JPH02132948U - - Google Patents
Info
- Publication number
- JPH02132948U JPH02132948U JP1989041780U JP4178089U JPH02132948U JP H02132948 U JPH02132948 U JP H02132948U JP 1989041780 U JP1989041780 U JP 1989041780U JP 4178089 U JP4178089 U JP 4178089U JP H02132948 U JPH02132948 U JP H02132948U
- Authority
- JP
- Japan
- Prior art keywords
- reflow chip
- reflow
- pad
- chip structure
- bonding apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の実施例を示す図であり、第２
図は本考案のチツプ断面拡大図を示す図であり、
第３図は本考案が適用されるボンデイング装置の
概略図を示す図であり、第４図は本考案における
ワイヤボンデイング後の状態を示す図であり、第
５図は従来のチツプ断面拡大図を示す図である。
図において、１……プリント基板、２……電子
部品実装用モジユール、２ａ……接続パツド、３
……リフローチツプ、３ａ……突起部をそれぞれ
示す。
FIG. 1 is a diagram showing an embodiment of the present invention, and FIG.
The figure shows an enlarged cross-sectional view of the chip of the present invention.
FIG. 3 is a diagram showing a schematic diagram of a bonding apparatus to which the present invention is applied, FIG. 4 is a diagram showing the state after wire bonding in the present invention, and FIG. 5 is an enlarged cross-sectional view of a conventional chip. FIG. In the figure, 1...Printed circuit board, 2...Module for mounting electronic components, 2a...Connection pad, 3
. . . reflow chip, 3a . . . shows protrusions, respectively.
Claims (1)
用モジユール２の側面に設けられたパツド２ａに
ワイヤ４を接続するボンデイング装置のリフロー
チツプ構造であつて、 前記パツド２ａに対応してリフローチツプ３の
側面に突起部３ａを設けたことを特徴とするボン
デイング装置のリフローチツプ構造。 (2) 前記リフローチツプ３の断面は中空部３ｂ
を介して左右の肉厚が異なるよう構成しておき、
肉厚が薄い方に前記突起部３ａを設けたことを特
徴とする請求項１記載のボンデイング装置のリフ
ローチツプ構造。[Claims for Utility Model Registration] (1) A reflow chip structure of a bonding device that connects a wire 4 to a pad 2a provided on a side surface of an electronic component mounting module 2 mounted on a printed circuit board 1, wherein the pad A reflow chip structure for a bonding apparatus characterized in that a protrusion 3a is provided on the side surface of the reflow chip 3 corresponding to the reflow chip 2a. (2) The cross section of the reflow chip 3 is a hollow part 3b.
The thickness of the left and right sides should be different through the
2. A reflow chip structure for a bonding apparatus according to claim 1, wherein the protruding portion 3a is provided on the thinner side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041780U JPH02132948U (en) | 1989-04-10 | 1989-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989041780U JPH02132948U (en) | 1989-04-10 | 1989-04-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02132948U true JPH02132948U (en) | 1990-11-05 |
Family
ID=31552743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989041780U Pending JPH02132948U (en) | 1989-04-10 | 1989-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02132948U (en) |
-
1989
- 1989-04-10 JP JP1989041780U patent/JPH02132948U/ja active Pending