guiding waveguide using an organic polymeric material.

(口)従来の技術 有機高分子材料を用いた光導波路は、無機材料を用いた
ものに比べ安価、製作容易である。この有機材料を用い
て、光導波路を製造するのには、第5図に示す方法が知
られている。まず、シリコン(St)等の基板13上に
ポリメタクリル酸メチル(PMMA)よりなるクラッド
層14(例えば厚さ2μm)が形成される〔第5図(a
)参照〕。
(Example) Conventional technology Optical waveguides using organic polymer materials are cheaper and easier to manufacture than those using inorganic materials. A method shown in FIG. 5 is known for manufacturing an optical waveguide using this organic material. First, a cladding layer 14 (for example, 2 μm thick) made of polymethyl methacrylate (PMMA) is formed on a substrate 13 made of silicon (St) or the like [Fig. 5(a)
)reference〕.

このクラッド層14上には、屈折率を高めるためのドー
パントモノマーを含んだPMMAよりなるコア層15(
例えば厚さ3μm)が形成される〔第5図(bl参照〕
On this cladding layer 14 is a core layer 15 (made of PMMA containing a dopant monomer to increase the refractive index).
For example, a thickness of 3 μm) is formed [see Figure 5 (bl)]
.

このコアI!15上には、コアに対応するパターンを有
するホトマスク17が重ねられ、紫外線UVが照射され
る〔第5図(C)参照〕。コア層15の紫外線UVが照
射された部分では、ドーバントモノマーが重合し、周囲
とは屈折率の異なるコア16が形成される。最後に、コ
ア層15内の未反応のドーバントモノマーをベーキング
や溶媒による抽出で取り除く〔第5図(d)参照〕。
This core I! A photomask 17 having a pattern corresponding to the core is superimposed on the photomask 15, and ultraviolet rays are irradiated [see FIG. 5(C)]. In the portion of the core layer 15 irradiated with ultraviolet rays, the dopant monomer is polymerized, and a core 16 having a different refractive index from the surrounding area is formed. Finally, unreacted dopant monomers in the core layer 15 are removed by baking or extraction with a solvent [see FIG. 5(d)].

(ハ)発明が解決しようとする課題 上記従来の製造方法で得られた先導波路では、コア16
と周囲のコア層15との屈折率の差が小さく、コア16
が曲がっている場合などコア壁16aへの光入射角が大
きくなる所では、全反射の条件を満足することができず
(光の閉じ込め力が小さい)、損失が大きくなってしま
う問題点があった。また、コア16の高さ(深さ)hに
変化をつけることが困難であり、モード変換が行いにく
い問題点があった。
(c) Problems to be Solved by the Invention In the leading waveguide obtained by the above conventional manufacturing method, the core 16
The difference in refractive index between the core layer 15 and the surrounding core layer 15 is small, and the core 16
In places where the angle of light incidence on the core wall 16a is large, such as when the core wall 16a is bent, the condition for total internal reflection cannot be satisfied (the light confinement force is small), and there is a problem that the loss increases. Ta. Further, there was a problem in that it was difficult to vary the height (depth) h of the core 16, making it difficult to perform mode conversion.

上記従来の製造方法で得られる光導波路は、コア16が
コア層15内に形成される、いわゆる埋込み形であるが
、コアが基板表面より突出する形の光導波路が、リッヂ
形光導波路として知られている。このリッヂ形の光導波
路では、コアが空気あるいは他の任意の物質に接触させ
ることができるので、コアと周囲との屈折率の差を大き
くとることができる。しかし、このリッヂ形の光導波路
には、上記従来の製造方法は適用できず、製造が比較的
困難である問題点があった。
The optical waveguide obtained by the conventional manufacturing method described above is a so-called buried type optical waveguide in which the core 16 is formed within the core layer 15, but an optical waveguide in which the core protrudes from the substrate surface is known as a ridge type optical waveguide. It is being In this ridge-shaped optical waveguide, since the core can be brought into contact with air or any other substance, a large difference in refractive index between the core and the surroundings can be achieved. However, the conventional manufacturing method described above cannot be applied to this ridge-shaped optical waveguide, and there is a problem in that it is relatively difficult to manufacture.

