JPH0213363B2 - - Google Patents
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- Publication number
- JPH0213363B2 JPH0213363B2 JP56178313A JP17831381A JPH0213363B2 JP H0213363 B2 JPH0213363 B2 JP H0213363B2 JP 56178313 A JP56178313 A JP 56178313A JP 17831381 A JP17831381 A JP 17831381A JP H0213363 B2 JPH0213363 B2 JP H0213363B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic core
- film
- magnetic
- stress
- magnetostriction constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Description
本発明は薄膜磁気ヘツドの製造方法に係り、特
に電磁変換特性に優れた薄膜磁気ヘツドの製造方
法に関する。
薄膜磁気ヘツドの電磁変換特性は磁気コアの磁
気特性に大きく依存している。薄膜磁気ヘツドは
高周波領域で使用されるために、磁気コアに単軸
磁気異方性を付与し、トラツク幅方向に磁化容易
軸を向け、励磁方向を磁化困難軸とし、磁化回転
による磁化反転を行わしめ、高周波領域での透磁
率の大きいことを利用している。比較的大きい透
磁率は、磁歪定数が小さく、かつ誘導単軸異方性
定数の小さい磁性膜によつて得られることが知ら
れている。この様な磁性膜としてNi−Fe系合金
膜が知られている。
薄膜磁気ヘツドの磁気コアとしては負の磁歪定
数を有する磁性膜が望ましいことが、特開昭55−
101124号公報に開示されている。特開昭55−
101124号公報において、負の磁歪定数の磁性膜が
薄膜磁気ヘツドの磁気コアに望ましい理由とし
て、磁気コアのトラツク幅方向と直角方向に引張
応力が作用し、このトラツク幅方向と直角方向の
引張応力による磁化容易軸の回転を防止するため
と記述されている。
本発明者らの実験に依れば、薄膜磁気ヘツドの
磁気コア、特に上部磁気コアにはトラツク幅方向
と直角な方向の引張応力に加えてトラツク幅方向
にも引張応力を作用することが明らかとなつた。
更に、磁気コアのトラツク幅方向およびトラツク
幅方向と直角な方向等に圧縮応力も作用すること
も明らかとなつた。また、磁歪係数が負の大きな
値を取る場合には引張り応力に対して透磁率が減
少することも明らかとなつた。
従つて、薄膜磁気ヘツドの磁気コアとしては、
磁歪定数の符号を負にすることのみででは安定し
た特性が得られないことがわかつた。
本発明の目的は、常に安定した電磁変換特性を
呈する改良された薄膜磁気ヘツドの製造方法を提
供することにある。
そして、安定した電磁変換特性を得るために
は、磁気コアを構成する上部磁気コア及び下部磁
気コアのうち少なくとも上部磁気コアの磁歪定数
を絶対値で1×10-6以内とする必要がある。
かかる目的を奏する本発明の薄膜磁気ヘツドの
製造方法は、絶縁基板上に下部磁気コアを形成
し、該下部磁気コア上に磁気ギヤツプを形成し、
該磁気ギヤツプより上にコイル導体を形成し、該
コイル導体相互間及び前記コイル導体上に絶縁膜
を形成し、該絶縁膜上に一端が前記下部磁気コア
の一端に接し、他端が前記下部磁気コアの他端に
磁気ギヤツプを介して対向する上部磁気コアを形
成することを含み、少なくとも前記上部磁気コア
が、スパツタ法により組成制御されたNi−Fe系
合金からなり、前記上部磁気コア面と平行な面に
(111)面又は(100)面が多くなるように結晶配
向を制御して形成され、前記上部磁気コア形成後
に熱処理し、磁歪定数を絶対値で1×10-6以下と
することを特徴とする。
以下、本発明による薄膜磁気ヘツドを図面によ
り詳細に説明する。
第1図において、1は絶縁基板、2は絶縁基板
1上に形成した下地膜、3は下地膜2上に形成さ
れた下部磁気コア、4は下部磁気コア3上に積層
され一端が下部磁気コア3の一端に連なり、他端
が下部磁気コア3の他端に所定の磁気ギヤツプG
を介して対向する上部磁気コア、5は下部磁気コ
ア3と上部磁気コア4との間を貫通するように配
置されたコイル導体、6はコイル導体5相互間、
コイル導体5と下部磁気コア3及び上部磁気コア
4との間、及び磁気ギヤツプG間に充填された絶
縁物、7は上部磁気コア4、コイル導体5を被覆
する保護膜である。上部磁気コア4はその磁歪定
数が絶対値で1×10-6以内としてある。
下部磁気コア3及び上部磁気コア4に作用する
応力を第2図及び第3図により説明する。
下部磁気コア3には、パターニングすることに
