JPH0213762U - - Google Patents
Info
- Publication number
- JPH0213762U JPH0213762U JP9069788U JP9069788U JPH0213762U JP H0213762 U JPH0213762 U JP H0213762U JP 9069788 U JP9069788 U JP 9069788U JP 9069788 U JP9069788 U JP 9069788U JP H0213762 U JPH0213762 U JP H0213762U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- board
- holes
- back sides
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000037431 insertion Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例の斜視図であり、第２
図はスルーホール部の拡大図、第３図は本考案基
板のソケツト実装図である。
１……基板本体、２……ソケツトリードピンの
さし込み口、３……表面配線、４……裏面配線、
５……スルーホール、６……表面スルーホール接
続部、７……裏面スルーホール接続部、８……ス
ルーホール、９……ソケツトリードピンさし込み
口、１０……表面配線、１１……ＩＣ用ソケツト
、１２……ソケツトリードピン。
FIG. 1 is a perspective view of an embodiment of the present invention;
The figure is an enlarged view of the through-hole section, and FIG. 3 is a diagram of the socket mounted on the board of the present invention. 1... Board body, 2... Socket lead pin insertion port, 3... Surface wiring, 4... Back wiring,
5...Through hole, 6...Surface through hole connection part, 7...Back side through hole connection part, 8...Through hole, 9...Socket lead pin insertion opening, 10...Surface wiring, 11... IC socket, 12... socket lead pin.
Claims (1)
均一間隔でそれぞれ一列に設けられ、また表面と
裏面に互に直交する配線が施され、表裏面の配線
が基板の表面と裏面を貫通するスルーホールで接
続可能な構造を有し、本配線とスルーホールによ
り特定の孔同志を直結し配線構造を形成すること
を特徴とする配線基板。 Holes penetrating the front and back surfaces of the board are provided in a row at uniform intervals on both sides of the board, wiring is perpendicular to each other on the front and back sides, and the wiring on the front and back sides penetrates the front and back sides of the board. 1. A wiring board having a structure that allows connection through through holes, and forming a wiring structure by directly connecting specific holes with the main wiring and through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9069788U JPH0213762U (en) | 1988-07-08 | 1988-07-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9069788U JPH0213762U (en) | 1988-07-08 | 1988-07-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0213762U true JPH0213762U (en) | 1990-01-29 |
Family
ID=31315210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9069788U Pending JPH0213762U (en) | 1988-07-08 | 1988-07-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0213762U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60185613U (en) * | 1984-05-15 | 1985-12-09 | 渡辺 義雄 | gloves |
-
1988
- 1988-07-08 JP JP9069788U patent/JPH0213762U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60185613U (en) * | 1984-05-15 | 1985-12-09 | 渡辺 義雄 | gloves |