この発明は、上記に鑑みなされたもので、有機高分子材
料の特性を生かし、容易にリッヂ形光導波路を製造でき
ると共に、光導波路の高さに変化をつけることの容易な
、光導波路の製造方法の桿供を目的としている。
This invention was made in view of the above, and it is possible to easily manufacture a ridge-shaped optical waveguide by taking advantage of the characteristics of organic polymer materials, and also to manufacture an optical waveguide in which the height of the optical waveguide can be easily varied. The purpose is to provide a method.

(二)課題を解決するための手段及び作用上記課題を解
決するため、この発明の光導波路の製造方法は、光導波
路に対応するパターンが凹設されたスタンバを基板表面
に密着させ、このパターン内には有機高分子材料を充填
し、この有機高分子材料を外部エネルギ(例えば、プラ
ズマ、熱、光等)により硬化させた後、前記表面より前
記スタンパを分離し、前記基板表面に光導波路を突出形
成するものである。従って、有機高分子材料によるリッ
ヂ形光導波路を容易に製造できる。
(2) Means and operation for solving the problems In order to solve the above problems, the method for manufacturing an optical waveguide of the present invention includes closely contacting a stand bar having a recessed pattern corresponding to the optical waveguide to the surface of the substrate. The inside is filled with an organic polymer material, and after this organic polymer material is cured by external energy (e.g., plasma, heat, light, etc.), the stamper is separated from the surface, and an optical waveguide is formed on the surface of the substrate. It forms a protrusion. Therefore, a ridge-shaped optical waveguide made of organic polymer material can be easily manufactured.

また、パターンの断面形状を変更することにより、任意
の光導波路の断面形状を得ることができ、光導波路の高
さをかえてモード変換を行うことが容易となる。
Further, by changing the cross-sectional shape of the pattern, it is possible to obtain an arbitrary cross-sectional shape of the optical waveguide, and it becomes easy to perform mode conversion by changing the height of the optical waveguide.

(ホ)実施例 この発明の一実施例を、第1図乃至第4図に基づいて以
下に説明する。
(E) Embodiment An embodiment of the present invention will be described below with reference to FIGS. 1 to 4.

まず、この実施例に適用されるスタンパ2の製造方法を
第2図を参照しながら説明する。まず、シリコン(Si
)等の基板21上に、レジスト層22を形成する〔第2
図(a)参照〕。次に、レジストR22は、電子ビーム
23が照射され、光導波路パターンと同じパターン24
を描画する〔第2図(b)参照〕。この時、電子照射量
を制御することにより、パターン24の高さを調整する
ことができる。
First, a method for manufacturing the stamper 2 applied to this embodiment will be explained with reference to FIG. First, silicon (Si
), etc., a resist layer 22 is formed on a substrate 21 [second
See figure (a)]. Next, the resist R22 is irradiated with an electron beam 23, and a pattern 24 identical to the optical waveguide pattern is formed.
[See Figure 2(b)]. At this time, the height of the pattern 24 can be adjusted by controlling the amount of electron irradiation.

次に、レジスト層22が現像され、基板21表面にパタ
ーン24が残る(第2図(C)参照〕。この基板21に
は、ニンケル(Ni)めっき25が施される〔第2図(
d)参照〕。最後に、基板21が取り除かれ、スタンバ
2が得られる〔第2図(e)参照〕。
Next, the resist layer 22 is developed, leaving a pattern 24 on the surface of the substrate 21 (see FIG. 2(C)).Ni plating 25 is applied to this substrate 21 (see FIG. 2(C)).
d) see]. Finally, the substrate 21 is removed to obtain the stand bar 2 (see FIG. 2(e)).