より第2図の矢印で示す方向に引張応力が作用す
る。即ち、パターンの端部近傍において、パター
ンの端に沿つた方向に引張応力21,21′,2
1″,21が作用する。
上部磁気コア4の場合は下部磁気コア3に比べ
て複雑である。上部磁気コア4には次の3種類の
応力が作用する。それは、(1)下部磁気コア3と同
様にパターニングすることにより発生する応力σa
22,22′,22″,22、(2)フロントギヤツ
プGおよびバツクギヤツプ近傍にある乗り上げ部
に磁性膜を形成することによつて発生する引張応
力σb23,23′、(3)上部磁気コア4上に形成さ
れる保護膜7が上部磁気コア4に及ぼす応力σc2
4,24′,24″,24、24′′′′の3種類で
ある。乗り上げ部に磁性膜を形成することによつ
て発生する応力σb23,23′は乗り上げの縁に
平行な方向すなわちトラツク幅方向の引張応力が
作用する。保護膜7が上部磁気コア4に及ぼす応
力σc24,24′,24″,24,24′′′′は
保護
膜(多くの場合はスパツタリングで形成される酸
化アルミニウム膜)7の形成条件によつて変わ
る。発明者らの行つたスパツタリングで形成した
酸化アルミニウム膜の場合、上部磁気コアのパタ
ーンの縁に沿つた方向に圧縮応力が、乗り上げの
縁に沿つた方向に圧縮応力がそれぞれ作用する。
すなわち、保護膜が上部磁気コアに及ぼす応力σc
24,24′,24″,24,24′′′′は、パタ
ーニングすることにより発生する応力σa22,2
2′,22″,22および乗り上げ部に磁性膜を
形成することによつて発生する応力σb23,2
3′と引張応力、圧縮応力の関係が逆になつてい
る。この様に上部磁気コアには複雑な応力が作用
する。
次に単軸磁気異方性膜に応力が作用している場
合の透磁率について説明する。磁歪定数λの単軸
磁気異方性膜の磁化困難軸に応力が作用した時、
応力が作用しない時の透磁率が2000の場合、磁歪
定数と応力と透磁率との関係を第4図に示す。第
4図中の数字は透磁率を表わす。磁歪定数が正の
場合、磁化困難軸方向に圧縮応力が作用すれば透
磁率が低下し、磁化困難軸に限界曲線30以内の引
張応力が作用すれば透磁率が増加する。限界曲線
30よりも大きな引張応力が作用すれば、磁化容
易軸の回転が起り、磁化容易軸方向励磁となり、
磁壁移動による磁化反転が起り、高周波領域にお
ける透磁率は大幅に低下し、薄膜磁気ヘツドの電
磁変換特性が劣化する。磁歪定数が負の場合に
は、磁化困難軸に引張応力が作用すると透磁率が
低下し、磁化困難軸に限界曲線31以内の圧縮応
力が作用すれば透磁率が増加する。限界曲線31
よりも大きな圧縮応力が作用すれば、磁化容易軸
の回転が起り、高周波領域における透磁率は大幅
に低下する。磁歪定数λの大きな磁性膜に対して
は、小さな磁化困難軸方向の応力が作用すること
によつて透磁率が変動する。磁歪定数の絶対値の
大きい磁気コアから成る薄膜磁気ヘツドは読出電
圧のばらつきが大きく、重ね書き特性も望ましく
ない。
薄膜磁気ヘツドの上部磁気コアには、上述のよ
うにパターニングすることにより発生する応力
σa、乗り上げ部に磁性膜を形成することによつて
発生する応力σbおよび保護膜が上部磁気コアに及
ぼす応力σcがある。本発明者らの実験に依れば、
これらの応力は、磁性膜の形成条件、パターンの
形状、乗り上げ部の形状および保護膜形成条件等
によつて変わるが、概略±108N/m2以内であつ
た。従つて、第4図により薄膜磁気ヘツドの電磁
変換特性を良好に、かつ安定に保つには磁気コア
の磁歪定数の絶対値を1×10-6以内にすることが
必要である。磁歪定数の絶対値が1×10-6以内の
磁性膜を工業的に再現性良く得る方法をNi−Fe
系合金膜の場合について説明する。薄膜磁気ヘツ
ドの磁気コアにはNi−Fe系合金膜が多く用いら
れる。薄膜磁気ヘツドに用いられるNi−Fe系合
金膜は多くの場合多結晶である。多結晶膜の磁歪
定数は単結晶膜と同様に、結晶の配向の度合が重
要である。Ni−Fe系合金膜では、膜面と平行な
面に(111)面が多い場合には約80.2重量%Niで
磁歪定数が零となり、膜面に平行な面に(100)
面が多い場合には約81.7重量%Niで磁歪定数が零
となる。すなわち、Ni−Fe系合金膜で磁歪定数
の絶対値を1×10-6以内にするには、膜の組成だ
けでなく、膜の配向の度合も制御することが重要
である。第5図に(100)配向したNi−Fe系合金
膜の磁化困難軸に応力を印加した時の透磁率の変
化を示す。第5図中の膜a,b,c,dの磁歪定
数は夫々+4.6×10-6、+1.1×10-6、−0.1×10-6お
よび−0.8×10-6であつた。磁歪定数の大きいNi
−Fe系合金膜は小さな応力で透磁率変化が大き
い。特に、磁歪定数が+4.6×10-6と大きい膜a
は大きな引張応力で磁化容易軸の回転が起り、透
磁率が大幅に低下する。
実施例
絶縁基板1としてAl2O3−TiCセラミツクス基
