JPH02131348U - - Google Patents

Info

Publication number
JPH02131348U
JPH02131348U JP1989039272U JP3927289U JPH02131348U JP H02131348 U JPH02131348 U JP H02131348U JP 1989039272 U JP1989039272 U JP 1989039272U JP 3927289 U JP3927289 U JP 3927289U JP H02131348 U JPH02131348 U JP H02131348U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting structure
protruding electrode
sealing resin
covers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989039272U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989039272U priority Critical patent/JPH02131348U/ja
Publication of JPH02131348U publication Critical patent/JPH02131348U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例における半導体
装置の実装構造を示す断面図、第２図は本考案の
第２の実施例における半導体装置の実装構造を示
す断面図、第３図ａ，ｂは本考案の第１の実施例
における半導体装置の実装構造の製造方法を工程
順に示す断面図、第４図は本考案の第２の実施例
における半導体装置の実装構造の製造方法を示す
断面図、第５図は従来例における半導体装置の実
装構造を説明するための断面図である。 １……半導体装置、２……突起電極、３……封
止樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体装置の入出力端子である接続電極上に設
    ける突起電極と、該突起電極の頂部が露出するよ
    う該半導体装置を覆う封止樹脂とを備えることを
    特徴とする半導体装置の実装構造。
JP1989039272U 1989-04-04 1989-04-04 Pending JPH02131348U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989039272U JPH02131348U (ja) 1989-04-04 1989-04-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989039272U JPH02131348U (ja) 1989-04-04 1989-04-04

Publications (1)

Publication Number Publication Date
JPH02131348U true JPH02131348U (ja) 1990-10-31

Family

ID=31548037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989039272U Pending JPH02131348U (ja) 1989-04-04 1989-04-04

Country Status (1)

Country Link
JP (1) JPH02131348U (ja)

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