このスタンバ2は、パターン24により凹状の反転光導
波路パターン26が形成されている。なお、スクンバ2
の作製には、イオンビーム描画法や、ホトマスクを用い
た露光法を適用することができる。
In this standber 2, a concave inverted optical waveguide pattern 26 is formed by a pattern 24. In addition, Sukumba 2
For manufacturing, an ion beam lithography method or an exposure method using a photomask can be applied.

光導波路を製造するには、まず基板3を用意する〔第1
図(a)参照〕。この基板3には、後述のコア5より屈
折率の低い透明材料、例えばポリカーボネイト(PC)
、ポリメタクリル酸メチル(PMMA) 、ガラス板等
が使用できる。
To manufacture an optical waveguide, first prepare the substrate 3 [first
See figure (a)]. This substrate 3 is made of a transparent material having a lower refractive index than the core 5 described later, such as polycarbonate (PC).
, polymethyl methacrylate (PMMA), glass plates, etc. can be used.

基板表面3aには、紫外線硬化樹脂4がコートされる〔
第1図(b)参照〕。このコート方法としては、スピン
コート、ディップコート、キャスト法あるいはロール押
し出し法が適用できる。
The substrate surface 3a is coated with an ultraviolet curing resin 4 [
See Figure 1(b)]. As this coating method, spin coating, dip coating, casting method, or roll extrusion method can be applied.

基板表面3aには、スタンパ2が密着するよう押圧され
〔第1図(C)参照〕。この時、紫外線硬化樹脂4が、
反転光導波路パターン26内に充填される。この状態で
、基板3の他の表面3bより、紫外線UVが照射され、
紫外線硬化樹脂4が重合硬化させられる。
The stamper 2 is pressed so as to be in close contact with the substrate surface 3a [see FIG. 1(C)]. At this time, the ultraviolet curing resin 4
The inverted optical waveguide pattern 26 is filled. In this state, ultraviolet rays are irradiated from the other surface 3b of the substrate 3,
The ultraviolet curing resin 4 is polymerized and cured.

最後に、基板3よりスタンパ2を分離する〔第1図(d
)参照]。基板表面3aには、突出する光導波路部5が
形成されることとなる。この光導波路部5は空気に接し
ているため、光導波路部5内とその周囲との屈折率の差
を大きくとることができる。従って、光導波路部5の曲
がりが大きい場合など、境界面への入射角が大きくなっ
たときでも、光導波路部5からの光の放射が少ない。
Finally, the stamper 2 is separated from the substrate 3 [Fig.
)reference]. A protruding optical waveguide section 5 is formed on the substrate surface 3a. Since this optical waveguide section 5 is in contact with air, it is possible to have a large difference in refractive index between the inside of the optical waveguide section 5 and the surrounding area. Therefore, even when the angle of incidence on the boundary surface becomes large, such as when the optical waveguide section 5 has a large bend, the amount of light emitted from the optical waveguide section 5 is small.

な゛お、基板3に先にスタンパ2を密着させてから、反
転光導波路パターン26に毛管現象により、紫外線硬化
樹脂を充填することも可能である。
Note that it is also possible to first bring the stamper 2 into close contact with the substrate 3 and then fill the inverted optical waveguide pattern 26 with the ultraviolet curing resin by capillary action.

第3図は、導波路部5゜の高さh(及び幅W)が途中で
h1からhz(W+からwz)に変化しモード変換を可
能とした例を示している。この場合には、スタンパ2の
作成時に、前述のように電子照射量を制御して、反転先
導波路パターンの高さを変化させておく。
FIG. 3 shows an example in which the height h (and width W) of the waveguide portion 5° changes from h1 to hz (from W+ to wz) midway, making mode conversion possible. In this case, when creating the stamper 2, the height of the inverted leading waveguide pattern is varied by controlling the amount of electron irradiation as described above.