板を用いた。基板としてはAl2O3−TiC以内に
SiC、Znフエライト、Ni−Znフエライト、Mn−
Znフエライト、Al2O3−TiC等の他のセラミツク
ス基板を用いても良い。次に、基板1上に下地膜
2としてスパツタAl2O3膜を形成した。下地膜と
してはAl2O3に限定されず、電気的絶縁性が良好
で、Ni−Fe系合金膜との反応が実質的に問題と
ならない酸化物、弗化物ならば他の材料でも良
い。次に下部磁気コア3としてのNi−Fe合金を
スパツタ法で形成した。ここで、Ni−Fe膜の磁
歪定数がほぼ零となる膜と、2×10-6となる膜
と、−2×10-6となる膜とを作製した。膜の磁歪
定数は膜組成だけでなく、膜の結晶の配向の度合
によつて変わるので膜形成条件だけでなく膜形成
後の熱処理も重要である。次に、磁気ギヤツプG
を構成するAl2O3をスパツタ法で形成した。コイ
ル導体5の絶縁物としては耐熱性の良好なポリイ
ミド系の樹脂を用いた。コイル導体5にはエレク
トロンマイグレーシヨン特性のすぐれたCuを用
いた。Cuはスパツタ法で形成したが、真空蒸着
法あるいはめつき法で形成しても良い。次に第2
絶縁膜としてポリイミド系樹脂を用いた。上部磁
気コア4は下部磁気コア3と同様にNi−Fe合金
をスパツタ法で形成した。ここで、Ni−Fe膜の
磁歪定数でほぼ零となる膜と2×10-6となる膜と
−2×10-6となる膜とを作製した。下部磁気コア
3、磁気ギヤツプG、絶縁膜、コイル導体5、第
2絶縁膜、上部磁気コア4のパターニングにはイ
オンミリング法を採用した。パターニング法とし
てはイオンミリング法以外にスパツタエツチ法あ
るいは化学エツチング法を用いても良い。次に端
子部分をめつき法で形成し、保護膜7のAl2O3を
スパツタで形成した。次に浮上面となる記録媒体
対向面を機械加工して、薄膜磁気ヘツドの電磁変
換特性をテストした。テストに用いた記録媒体は
γ−Fe2O3磁性粉であつた。周速は40m/s、磁
気ヘツドと記録媒体との浮動スペーシングは
0.35μmでテストした。磁歪定数の異なる磁気コ
アの薄膜磁気ヘツドの電磁変換特性は表1の通り
であつた。
The present invention relates to a method of manufacturing a thin film magnetic head, and more particularly to a method of manufacturing a thin film magnetic head with excellent electromagnetic conversion characteristics. The electromagnetic conversion characteristics of a thin film magnetic head are largely dependent on the magnetic properties of the magnetic core. Because thin-film magnetic heads are used in high-frequency regions, the magnetic core is given uniaxial magnetic anisotropy, the axis of easy magnetization is oriented in the track width direction, the axis of hard magnetization is set in the excitation direction, and magnetization reversal due to magnetization rotation is achieved. This method takes advantage of the high magnetic permeability in the high frequency range. It is known that a relatively high magnetic permeability can be obtained by a magnetic film having a small magnetostriction constant and a small induced uniaxial anisotropy constant. A Ni-Fe alloy film is known as such a magnetic film. It was discovered in Japanese Patent Laid-Open No. 1983-1997 that a magnetic film with a negative magnetostriction constant is desirable as the magnetic core of a thin-film magnetic head.
