JPH02132896A - Component mounting method - Google Patents

Component mounting method

Info

Publication number
JPH02132896A
JPH02132896A JP63286946A JP28694688A JPH02132896A JP H02132896 A JPH02132896 A JP H02132896A JP 63286946 A JP63286946 A JP 63286946A JP 28694688 A JP28694688 A JP 28694688A JP H02132896 A JPH02132896 A JP H02132896A
Authority
JP
Japan
Prior art keywords
mounting
board
component
components
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63286946A
Other languages
Japanese (ja)
Inventor
Toshio Nakagawa
中川 敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP63286946A priority Critical patent/JPH02132896A/en
Publication of JPH02132896A publication Critical patent/JPH02132896A/en
Pending legal-status Critical Current

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  • Automatic Assembly (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To improve work efficiency in mounting of components by a method wherein a mounting sequence of the components is alternatively, and inversely changed by each board. CONSTITUTION:A movable support table 31 advances from right to left as moving and stopping intermittently in accordance with a mounting sequence. The tenth component feeding unit 32 reaches to a component mounting station 46 and components are mounted on a unit board 12a. A mounting operation for the next board 12b starts from the tenth mounting position and takes place in a reverse sequence, the support table 31 returns to a starting point as moving rightward and stopping intermittently from the position that it makes the 10th unit 32 stopped at the station 41. A mounting operation for the board 12b whose last mounting position is No.1 is finished and a mounting operation for a substrate 12c starts from a mounting position 1. A mounting operation follows as its mounting sequence is alternately and inversely changed by each board, so that time lost due to the waiting for return can be eliminated and consequently a mounting operation is shortened in time and improved in work efficiency.

Description

【発明の詳細な説明】 ω 産業上の利用分野 本允明は、1枚の基板に多数の部品を装着する方法に関
し、電子回路基板組立工程等に応用i」能である。
[Detailed Description of the Invention] ω Industrial Field of Application This invention relates to a method for mounting a large number of components on one board, and can be applied to electronic circuit board assembly processes, etc.

(ロ)従来の技術 1枚の基板に多数の部品を装着するといった作業の典型
例は電子回路基板組立ラインに見ることができる。部品
サイズは小型化する傾同にあり、これと比例するように
部品実装密度が高まっているため、現在では殆どの部品
装着が専用の自動機によクて行われている。さて、かか
る自動機にあっては、多種類の部品を的確なタイミング
で供給するため、可動支持台上に複数個の部晶供給ユニ
ットを並べ、この可動支持台を装着シーケンスに従って
移動させることにより、所望の部品供給ユニットを順次
部品供給ステーションに停止させる構成としたものが多
い。その一例を特開昭61−142799号公報に見る
ことができる。部品供給ユニットの配列は、一方の端か
ら他方の端へ、装着シーケンスに従って所定の部品を内
蔵した部品供給ユニットを並べて行くのが普通のやり方
である。
(b) Prior Art A typical example of work in which a large number of parts are mounted on a single board can be seen on an electronic circuit board assembly line. The size of components tends to be smaller, and the density of component mounting is increasing proportionally, so that most component mounting is now carried out by specialized automatic machines. Now, in such an automatic machine, in order to supply a wide variety of parts at precise timing, a plurality of parts supply units are arranged on a movable support base, and this movable support base is moved according to the mounting sequence. In most cases, desired component supply units are sequentially stopped at a component supply station. An example of this can be found in Japanese Unexamined Patent Publication No. 142799/1983. The usual way of arranging component supply units is to line up component supply units containing predetermined components from one end to the other according to a mounting sequence.

e9  発明が解決しようとする課題 上記構成の部品供給装1程にあっては、装着すべき部品
が多種にわたる場合、多数の部品供給ユニットを並べね
ばならず、全体が長大なものになる。従って、一方の端
に位置した部品供給ユニットから供給を始め、他方の端
にたどり着いた後、次の基板に対しもう一度最初の部品
供給ユニットから供給を行わせようとすると、可動支持
台を引き返させるのに時間をとってしまい、ロスタイム
が多くなるという問題がめった。本允明はこの点を解決
しようとするものである。
e9 Problems to be Solved by the Invention In the component supply device 1 having the above configuration, when there are many types of components to be mounted, a large number of component supply units must be lined up, and the entire device becomes long. Therefore, if you start supplying from the component supply unit located at one end, and after reaching the other end, you try to supply the next board again from the first component supply unit, the movable support base will be turned back. The problem was that it took a lot of time, resulting in a lot of lost time. This book attempts to solve this problem.