第4図(a)(b)は、それぞれ光導波路部5の断面形
状の変形例を示している。第4図(a)は、断面形状が
半円形状の光導波路部5Aを示している。この光導波路
部5Aでは、角部がないため伝II!損失を低減できる
利点を有している。第4図(b)は、断面形状が台形状
の光導波路5Bを示している。この光導波路部5Bは、
基板3よりスタンパ2を分離するのが容易である利点を
有している。
FIGS. 4(a) and 4(b) each show a modification of the cross-sectional shape of the optical waveguide portion 5. FIG. FIG. 4(a) shows an optical waveguide section 5A having a semicircular cross-sectional shape. In this optical waveguide section 5A, there is no corner, so transmission II! It has the advantage of reducing losses. FIG. 4(b) shows an optical waveguide 5B having a trapezoidal cross-section. This optical waveguide section 5B is
This has the advantage that it is easier to separate the stamper 2 from the substrate 3.

第4図(C)(d)は、それぞれ他の変形例を示してい
る。第4図(C)は、基板3上にさらにクラッド層6を
形成した例を示している。この場合には、光導波路部5
の作製精度を、クラッド層を設けない場合よりもゆるく
することができる。また、第4図?d)は、基板を不透
明なシリコン板3゛とした例を示している。シリコン板
3゛上には、低ttt失化を図るため、SiO■等より
なるクラッド層7が形成されている。このクラッド層7
上に光導波路部5が形成される。この場合には、シリコ
ン板3゜を通して、紫外線硬化樹脂に紫外線を照射でき
ないので、先導波路パターンに沿った方向から、紫外線
を照射する。
FIGS. 4(C) and 4(d) each show other modified examples. FIG. 4(C) shows an example in which a cladding layer 6 is further formed on the substrate 3. In this case, the optical waveguide section 5
The manufacturing accuracy can be made more relaxed than when no cladding layer is provided. Also, Figure 4? d) shows an example in which the substrate is an opaque silicon plate 3. A cladding layer 7 made of SiO2 or the like is formed on the silicon plate 3' in order to achieve low TTT loss. This cladding layer 7
An optical waveguide section 5 is formed thereon. In this case, since the ultraviolet rays cannot be irradiated onto the ultraviolet curable resin through 3 degrees of the silicon plate, the ultraviolet rays are irradiated from the direction along the leading waveguide pattern.

なお、上記実施例では、外部エネルギにより重合硬化す
る樹脂として、紫外線硬化樹脂を用いているが、熱やプ
ラズマにより重合硬化する樹脂を用いることもできる。
In the above embodiments, an ultraviolet curable resin is used as the resin that is polymerized and cured by external energy, but a resin that is polymerized and cured by heat or plasma may also be used.

