JPH028173U - - Google Patents
Info
- Publication number
- JPH028173U JPH028173U JP8586988U JP8586988U JPH028173U JP H028173 U JPH028173 U JP H028173U JP 8586988 U JP8586988 U JP 8586988U JP 8586988 U JP8586988 U JP 8586988U JP H028173 U JPH028173 U JP H028173U
- Authority
- JP
- Japan
- Prior art keywords
- jumper wire
- hole
- component mounting
- wire connection
- mounting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る表面実装用プ
リント配線板の一部拡大平面図、第２図は同じく
表面実装用プリント配線板に表面実装用部品を搭
載した状態を示す平面図で、第３図は従来の表面
実装用プリント配線板の一部拡大平面図である。
２……部品搭載パツド、３……ジヤンパー線接
続用スルーホール、５……ソルダレジスト、９…
…ジヤンパー線。
Fig. 1 is a partially enlarged plan view of a surface mount printed wiring board according to an embodiment of the present invention, and Fig. 2 is a plan view showing a state in which surface mount components are mounted on the surface mount printed wiring board. , FIG. 3 is a partially enlarged plan view of a conventional printed wiring board for surface mounting. 2... Component mounting pad, 3... Through hole for connecting jumper wire, 5... Solder resist, 9...
... Jumper line.
Claims (1)
、上記部品搭載パツドの延長線上に設けられたジ
ヤンパー線を接続するジヤンパー線接続用スルー
ホールと、上記部品搭載パツドとジヤンパー線接
続用スルーホールとの間に設けたソルダレジスト
とを有することを特徴とした表面実装用プリント
配線板。 Between the component mounting pad for attaching surface mount components, the jumper wire connection through hole for connecting the jumper wire provided on the extension line of the component mounting pad, and the jumper wire connection through hole between the component mounting pad and the jumper wire connection through hole. A printed wiring board for surface mounting, characterized in that it has a solder resist provided thereon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8586988U JPH028173U (en) | 1988-06-30 | 1988-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8586988U JPH028173U (en) | 1988-06-30 | 1988-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028173U true JPH028173U (en) | 1990-01-19 |
Family
ID=31310522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8586988U Pending JPH028173U (en) | 1988-06-30 | 1988-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028173U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021174975A (en) * | 2020-04-30 | 2021-11-01 | Ｎｅｃプラットフォームズ株式会社 | Printed circuit board and printed circuit board manufacturing method |
-
1988
- 1988-06-30 JP JP8586988U patent/JPH028173U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021174975A (en) * | 2020-04-30 | 2021-11-01 | Ｎｅｃプラットフォームズ株式会社 | Printed circuit board and printed circuit board manufacturing method |