JPH02132901U - - Google Patents
Info
- Publication number
- JPH02132901U JPH02132901U JP4140289U JP4140289U JPH02132901U JP H02132901 U JPH02132901 U JP H02132901U JP 4140289 U JP4140289 U JP 4140289U JP 4140289 U JP4140289 U JP 4140289U JP H02132901 U JPH02132901 U JP H02132901U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealed
- periphery
- lead
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案にかかる樹脂封止型電子部品の
第１実施例の斜視図、第２図は第１図の−線
断面図、第３図は実装状態の一部側面図、第４図
は製造途中の平面図、第５図はその一部拡大斜視
図、第６図は第２実施例の断面図、第７図はその
製造途中の平面図、第８図は従来例の斜視図であ
る。
１……基板、２……端子、２ａ……接続部、２
ｂ……引出部、３……封止樹脂、４，６……弾性
物質。
FIG. 1 is a perspective view of a first embodiment of a resin-sealed electronic component according to the present invention, FIG. 2 is a sectional view taken along the line -- in FIG. 5 is a partially enlarged perspective view of the manufacturing process, FIG. 6 is a sectional view of the second embodiment, FIG. 7 is a plan view of the manufacturing process, and FIG. 8 is a perspective view of the conventional example. It is a diagram. 1... Board, 2... Terminal, 2a... Connection part, 2
b...Drawer part, 3...Sealing resin, 4, 6...Elastic material.
Claims (1)
脂で封止してなる樹脂封止型電子部品において、 少なくとも上記端子の基板接続部と引出部との
中間部周囲を弾性物質で被覆し、該被覆箇所が封
止樹脂と外部との境界面に対応するように封止樹
脂で封止したことを特徴とする樹脂封止型電子部
品。[Scope of Claim for Utility Model Registration] In a resin-sealed electronic component in which the periphery of a terminal connected to a board except for the lead-out part is sealed with resin, at least the intermediate part between the board connection part and the lead-out part of the terminal. 1. A resin-sealed electronic component, characterized in that the periphery of the component is covered with an elastic material, and the covered area is sealed with a sealing resin so as to correspond to the interface between the sealing resin and the outside.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4140289U JPH02132901U (en) | 1989-04-07 | 1989-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4140289U JPH02132901U (en) | 1989-04-07 | 1989-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132901U true JPH02132901U (en) | 1990-11-05 |
Family
ID=31552037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4140289U Pending JPH02132901U (en) | 1989-04-07 | 1989-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132901U (en) |
-
1989
- 1989-04-07 JP JP4140289U patent/JPH02132901U/ja active Pending