(ニ)課題を解決するための手段 本発明においては、1枚の基板に所定数の部品を所定順
序で装着した後、次の基板については、逆の順序で部品
装着を遂行するものとする。
(d) Means for Solving the Problems In the present invention, after a predetermined number of components are mounted on one board in a predetermined order, the parts are mounted on the next board in the reverse order. .

(ホ)作用 上記手順によれば、可動支持台は、1枚の基板に対する
部品装着が終了した後、次の基板に対する部品装着が開
始されるまで、その場に留まっていれは良くなる。従っ
て可動支持台の復帰によるロスクイムが生じず、作業能
率が向上する。
(E) Effect According to the above procedure, the movable support stand remains in place after the completion of component mounting on one board until the start of component mounting on the next board. Therefore, no loss occurs due to the return of the movable support, and work efficiency is improved.

(ヘ)実施例 第1図乃至第5図に基き本発明の一実施例を説明する。(f) Examples An embodiment of the present invention will be described based on FIGS. 1 to 5.

第4図は電子回路基板の組立に使用する部品装着装置2
1のレイアウトを模型的に示したものである。22は吸
着装置、28は部品供給装置、24は供給側基板搬送装
置、25は収納側基板搬送装置、26は基板位置決め装
置である。
Figure 4 shows component mounting device 2 used for assembling electronic circuit boards.
This is a schematic representation of the layout of No. 1. 22 is a suction device, 28 is a component supply device, 24 is a supply side substrate transfer device, 25 is a storage side substrate transfer device, and 26 is a substrate positioning device.

基板位置決め装f1126はX−Yテーブルを主体に構
成されるものであり、供給側基板搬送装置24から基板
l1を受け取り、この基板l1の部品取付個所を作業地
点に順次位置決めする。所要の部品をすべて装着した後
、基板位置決め装置26は収納側基板搬送装置25に基
板11を引き渡す。
The board positioning device f1126 is mainly composed of an X-Y table, and receives the board l1 from the supply side board transfer device 24, and sequentially positions the parts mounting parts of the board l1 at work points. After all the required parts are mounted, the board positioning device 26 delivers the board 11 to the storage-side board transfer device 25.

部品供給装置2Bは、直線移動する可動支持台81の上
に複数個の部品供給ユニット82を並べたものである。
The component supply device 2B has a plurality of component supply units 82 arranged on a movable support base 81 that moves linearly.

