JPH02137687A - Laser light condensing device - Google Patents
Laser light condensing deviceInfo
- Publication number
- JPH02137687A JPH02137687A JP63292056A JP29205688A JPH02137687A JP H02137687 A JPH02137687 A JP H02137687A JP 63292056 A JP63292056 A JP 63292056A JP 29205688 A JP29205688 A JP 29205688A JP H02137687 A JPH02137687 A JP H02137687A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- section
- laser beam
- optical system
- cylindrical lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
この発明は、レーザビームを被加工物に照射して、切断
、Nl@接等のレーザ加工を行うレーザ集光装置に関す
る。The present invention relates to a laser focusing device that irradiates a workpiece with a laser beam to perform laser processing such as cutting and Nl@ contact.
従来固体レーザ例えばYAGレーザから発振するレーザ
ビームは、断面が円形をしていて、集光されたスポット
も円形である。一方、金属板例えば板厚0.5鵬の軟鋼
板やステンレス板を重ね合わせシーム溶接する場合、パ
ルスYAG レーザは熱変色、熱歪を小さく抑えること
ができるので、通常よく使用されている。
第3図は、X−Yテーブル上に載置された被加工物をX
軸方向にシーム溶接する従来例によるレーザ集光装置の
概略図で、レーザ発振器1からレーザビーム2を発振さ
せ、エキスパンダレンズ3でレーザビーム径を拡大し、
反射ミラー4で反射させ、集光レンズ5で集光してX−
Yテーブル6に載せた被加工物7に照射させ、被加工物
7上に円形の集光スポット溶接部8を形成する。この際
、被加工物7をX軸のB矢印方向に移動させ、円形の集
光スポット溶接部8の重なりによってシーム溶接部9を
形成していた。
第4図は第3図のレーザ集光装置による円形の集光スポ
ット溶接部の軌跡を示す・図である。
パルスYAG レーザ発振器1から発振するレーザビー
ム2のパルス数(回/秒)と、X−Yテーブル6のテー
ブルの送り速度(mm/秒)とにより、第4図に示すよ
うに円形の集光スポット溶接部8が、お互いに重なる範
囲内の関係を保ちなからシーム溶接することが必要とな
る。Conventionally, a laser beam emitted from a solid-state laser, such as a YAG laser, has a circular cross section, and the focused spot also has a circular shape. On the other hand, when overlapping and seaming welding metal plates, such as mild steel plates or stainless steel plates with a plate thickness of 0.5 mm, a pulsed YAG laser is commonly used because it can suppress thermal discoloration and thermal distortion to a small level. Figure 3 shows the workpiece placed on the X-Y table.
This is a schematic diagram of a conventional laser focusing device that performs seam welding in the axial direction, in which a laser beam 2 is oscillated from a laser oscillator 1, and the diameter of the laser beam is expanded with an expander lens 3.
The light is reflected by the reflecting mirror 4 and focused by the condensing lens 5 to
A workpiece 7 placed on a Y-table 6 is irradiated with the light to form a circular focused spot weld 8 on the workpiece 7. At this time, the workpiece 7 was moved in the direction of arrow B on the X axis, and a seam weld 9 was formed by overlapping the circular condensed spot welds 8. FIG. 4 is a diagram showing the locus of a circular focused spot welded part by the laser focusing device of FIG. 3. FIG. Pulsed YAG Depending on the number of pulses (times/second) of the laser beam 2 oscillated from the laser oscillator 1 and the table feed speed (mm/second) of the X-Y table 6, the light is focused in a circular shape as shown in FIG. It is necessary to seam weld the spot welds 8 while maintaining the relationship within the range where they overlap with each other.
溶接速度を上げるには、発振レーザのパルスを多くして
、かつX−Yテーブル6の送り速度を速(すればよいが
、実際にはこの溶接速度は、被加工物の板厚やレーザ発
振器1の最大発振パルス数の性能上の限度によって決ま
る。よって単にX−Yテーブル6の送り速度の調節だけ
では溶接速度をある速度以上には速められないという問
題があった。
この発明は、前記従来の問題点を除去し、最大発振パル
ス数に性能上の限度があるレーザ発振器を用いても、従
来以上の溶接速度でシーム溶接を行うことが可能なレー
ザ集光装置を提供することを目的とする。To increase the welding speed, increase the number of pulses of the oscillating laser and increase the feed speed of the The welding speed is determined by the performance limit of the maximum number of oscillation pulses of 1. Therefore, there is a problem that the welding speed cannot be increased above a certain speed simply by adjusting the feed speed of the X-Y table 6. The purpose of the present invention is to provide a laser focusing device that eliminates the problems of the conventional method and can perform seam welding at a welding speed higher than that of the conventional method even when using a laser oscillator that has a performance limit on the maximum number of oscillation pulses. shall be.
