JPH02131348U - - Google Patents
Info
- Publication number
- JPH02131348U JPH02131348U JP1989039272U JP3927289U JPH02131348U JP H02131348 U JPH02131348 U JP H02131348U JP 1989039272 U JP1989039272 U JP 1989039272U JP 3927289 U JP3927289 U JP 3927289U JP H02131348 U JPH02131348 U JP H02131348U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- mounting structure
- protruding electrode
- sealing resin
- covers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
- H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989039272U JPH02131348U (cs) | 1989-04-04 | 1989-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989039272U JPH02131348U (cs) | 1989-04-04 | 1989-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02131348U true JPH02131348U (cs) | 1990-10-31 |
Family
ID=31548037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989039272U Pending JPH02131348U (cs) | 1989-04-04 | 1989-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02131348U (cs) |
-
1989
- 1989-04-04 JP JP1989039272U patent/JPH02131348U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH02131348U (cs) | ||
| JPS61182036U (cs) | ||
| JPS6219754U (cs) | ||
| JPH0369232U (cs) | ||
| JPS605125U (ja) | 半導体装置組み立て用ヒ−タブロツク | |
| JPS6134733U (ja) | 半導体ウエハ | |
| JPS62163963U (cs) | ||
| JPS6315052U (cs) | ||
| JPH0226261U (cs) | ||
| JPS614437U (ja) | 半導体装置用リ−ドフレ−ム | |
| JPS6258048U (cs) | ||
| JPS61111160U (cs) | ||
| JPS6139978U (ja) | 電装部品の防水装置 | |
| JPH0316350U (cs) | ||
| JPS6310566U (cs) | ||
| JPS6329954U (cs) | ||
| JPS6234419U (cs) | ||
| JPS6117689U (ja) | 時計ケ−ス | |
| JPS6159355U (cs) | ||
| JPH02101544U (cs) | ||
| JPS6172857U (cs) | ||
| JPH024235U (cs) | ||
| JPH0286144U (cs) | ||
| JPS6268231U (cs) | ||
| JPH0463678U (cs) |