It is disclosed in Publication No. 101124. Japanese Unexamined Patent Publication 1973-
101124, the reason why a magnetic film with a negative magnetostriction constant is desirable for the magnetic core of a thin-film magnetic head is that tensile stress acts in the direction perpendicular to the track width direction of the magnetic core, and this tensile stress in the direction perpendicular to the track width direction It is stated that the purpose is to prevent rotation of the axis of easy magnetization due to According to the experiments conducted by the present inventors, it is clear that in addition to the tensile stress in the direction perpendicular to the track width direction, tensile stress also acts on the magnetic core of the thin film magnetic head, especially the upper magnetic core. It became.
Furthermore, it has become clear that compressive stress also acts in the track width direction of the magnetic core and in a direction perpendicular to the track width direction. It has also become clear that when the magnetostriction coefficient takes a large negative value, the magnetic permeability decreases in response to tensile stress. Therefore, as a magnetic core of a thin film magnetic head,
It was found that stable characteristics could not be obtained only by making the sign of the magnetostriction constant negative. An object of the present invention is to provide an improved method of manufacturing a thin film magnetic head that always exhibits stable electromagnetic conversion characteristics. In order to obtain stable electromagnetic conversion characteristics, the magnetostriction constant of at least the upper magnetic core among the upper magnetic core and the lower magnetic core constituting the magnetic core needs to be within 1×10 −6 in absolute value. A method for manufacturing a thin film magnetic head of the present invention that achieves the above object comprises forming a lower magnetic core on an insulating substrate, forming a magnetic gap on the lower magnetic core,
A coil conductor is formed above the magnetic gap, an insulating film is formed between the coil conductors and on the coil conductor, and one end of the insulating film contacts one end of the lower magnetic core, and the other end contacts the lower magnetic core. forming an upper magnetic core that faces the other end of the magnetic core through a magnetic gap, at least the upper magnetic core is made of a Ni-Fe alloy whose composition is controlled by sputtering, and the upper magnetic core surface It is formed by controlling the crystal orientation so that there are many (111) planes or (100) planes in the plane parallel to the upper magnetic core, and is heat-treated after forming the upper magnetic core to have a magnetostriction constant of 1 × 10 -6 or less in absolute value. It is characterized by Hereinafter, the thin film magnetic head according to the present invention will be explained in detail with reference to the drawings. In FIG. 1, 1 is an insulating substrate, 2 is a base film formed on the insulating substrate 1, 3 is a lower magnetic core formed on the base film 2, 4 is laminated on the lower magnetic core 3, and one end is the lower magnetic core. It connects to one end of the core 3, and the other end connects to the other end of the lower magnetic core 3 with a predetermined magnetic gap G.
5 is a coil conductor arranged to penetrate between the lower magnetic core 3 and the upper magnetic core 4, 6 is between the coil conductors 5,
An insulator 7 filled between the coil conductor 5 and the lower magnetic core 3 and upper magnetic core 4 and between the magnetic gap G is a protective film covering the upper magnetic core 4 and the coil conductor 5. The upper magnetic core 4 has a magnetostriction constant within 1×10 −6 in absolute value. The stress acting on the lower magnetic core 3 and the upper magnetic core 4 will be explained with reference to FIGS. 2 and 3. By patterning the lower magnetic core 3, tensile stress is applied in the direction indicated by the arrow in FIG. 2. That is, near the edges of the pattern, tensile stresses 21, 21', 2 are applied in the direction along the edges of the pattern.