部品供給の方式は、テープ、マカジン、バルクホッパ等
が現今多く採用されているが、そのいずれであっても良
い。吸着装置22は、ロータリーインデックステーブル
85の周縁に複数個の装着ヘッド36を設けたものであ
る。弟2図に示すように、実施例においては計lθ個の
装着ヘッド36を配置しており、各々の装着ヘッド86
が第3図に示す吸着コレット87を有していろ。ロータ
リーインデックステーブル85の回転に伴い、各装着ヘ
ッド36は10個所の作業ステ?ションを順次周回する
。装着ヘッド36と部品供給装置28の接点となる作業
ステーション(第2図においては識別符号Aを付した装
着ヘッド86が位置している)が部品供給ステーション
41となり、装着ヘッド86と基板位置決め装置26の
接点となる作業ステーション(弟2図においては識別符
号Fを付した装着ヘッド36が位置している)が部品装
着ステーション46となる。吸着コレット87は、部品
供給ステーション41においては部品供給ユニット32
の中の部品l5に向かって、部品装着ステーション46
においては基板11に向かって、それぞれ降下動を行う
。なお部品供給ステーション41から部品装着ステーシ
ン46までのいずれかの作業ステーションには、■吸着
コレット87に吸着された部品15のセンタリング及び
角度規正を行う部品位置規正装置を配置する。
At present, tape, macazine, bulk hopper, etc. are often used as a part supply method, and any of these methods may be used. The suction device 22 includes a plurality of mounting heads 36 provided around the periphery of a rotary index table 85. As shown in FIG. 2, in the embodiment, a total of lθ mounting heads 36 are arranged, and each mounting head 86
has a suction collet 87 shown in FIG. As the rotary index table 85 rotates, each mounting head 36 moves to 10 work stations. rotations in sequence. A work station that is a contact point between the mounting head 36 and the component supply device 28 (in FIG. 2, the mounting head 86 with identification code A is located) is the component supply station 41, and the mounting head 86 and the board positioning device 26 The work station (where the mounting head 36 with identification code F is located in FIG. 2) is the component mounting station 46. The suction collet 87 is attached to the component supply unit 32 at the component supply station 41.
toward the component l5 in the component mounting station 46.
In each step, a downward motion is performed toward the substrate 11. In any of the work stations from the component supply station 41 to the component mounting station 46, a component position adjustment device (2) for centering and angle adjustment of the component 15 sucked by the suction collet 87 is arranged.

第4図に部品装着装置21の制御系統を示す.51は演
算処理部52とメモリ53により構成される制御部であ
る。制御部5lには、吸着装置2?、部品供給装置23
、基板搬送装@24、25、基板位置決め装置26の他
、部品位置規正装置54、データ入力部55、キーボー
ド56が入出力インターフェース57を介して接続され
ている。
Figure 4 shows the control system of the component mounting device 21. Reference numeral 51 denotes a control section composed of an arithmetic processing section 52 and a memory 53. The control unit 5l includes an adsorption device 2? , parts supply device 23
, the board transport devices @24 and 25, and the board positioning device 26, as well as a component positioning device 54, a data input section 55, and a keyboard 56 are connected via an input/output interface 57.

部品固定用半田ペースト、■接着剤等を基板11に塗布
するためのディスベシサを装置内に組み込む場合は、こ
のディスペンサ58も同様に接続する。
When a dispenser for applying solder paste for fixing components, adhesive, etc. to the board 11 is incorporated into the device, this dispenser 58 is also connected in the same way.

本尭明では、次のような順序で部品を装着する。In this model, parts are installed in the following order.

第1図に示す基板1lはミ複数個の単位基板を連結し、
部品の半田付が完rした時点で分割する、いわゆる多面
取り基板の一種であって、同一規格の単位基板12を8
枚組み合わせた形になっている。各単位基板12には各
々種類を異にする10個の部品を装着するものとする。
The board 1l shown in FIG. 1 connects a plurality of unit boards,
It is a type of so-called multi-panel board that is divided when the soldering of components is completed, and unit boards 12 of the same standard are divided into 8 parts.
It is shaped like a combination of sheets. It is assumed that ten parts of different types are mounted on each unit board 12.