(へ)発明の効果 以上説明したように、この発明の光導波路の製造方法は
、光導波路に対応するパターンが凹設されたスタンバを
、基板表面に密着させ、このパターン内には有機高分子
材料を充填し、この有機高分子材料を外部エネルギによ
り硬化させたのち、前記基板表面よりスタンパを分離し
、前記基板表面に光導波路を突出形成するものであるか
ら、リッヂ形光導波路を有機高分子材料により容易に製
造できる利点を有している。また、光導波路の高さを変
化させることができるので、モード変換可能な光導波路
を容易に得ることができる利点を有している。
(f) Effects of the Invention As explained above, in the method for manufacturing an optical waveguide of the present invention, a standber in which a pattern corresponding to the optical waveguide is recessed is brought into close contact with the substrate surface, and in this pattern, an organic polymer is After filling the organic polymer material and hardening the organic polymer material with external energy, the stamper is separated from the substrate surface and the optical waveguide is formed protruding from the substrate surface. It has the advantage of being easily manufactured using molecular materials. Furthermore, since the height of the optical waveguide can be changed, it has the advantage that an optical waveguide capable of mode conversion can be easily obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)、第1図さ)、第1図(C)及び第1図(
d)は、この発明の一実施例に係る光導波路製造工程を
説明する図、第2図(a)、第2図(b)、第2図(C
)、第2図(d)及び第2図(e)は、同実施例に適用
されるスタンパの製造工程を説明する図、第3図は、同
実施例において製造された光導波路の他の例を説明する
斜視図、第4図(a)、第4図(b)、第4図(C)及
び第4図(d)は、同実施例において製造された先導波
路のさらに他の例をそれぞれ説明する図、第5図(a)
、第5図ら)、第5図(C)及び第5図(d)は、従来
の先導波路の製造工程を説明する図である。 2:スタンパ、     3:基板、 4:紫外線硬化樹脂、 5:先導波路、26:反転光導
波路パターン。 第1図(a) 第1図(b) 第1図(d) 第1図(C) 2日 26.反l云f−導冫疋,tギi.パターン第 図(a) 第 図 (a) 第 図(C) 第 図 第 図(b) 第 図 (d) 第 図 (a) 第 図 (C) 第 図(b)
Figure 1(a), Figure 1(a), Figure 1(C) and Figure 1(
d) is a diagram explaining the optical waveguide manufacturing process according to an embodiment of the present invention, FIG. 2(a), FIG. 2(b), and FIG. 2(C).
), FIG. 2(d) and FIG. 2(e) are diagrams explaining the manufacturing process of the stamper applied to the same example, and FIG. 3 is a diagram explaining the manufacturing process of the stamper applied to the same example. The perspective views illustrating the example, FIG. 4(a), FIG. 4(b), FIG. 4(C), and FIG. 4(d) are still other examples of the guiding waveguide manufactured in the same example. Figure 5 (a) is a diagram explaining each of the
, FIG. 5 et al.), FIG. 5(C), and FIG. 5(d) are diagrams explaining the manufacturing process of a conventional leading waveguide. 2: Stamper, 3: Substrate, 4: Ultraviolet curing resin, 5: Guide waveguide, 26: Inverted optical waveguide pattern. Figure 1 (a) Figure 1 (b) Figure 1 (d) Figure 1 (C) 2nd day 26. Anti-lunf-guide, tgii. Pattern figure (a) figure (a) figure (C) figure figure (b) figure (d) figure (a) figure (C) figure (b)

Claims (1)

【特許請求の範囲】[Claims] (1)光導波路に対応するパターンが凹設されたスタン
パを、基板表面に密着させ、このパターン内には有機高
分子材料を充填し、この有機高分子材料を外部エネルギ
により硬化させた後、前記基板表面より前記スタンパを
分離し、前記基板表面に光導波路を突出形成する光導波
路の製造方法。
(1) A stamper having a recessed pattern corresponding to the optical waveguide is brought into close contact with the substrate surface, the pattern is filled with an organic polymer material, and this organic polymer material is cured by external energy, and then A method for manufacturing an optical waveguide, comprising separating the stamper from the surface of the substrate and forming an optical waveguide protruding from the surface of the substrate.
JP28607088A 1988-11-11 1988-11-11 Manufacture of optical waveguide Pending JPH02131202A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28607088A JPH02131202A (en) 1988-11-11 1988-11-11 Manufacture of optical waveguide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28607088A JPH02131202A (en) 1988-11-11 1988-11-11 Manufacture of optical waveguide

Publications (1)

Publication Number Publication Date
JPH02131202A true JPH02131202A (en) 1990-05-21

Family

ID=17699564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28607088A Pending JPH02131202A (en) 1988-11-11 1988-11-11 Manufacture of optical waveguide

Country Status (1)