1'' and 21 act on the upper magnetic core 4. The upper magnetic core 4 is more complicated than the lower magnetic core 3. The following three types of stress act on the upper magnetic core 4. Stress σ a generated by patterning as in 3
22, 22', 22'', 22, (2) Tensile stress σ b generated by forming a magnetic film on the riding part near the front gap G and back gap 23, 23', (3) Upper magnetic core 4 Stress σ c 2 exerted on the upper magnetic core 4 by the protective film 7 formed thereon
There are three types: 4, 24', 24'', 24, 24'''''. The stress σ b generated by forming the magnetic film on the run-on part 23, 23' is in the direction parallel to the run-on edge. In other words , tensile stress in the track width direction acts. It varies depending on the conditions for forming the aluminum oxide film (7). In the case of the aluminum oxide film formed by sputtering performed by the inventors, compressive stress acts in the direction along the edge of the pattern of the upper magnetic core, and compressive stress acts in the direction along the edge of the run-up.
In other words, the stress σ c exerted by the protective film on the upper magnetic core
24, 24', 24'', 24, 24''''' are stress σ a 22, 2 generated by patterning.
2′, 22″, 22 and the stress generated by forming a magnetic film on the riding part σ b 23,2
The relationships between 3', tensile stress, and compressive stress are reversed. In this way, complex stress acts on the upper magnetic core. Next, magnetic permeability when stress is acting on the uniaxial magnetic anisotropic film will be explained. When stress acts on the hard axis of magnetization of a uniaxial magnetically anisotropic film with magnetostriction constant λ,
When the magnetic permeability when no stress is applied is 2000, the relationship between the magnetostriction constant, stress, and magnetic permeability is shown in Figure 4. The numbers in FIG. 4 represent magnetic permeability. When the magnetostriction constant is positive, magnetic permeability decreases if compressive stress is applied in the direction of the hard magnetization axis, and magnetic permeability increases if tensile stress within the limit curve 30 is applied to the hard magnetization axis. If a tensile stress larger than the limit curve 30 is applied, rotation of the axis of easy magnetization occurs, resulting in excitation in the direction of the axis of easy magnetization,
Magnetization reversal occurs due to domain wall movement, and the magnetic permeability in the high frequency region decreases significantly, deteriorating the electromagnetic conversion characteristics of the thin film magnetic head. When the magnetostriction constant is negative, magnetic permeability decreases when tensile stress is applied to the hard magnetization axis, and magnetic permeability increases when compressive stress within the limit curve 31 is applied to the hard magnetization axis. limit curve 31
If a larger compressive stress is applied, the axis of easy magnetization will rotate, and the magnetic permeability in the high frequency region will decrease significantly. For a magnetic film with a large magnetostriction constant λ, the magnetic permeability changes when a small stress in the direction of the hard magnetization axis acts. A thin film magnetic head consisting of a magnetic core with a large absolute value of the magnetostriction constant has large variations in read voltage and undesirable overwriting characteristics. The upper magnetic core of the thin-film magnetic head has stress σ a generated by patterning as described above, stress σ b generated by forming the magnetic film on the run-on portion, and stress exerted on the upper magnetic core by the protective film. There is a stress σ c . According to the experiments of the present inventors,
These stresses varied depending on the conditions for forming the magnetic film, the shape of the pattern, the shape of the overlapping portion, the conditions for forming the protective film, etc., but were approximately within ±10 8 N/m 2 . Therefore, as shown in FIG. 4, in order to maintain good and stable electromagnetic conversion characteristics of the thin film magnetic head, it is necessary to keep the absolute value of the magnetostriction constant of the magnetic core within 1×10 -6 . Ni -Fe
The case of a alloy film will be explained. Ni-Fe alloy films are often used for the magnetic core of thin-film magnetic heads. Ni-Fe alloy films used in thin-film magnetic heads are often polycrystalline. As with a single crystal film, the degree of crystal orientation is important for the magnetostriction constant of a polycrystalline film. In a Ni-Fe alloy film, if there are many (111) planes on the plane parallel to the film surface, the magnetostriction constant becomes zero at approximately 80.2% Ni by weight, and the (100) plane on the plane parallel to the film surface