説明上の便宜のため、図に2枚描いた基板11のうち、
右側のもの、すなわち先に部品装着が行われる方の基板
11には識別符号aを付加し、左側のもの、すなわちそ
の次に部品装着が行われる基板!■には識別符号bを付
加する.同様に、各基板1111,1lbを構成する単
位基板12にもa /− fの識別符号を付す。また第
2図にあっては、10個並べた部品供給ユニット32に
、左から順に1−10の識別符号を付す。識別符号1〜
10は部品の種別を表わし、また第1図においては部品
装着個所を、示すものである。さて、弟1図において、
まず単位基板12aから部品装宥が開始されるのである
が、ここではlがスタート地点となる。可動支持台31
は、装着シーケンスに従って第2図の右から左へと、移
動→停止を繰り返しながら進んで行く。
For convenience of explanation, among the two boards 11 drawn in the figure,
An identification code a is added to the board 11 on the right, that is, the one on which components are mounted first, and the one on the left, that is, the board 11 on which components are mounted next! Add identification code b to ■. Similarly, the unit boards 12 constituting each board 1111, 1lb are also given identification codes a/-f. Further, in FIG. 2, identification codes 1-10 are attached to ten component supply units 32 arranged in order from the left. Identification code 1~
Reference numeral 10 indicates the type of component, and in FIG. 1, the location where the component is mounted. Now, in the younger brother figure 1,
First, component mounting is started from the unit board 12a, and here, l is the starting point. Movable support stand 31
follows the mounting sequence from right to left in FIG. 2, repeating movement and stopping.

lO番目の部品供給ユニット82が部品供給ステーショ
ン41に達すると、可動支持台81はそこで停止する。
When the IOth component supply unit 82 reaches the component supply station 41, the movable support stand 81 stops there.

10番目の部品を取り上げた装着ヘッド36が部品装着
ステーション46に達し、単位基板12mにその部品を
付着させると、単位基板12aに対する作業は一段落す
る。続いて単位基板12bに対する作業を開始するので
あるが、今度は10番目の装着個所から逆進して装着を
進めて行く。可動支持台81は、IO番目の部品供給ユ
ニット32を部品供給ステーション41に停止させてい
た状態から、第2図において右方へと移動→停止を繰り
返しつつ復帰する。装着個所lを最後として単位基板1
2bに対する作業が終了すると、単位基板12cについ
ては装着個所1から装着がスタートする。以下同様にし
て、単位基板12dについては装着個所10から、単位
基板12eについては装着個所1から、単位基板12f
については装着個所lOから、それぞれ装着を開始させ
るものである。なお、各部の動作速度にもよるが、部品
装着を終えた基板11aを収納側基板搬送装置25に引
き渡し、供給側基板搬送装置24から基板1lbを受け
取るといった一連の作業に相当以上の時間がかかるよう
であれば、その間に可動支持台31を復帰させて単位基
板l2dに対する部品装着を装着個所1から始めること
もできる。
When the mounting head 36 that has picked up the tenth component reaches the component mounting station 46 and attaches the component to the unit board 12m, the work on the unit board 12a comes to an end. Next, work on the unit board 12b is started, and this time, the mounting progresses backwards from the 10th mounting location. The movable support stand 81 returns from the state in which the IOth component supply unit 32 was stopped at the component supply station 41 by repeatedly moving and stopping rightward in FIG. 2. Unit board 1 with mounting point l as the last
When the work on unit board 2b is completed, mounting on unit board 12c starts from mounting location 1. Thereafter, in the same manner, the unit board 12d is mounted from the mounting location 10, the unit board 12e is mounted from the mounting location 1, and the unit board 12f is
For these, the mounting is started from the mounting location IO. Although it depends on the operating speed of each part, it takes a considerable amount of time to complete a series of operations such as handing over the board 11a on which parts have been mounted to the storage-side board transport device 25 and receiving 1 lb of board from the supply-side board transport device 24. If so, it is also possible to return the movable support base 31 during that time and start mounting components on the unit board l2d from the mounting location 1.

