JPH02135277U - - Google Patents

Info

Publication number
JPH02135277U
JPH02135277U JP4302989U JP4302989U JPH02135277U JP H02135277 U JPH02135277 U JP H02135277U JP 4302989 U JP4302989 U JP 4302989U JP 4302989 U JP4302989 U JP 4302989U JP H02135277 U JPH02135277 U JP H02135277U
Authority
JP
Japan
Prior art keywords
cover
metal fitting
binder metal
fixed
computer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4302989U
Other languages
English (en)
Other versions
JPH0547668Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4302989U priority Critical patent/JPH0547668Y2/ja
Publication of JPH02135277U publication Critical patent/JPH02135277U/ja
Application granted granted Critical
Publication of JPH0547668Y2 publication Critical patent/JPH0547668Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Sheet Holders (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例であるコンピユータ
ー用フアイルの要部の横断面図、第２図は同フア
イルの表紙要部の横断面図、第３図は本考案のフ
アイルにコンピユーターにより打ち出された連続
用紙を綴込んで、それを閲覧する状態を示した横
断面図、第４図は従来のコンピユーター用フアイ
ルの横断面図、第５図乃至第７図は従来のフアイ
ルの閲覧の際の状態を示した横断面図である。 １……バインダー金具、２……綴込杵、３……
固定板、４……可動板、５……表紙、７……折り
返し部、９……背部、１０……折曲げ部、１０ａ
，１０ｂ……折り返し部、２０……連続用紙、３
０……表紙、３１，３２……折り返し部、３３…
…背部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 綴込杵を一定の間隔に列設した固定板と、綴込
    杵の上端を被覆又は開放するように固定板に回動
    可能に蝶着された可動板を有したバインダー金具
    を表紙に固着し、所謂コンピユーターにより打ち
    出された連続用紙を綴込むようにしたコンピユー
    ター用フアイルに於いて、表紙５にバインダー金
    具１を固着し、且つ連続用紙を綴込んだ反対側で
    、表紙５に隣接した２条の折り返し部１０ａ，１
    ０ｂを形成して外側に自在に折り曲げて略密着可
    能とした折曲げ部１０を構成すると共に、表紙５
    に上記バインダー金具１の上端位置で折り返し部
    ７を形成して背部９を設けたことを特徴とするコ
    ンピユーター用フアイル。
JP4302989U 1989-04-14 1989-04-14 Expired - Lifetime JPH0547668Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4302989U JPH0547668Y2 (ja) 1989-04-14 1989-04-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4302989U JPH0547668Y2 (ja) 1989-04-14 1989-04-14

Publications (2)

Publication Number Publication Date
JPH02135277U true JPH02135277U (ja) 1990-11-09
JPH0547668Y2 JPH0547668Y2 (ja) 1993-12-15

Family

ID=31555090

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4302989U Expired - Lifetime JPH0547668Y2 (ja) 1989-04-14 1989-04-14

Country Status (1)

Country Link
JP (1) JPH0547668Y2 (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
KR20060079144A (ko) 2003-06-18 2006-07-05 어플라이드 머티어리얼스, 인코포레이티드 배리어 물질의 원자층 증착

Also Published As

Publication number Publication date
JPH0547668Y2 (ja) 1993-12-15

Similar Documents

Publication Publication Date Title
JPH0547668Y2 (ja)
JPH02106380U (ja)
JPH02106379U (ja)
JPH0319071U (ja)
JPS586716Y2 (ja) 箱型バインダ−
JPS6017336Y2 (ja) ル−ズリ−フ・バインダ−の表装カバ−
JPS6113342Y2 (ja)
JPS5826142Y2 (ja) 帳面等の綴込み体のカバ−
JPS6123426Y2 (ja)
JPH0123832Y2 (ja)
JPH0430971U (ja)
JPS6193273U (ja)
JPS6024630Y2 (ja) バインダ−
JPH0323485U (ja)
JPS63170270U (ja)
JPS61138575U (ja)
JPH02126890U (ja)
JPS6150479U (ja)
JPS63124175U (ja)
JPH01175871U (ja)
JPS6114452Y2 (ja)
JPH02106378U (ja)
JPH01104384U (ja)
JPH03106083U (ja)
JPH0620063U (ja) 綴込表紙

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term