When there are many surfaces, the magnetostriction constant becomes zero at approximately 81.7% by weight Ni. That is, in order to keep the absolute value of the magnetostriction constant within 1×10 −6 in a Ni—Fe alloy film, it is important to control not only the composition of the film but also the degree of orientation of the film. Figure 5 shows the change in magnetic permeability when stress is applied to the hard axis of magnetization of a (100) oriented Ni-Fe alloy film. The magnetostriction constants of films a, b, c, and d in Figure 5 were +4.6×10 -6 , +1.1×10 -6 , -0.1×10 -6 and -0.8×10 -6 respectively. . Ni with large magnetostriction constant
-Fe-based alloy films have a large change in magnetic permeability with small stress. In particular, film a with a large magnetostriction constant of +4.6×10 -6
The rotation of the axis of easy magnetization occurs under large tensile stress, and the magnetic permeability decreases significantly. Example An Al 2 O 3 --TiC ceramic substrate was used as the insulating substrate 1. As a substrate, within Al 2 O 3 −TiC
SiC, Zn ferrite, Ni−Zn ferrite, Mn−
Other ceramic substrates such as Zn ferrite and Al 2 O 3 -TiC may also be used. Next, a sputtered Al 2 O 3 film was formed as a base film 2 on the substrate 1 . The base film is not limited to Al 2 O 3 , but other materials may be used as long as they are oxides or fluorides that have good electrical insulation and do not substantially cause problems in reaction with the Ni-Fe alloy film. Next, a Ni-Fe alloy as the lower magnetic core 3 was formed by sputtering. Here, a film in which the magnetostriction constant of the Ni-Fe film was approximately zero, a film in which the magnetostriction constant was 2×10 −6 , and a film in which the magnetostriction constant was −2×10 −6 were fabricated. The magnetostriction constant of a film varies not only with the film composition but also with the degree of crystal orientation of the film, so not only the film formation conditions but also the heat treatment after film formation are important. Next, the magnetic gap G
Al 2 O 3 constituting the structure was formed by a sputtering method. As the insulator of the coil conductor 5, a polyimide resin having good heat resistance was used. Coil conductor 5 is made of Cu, which has excellent electron migration characteristics. Although Cu is formed by a sputtering method, it may also be formed by a vacuum evaporation method or a plating method. Then the second
Polyimide resin was used as the insulating film. The upper magnetic core 4, like the lower magnetic core 3, was formed from a Ni--Fe alloy by sputtering. Here, a film with a magnetostriction constant of almost zero, a film with a magnetostriction constant of 2×10 -6 and a film with a magnetostriction constant of -2×10 -6 were fabricated. Ion milling was used to pattern the lower magnetic core 3, magnetic gap G, insulating film, coil conductor 5, second insulating film, and upper magnetic core 4. In addition to the ion milling method, a sputter etching method or a chemical etching method may be used as the patterning method. Next, a terminal portion was formed by plating, and a protective film 7 of Al 2 O 3 was formed by sputtering. Next, the surface facing the recording medium, which serves as the air bearing surface, was machined to test the electromagnetic conversion characteristics of the thin-film magnetic head. The recording medium used in the test was γ-Fe 2 O 3 magnetic powder. The peripheral speed is 40 m/s, and the floating spacing between the magnetic head and recording medium is
Tested at 0.35 μm. The electromagnetic conversion characteristics of the thin film magnetic head with magnetic cores having different magnetostriction constants are shown in Table 1.
【表】
この表から明らかなように、磁歪定数の絶対値
の小さい磁気コアから成る薄膜磁気ヘツドは良好
な電磁変換特性を示した。
以上述べたように、薄膜磁気ヘツドの構造およ
び製造工程からして必然的に磁気コアに応力が作
用するが、本発明の製造方法によれば磁気コアと
して磁歪定数の絶対値の小さい磁性膜を製造する
ことができ、応力が作用している下でも大きな透
磁率を有する薄膜磁気ヘツドを提供できる。また
本発明の薄膜磁気ヘツド製造方法は電磁変換特性
が良好でかつバラツキが少ない薄膜磁気ヘツドが
提供できるという効果がある。[Table] As is clear from this table, the thin film magnetic head consisting of a magnetic core with a small absolute value of magnetostriction constant exhibited good electromagnetic conversion characteristics. As described above, stress inevitably acts on the magnetic core due to the structure and manufacturing process of the thin film magnetic head, but according to the manufacturing method of the present invention, a magnetic film with a small absolute value of the magnetostriction constant is used as the magnetic core. It is possible to provide a thin film magnetic head that can be manufactured and has high magnetic permeability even under stress. Further, the method for manufacturing a thin film magnetic head of the present invention has the advantage that a thin film magnetic head with good electromagnetic conversion characteristics and less variation can be provided.
