JPH0245616U - - Google Patents
Info
- Publication number
- JPH0245616U JPH0245616U JP12431988U JP12431988U JPH0245616U JP H0245616 U JPH0245616 U JP H0245616U JP 12431988 U JP12431988 U JP 12431988U JP 12431988 U JP12431988 U JP 12431988U JP H0245616 U JPH0245616 U JP H0245616U
- Authority
- JP
- Japan
- Prior art keywords
- component body
- lead member
- component
- external lead
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Ceramic Capacitors (AREA)
Description
第１図は本考案に係る電子部品の正断面図、第
２図は本考案要部の拡大断面図、第３図は突起お
よび半田溜りの斜視図である。第４図は従来の電
子部品の正断面図である。
１……部品本体、４……外部樹脂材、１１，１
２……外装リード部材、１１ｃ，１２ｃ……突起
、１３，１４……半田溜り。
FIG. 1 is a front sectional view of an electronic component according to the present invention, FIG. 2 is an enlarged sectional view of essential parts of the present invention, and FIG. 3 is a perspective view of a protrusion and a solder pool. FIG. 4 is a front sectional view of a conventional electronic component. 1...Part body, 4...External resin material, 11,1
2...Exterior lead member, 11c, 12c...Protrusion, 13, 14...Solder pool.
Claims (1)
部材を導出させた電子部品において、 部品本体に接続された前記外部リード部材に、
部品本体の下方で内側に向かつて延びる突起を形
成し、この突起と部品本体の下端面との間に半田
溜りを形成したことを特徴とする電子部品。[Scope of Utility Model Registration Claim] In an electronic component in which an external lead member is derived from an exterior resin material covering a component body, the external lead member connected to the component body includes:
An electronic component characterized in that a protrusion extending inwardly below the component body is formed, and a solder pool is formed between the protrusion and the lower end surface of the component body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12431988U JPH0245616U (en) | 1988-09-22 | 1988-09-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12431988U JPH0245616U (en) | 1988-09-22 | 1988-09-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0245616U true JPH0245616U (en) | 1990-03-29 |
Family
ID=31373950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12431988U Pending JPH0245616U (en) | 1988-09-22 | 1988-09-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0245616U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0552311A (en) * | 1991-08-21 | 1993-03-02 | Rinnai Corp | Gas burner |
-
1988
- 1988-09-22 JP JP12431988U patent/JPH0245616U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0552311A (en) * | 1991-08-21 | 1993-03-02 | Rinnai Corp | Gas burner |