第6図乃至第8図に他の実施例を示す。ここでは、大型
の基板位置決め装置26′に2枚の基板lla,!lb
を載せ、基板ttaに対し部品装着ヲ行う一方で、基板
1lbにはディスベンサ58により粘着性物質(半田ペ
ースト、接着剤)の供給を行う。基板1lbでは、基板
t 興とおいて部品装着が行われつつあるのと対応する
個所に、粘着性物質が付着する, (})発明の効果 本晃明によれば、1枚の基板に対する部品装着を終えて
次の基板に対する装着作業を開始する際、部品供給装置
を一々原位置に復帰させる必要がなく、復帰待ちのロス
タイムがない。作業終了から次の作業開始までの時間間
隔の短い多面取り基板の場合、本允明による時間短縮効
果は特に顕著である。
Other embodiments are shown in FIGS. 6 to 8. Here, two substrates lla, ! are placed in a large substrate positioning device 26'. lb
While mounting components on the board tta, a dispenser 58 supplies an adhesive substance (solder paste, adhesive) to the board 1lb. On the board 1lb, the adhesive substance adheres to the parts corresponding to the places where components are being mounted on the board t. There is no need to return the component supply device to the original position one by one when starting the mounting work on the next board after finishing the mounting operation, and there is no loss time waiting for the component supply device to return to its original position. In the case of multi-panel boards, where the time interval from the end of one work to the start of the next work is short, the time-saving effect provided by Masaaki Moto is particularly remarkable.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明による部品装着手順を示す基板の上面図
、第2図は第1図の部品装着作業を行わせる部品装着装
置の要部上面図、弟8図は第2図の装置の部分正面図、
第4図は部品装着装置の全体的レイアウトを示す上面図
、第5図は部品装着装置の制御系統を示すブロック図で
ある。第6図以下は本発明を応用した他の構成例を示す
もので、第6図は基板位置決め装置上の基板を示す上面
図、第7図は第2図に対応する部品装着装置の要部上面
図、第8図は第8図に対応する部品装着装置の部品正面
図である。 11・・・基板、15・・・部品、81・・・可動支持
台、32・・・部品供給ユニット、41・・・部品供給
ステーション。
FIG. 1 is a top view of a board showing the component mounting procedure according to the present invention, FIG. 2 is a top view of the main parts of a component mounting device that performs the component mounting work of FIG. partial front view,
FIG. 4 is a top view showing the overall layout of the component mounting device, and FIG. 5 is a block diagram showing the control system of the component mounting device. FIG. 6 and subsequent figures show other configuration examples to which the present invention is applied. FIG. 6 is a top view showing a board on a board positioning device, and FIG. 7 is a main part of a component mounting device corresponding to FIG. 2. The top view, FIG. 8, is a front view of components of the component mounting device corresponding to FIG. 8. DESCRIPTION OF SYMBOLS 11... Board, 15... Components, 81... Movable support stand, 32... Components supply unit, 41... Components supply station.

Claims (1)

【特許請求の範囲】[Claims] (1)複数個の部品供給ユニットを支持した可動支持台
を装着シーケンスに従って移動させ、部品供給ユニット
群を順次部品供給ステーションに停止させて基板に装着
すべき所定数の部品を供給するものにおいて、1枚の基
板に所定数の部品を所定順序で装着した後、次の基板に
ついては、逆の順序で部品装着を遂行することを特徴と
する部品装着方法。
(1) A movable support base supporting a plurality of component supply units is moved according to a mounting sequence, and a group of component supply units are sequentially stopped at a component supply station to supply a predetermined number of components to be mounted on a board, A component mounting method characterized in that after a predetermined number of components are mounted on one board in a predetermined order, the parts are mounted on the next board in the reverse order.
JP63286946A 1988-11-14 1988-11-14 Component mounting method Pending JPH02132896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63286946A JPH02132896A (en) 1988-11-14 1988-11-14 Component mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63286946A JPH02132896A (en) 1988-11-14 1988-11-14 Component mounting method

Publications (1)

Publication Number Publication Date
JPH02132896A true JPH02132896A (en) 1990-05-22

Family

ID=17711000

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63286946A Pending JPH02132896A (en) 1988-11-14 1988-11-14 Component mounting method

Country Status (1)

Country Link
JP (1) JPH02132896A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253457A (en) * 2005-03-11 2006-09-21 Hitachi High-Tech Instruments Co Ltd Printed circuit board assembly method and printed circuit board assembly apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006253457A (en) * 2005-03-11 2006-09-21 Hitachi High-Tech Instruments Co Ltd Printed circuit board assembly method and printed circuit board assembly apparatus

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