第1図は本発明薄膜磁気ヘツドの一実施例を示
す概略斜視図、第2図は下部磁気コアの応力発生
状況を示す斜視図、第3図は上部磁気コアの応力
発生状況を示す斜視図、第4図は応力による透磁
率の変化を示す特性曲線図、第5図は磁化困難軸
応力と比透磁率の関係を磁歪定数をパラメータと
して示した特性曲線図である。
1…絶縁基板、2…下地膜、3…下部磁気コ
ア、4…上部磁気コア、G…磁気ギヤツプ、5…
コイル、6…絶縁物、7…保護膜。
FIG. 1 is a schematic perspective view showing an embodiment of the thin-film magnetic head of the present invention, FIG. 2 is a perspective view showing how stress is generated in the lower magnetic core, and FIG. 3 is a perspective view showing how stress is generated in the upper magnetic core. , FIG. 4 is a characteristic curve diagram showing changes in magnetic permeability due to stress, and FIG. 5 is a characteristic curve diagram showing the relationship between hard axis stress and relative magnetic permeability using the magnetostriction constant as a parameter. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Base film, 3... Lower magnetic core, 4... Upper magnetic core, G... Magnetic gap, 5...
Coil, 6...insulator, 7...protective film.
Claims (1)
磁気コア上に磁気ギヤツプを形成し、該磁気ギヤ
ツプより上にコイル導体を形成し、該コイル導体
相互間及び前記コイル導体上に絶縁膜を形成し、
該絶縁膜上に一端が前記下部磁気コアの一端に接
し、他端が前記下部磁気コアの他端に磁気ギヤツ
プを介して対向する上部磁気コアを形成すること
を含む薄膜磁気ヘツドの製造方法において、 少なくとも前記上部磁気コアが、スパツタ法に
より組成制御されたNi−Fe系合金からなり、前
記上部磁気コア面と平行な面な(111)面又は
(100)面が多くなるように結晶配向を制御して形
成され、前記上部磁気コア形成後に熱処理し、磁
歪定数を絶対値で1×10-6以下とすることを特徴
とする薄膜磁気ヘツドの製造方法。[Claims] 1. A lower magnetic core is formed on an insulating substrate, a magnetic gap is formed on the lower magnetic core, a coil conductor is formed above the magnetic gap, and a coil conductor is formed between the coil conductors and the coil. Forming an insulating film on the conductor,
A method for manufacturing a thin film magnetic head, comprising forming an upper magnetic core on the insulating film, one end of which is in contact with one end of the lower magnetic core, and the other end of which is opposed to the other end of the lower magnetic core via a magnetic gap. , at least the upper magnetic core is made of a Ni-Fe alloy whose composition is controlled by a sputtering method, and the crystal orientation is such that there are many (111) planes or (100) planes parallel to the upper magnetic core surface. 1. A method for manufacturing a thin film magnetic head, characterized in that the upper magnetic core is formed under controlled conditions, and is heat treated after forming the upper magnetic core, so that the absolute value of the magnetostriction constant is 1×10 -6 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17831381A JPS5880120A (en) | 1981-11-09 | 1981-11-09 | Thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17831381A JPS5880120A (en) | 1981-11-09 | 1981-11-09 | Thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5880120A JPS5880120A (en) | 1983-05-14 |
| JPH0213363B2 true JPH0213363B2 (en) | 1990-04-04 |
Family
ID=16046288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17831381A Granted JPS5880120A (en) | 1981-11-09 | 1981-11-09 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5880120A (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5528212A (en) * | 1978-08-17 | 1980-02-28 | Tokyo Kasoode Kenkyusho:Kk | Indirectly-heated cathode structure |
| US4242710A (en) * | 1979-01-29 | 1980-12-30 | International Business Machines Corporation | Thin film head having negative magnetostriction |
| JPS57207308A (en) * | 1981-06-15 | 1982-12-20 | Akai Electric Co Ltd | Amorphous soft magnetic thin film |
-
1981
- 1981-11-09 JP JP17831381A patent/JPS5880120A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5880120A (en) | 1983-05-14 |
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