Country Link
JP (1) JPH02131202A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994014093A1 (en) * 1992-12-07 1994-06-23 Robert Bosch Gmbh Method of producing a cover for an integrated optical circuit, and the cover thus produced
WO1994016348A1 (en) * 1993-01-13 1994-07-21 Robert Bosch Gmbh Process for producing a hybrid integrated optical circuit and device for emitting light waves
JP2002174732A (en) * 2000-12-07 2002-06-21 Mark:Kk Light guide plate, display device and electronic device using the same, and method of manufacturing light guide plate
WO2004027472A1 (en) 2002-09-20 2004-04-01 Toppan Printing Co., Ltd. Optical waveguide and method for manufacturing same
EP1298462A3 (en) * 2001-09-28 2004-06-16 Omron Corporation Optical wave guide and method for producing the same
US7155103B2 (en) 2001-09-28 2006-12-26 Omron Corporation Optical wave guide and method for producing the same
US7181121B2 (en) 2003-05-23 2007-02-20 Sanyo Electric Co., Ltd. Optical device and method for manufacturing the same
JP2007250654A (en) * 2006-03-14 2007-09-27 Seiko Electric Co Ltd Manufacturing method of solid dye laser
JP2008059001A (en) * 2002-09-20 2008-03-13 Toppan Printing Co Ltd Manufacturing method of optical waveguide
EP1777560A3 (en) * 2002-07-02 2008-08-27 Omron Corporation Optical waveguide device, manufacturing method thereof, and optical communication apparatus
JP2008261957A (en) * 2007-04-10 2008-10-30 Nippon Telegr & Teleph Corp <Ntt> Planar lightwave circuit
US7455971B2 (en) 1998-06-24 2008-11-25 Illumina, Inc. Multiplex decoding of array sensors with microspheres
US7604758B2 (en) 2003-12-19 2009-10-20 Fuji Xerox Co., Ltd. Process for producing polymer optical waveguide
WO2014038474A1 (en) 2012-09-07 2014-03-13 日東電工株式会社 Method for manufacturing polymer optical waveguide

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Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5666446A (en) * 1992-12-07 1997-09-09 Robert Bosch Gmbh Method for producing a cover for an integrated optical circuit and cover for an integrated optical circuit
WO1994014093A1 (en) * 1992-12-07 1994-06-23 Robert Bosch Gmbh Method of producing a cover for an integrated optical circuit, and the cover thus produced
WO1994016348A1 (en) * 1993-01-13 1994-07-21 Robert Bosch Gmbh Process for producing a hybrid integrated optical circuit and device for emitting light waves
US9399795B2 (en) 1998-06-24 2016-07-26 Illumina, Inc. Multiplex decoding of array sensors with microspheres
US7455971B2 (en) 1998-06-24 2008-11-25 Illumina, Inc. Multiplex decoding of array sensors with microspheres
JP2002174732A (en) * 2000-12-07 2002-06-21 Mark:Kk Light guide plate, display device and electronic device using the same, and method of manufacturing light guide plate
EP1298462A3 (en) * 2001-09-28 2004-06-16 Omron Corporation Optical wave guide and method for producing the same
US7155103B2 (en) 2001-09-28 2006-12-26 Omron Corporation Optical wave guide and method for producing the same
EP1777560A3 (en) * 2002-07-02 2008-08-27 Omron Corporation Optical waveguide device, manufacturing method thereof, and optical communication apparatus
WO2004027472A1 (en) 2002-09-20 2004-04-01 Toppan Printing Co., Ltd. Optical waveguide and method for manufacturing same
US7289713B2 (en) 2002-09-20 2007-10-30 Toppan Printing Co., Ltd. Optical waveguide and method of manufacturing the same
JP2008059001A (en) * 2002-09-20 2008-03-13 Toppan Printing Co Ltd Manufacturing method of optical waveguide
EP1542045A4 (en) * 2002-09-20 2009-12-02 Toppan Printing Co Ltd OPTICAL WAVEGUIDE AND METHOD FOR MANUFACTURING THE SAME
US7050691B2 (en) 2002-09-20 2006-05-23 Toppan Printing Co., Ltd. Optical waveguide and method of manufacturing the same
US7181121B2 (en) 2003-05-23 2007-02-20 Sanyo Electric Co., Ltd. Optical device and method for manufacturing the same
US7604758B2 (en) 2003-12-19 2009-10-20 Fuji Xerox Co., Ltd. Process for producing polymer optical waveguide
JP2007250654A (en) * 2006-03-14 2007-09-27 Seiko Electric Co Ltd Manufacturing method of solid dye laser
JP2008261957A (en) * 2007-04-10 2008-10-30 Nippon Telegr & Teleph Corp <Ntt> Planar lightwave circuit
WO2014038474A1 (en) 2012-09-07 2014-03-13 日東電工株式会社 Method for manufacturing polymer optical waveguide

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