【課題を解決するための手段]
上記目的は、凹形シリンドリカルレンズと凸形シリンド
リカルレンズとを容器に収容してなり、レーザ発振器か
ら発振された断面円形のレーザビームを、断面楕円形に
変形するとともに、光軸中心に対し回転可能としたビー
ム成形光学系を備えたレーザ集光装置によって達成され
る。
【作 用】
レーザビームを断面楕円形に変形するビーム成形光学系
を備えたので、被加工物に楕円形の集光スポットを当て
るため、スポットが長くなり溶接を速やかにできる。ま
たビーム成形光学系を光軸に対し回転させることにより
、溶接の方向を任意に変えることができる。[Means for solving the problem] The above object is to transform a laser beam having a circular cross section emitted from a laser oscillator into an elliptical cross section by housing a concave cylindrical lens and a convex cylindrical lens in a container. This is also achieved by a laser focusing device equipped with a beam shaping optical system that is rotatable about the optical axis. [Function] Equipped with a beam shaping optical system that transforms the laser beam into an elliptical cross-section, the elliptical focused spot is applied to the workpiece, making the spot longer and allowing for faster welding. Furthermore, by rotating the beam shaping optical system with respect to the optical axis, the direction of welding can be changed arbitrarily.
以下図面に基づいてこの発明の詳細な説明する。第1図
はこの発明の実施例によるレーザ集光装置の概略図であ
る。
第1図において、例えばパルスYAGレーザ発振器1か
ら発振したレーザビーム2は断面円形であるが、凹形シ
リンドリカルレンズ10と凸形シリンドリカルレンズ1
1とを容器である円筒12に収容したビーム成形光学系
13によって断面略楕円形に変形され、反射ミラー4で
反射され集光レンズ5で集光され、X−Yテーブル6に
載せられた被加工物7に照射され楕円形の集光スポット
溶接部14が形成される。
X−Yテーブル6に載せられた被加工物7をy軸に沿っ
て矢印入方向に移動させれば、被加工物7はシーム溶接
されシーム溶接部15が形成される。
第2図は第1図のレーザ集光装置による楕円形の集光ス
ポット溶接部14の拡大図であり、楕円形の集光スポッ
ト溶接部14の楕円の長径方向とシーム溶接の方向とが
一致するように、前記ビーム成形光学系13の円筒12
を第1図のごとき方向に配置している。
また、被加工物7のY軸方向にシーム溶接する場合には
、前記ビーム成形光学系13の円筒12のy軸をX軸方
向へ90’だけ回転すれば、レーザビームの楕円形の集
光スポット溶接部14の長径方向はY軸方向に向(よう
になる。
シーム溶接方向をy軸とY軸との中間方向即ちX軸方向
から45°傾いた方向に溶接する場合は、前記ビーム成
形光学系13の円筒12のy軸をX軸方向に45°だけ
回転すればよい。
この発明は、シーム溶接だけでなく、ガラス基板上に成
膜された例えばa−86太陽電池のような透明導電膜(
TCO膜という)やa−5,膜など、レーザバターニン
グ加工に対しても、高速度の加工が達成できる。The present invention will be described in detail below based on the drawings. FIG. 1 is a schematic diagram of a laser focusing device according to an embodiment of the present invention. In FIG. 1, for example, a laser beam 2 oscillated from a pulsed YAG laser oscillator 1 has a circular cross section, but a concave cylindrical lens 10 and a convex cylindrical lens 1
1 is deformed into a substantially elliptical cross section by a beam shaping optical system 13 housed in a cylinder 12, which is a container, reflected by a reflection mirror 4, and condensed by a condensing lens 5. The workpiece 7 is irradiated to form an elliptical focused spot weld 14. When the workpiece 7 placed on the X-Y table 6 is moved in the direction of the arrow along the y-axis, the workpiece 7 is seam welded and a seam weld 15 is formed. FIG. 2 is an enlarged view of the elliptical focused spot welding part 14 produced by the laser condenser shown in FIG. The cylinder 12 of the beam shaping optical system 13 is
are arranged in the direction shown in Figure 1. In addition, when seam welding the workpiece 7 in the Y-axis direction, by rotating the y-axis of the cylinder 12 of the beam shaping optical system 13 by 90' in the X-axis direction, the laser beam can be focused in an elliptical shape. The long axis direction of the spot welded portion 14 is directed toward the Y-axis direction. When the seam welding direction is welded in the middle direction between the Y-axis and the Y-axis, that is, in a direction inclined at 45 degrees from the X-axis direction, the beam forming It is only necessary to rotate the y-axis of the cylinder 12 of the optical system 13 by 45 degrees in the X-axis direction.This invention is applicable not only to seam welding but also to Conductive film (
High-speed processing can also be achieved for laser patterning processing such as TCO film) and A-5 film.
この発明によれば、凹形シリンドリカルレンズと凸形シ
リンドリカルレンズを円筒に収容してなり、レーザ発振
器から発振された円形のレーザビームを、楕円形に変形
するとともに、光軸中心に対し回転可能なビーム成形光
学系を備えたので、楕円形の細長い集光スポットが得ら
れ、しかも任意の方向に楕円形の長径方向を変えること
ができる。従ってシーム溶接及びレーザパターニング加
工を任意の方向に従来の円形スポットの場合よりも高速
に行うことができる。According to this invention, a concave cylindrical lens and a convex cylindrical lens are housed in a cylinder, and the circular laser beam emitted from the laser oscillator is transformed into an elliptical shape, and is rotatable about the optical axis center. Since the beam shaping optical system is provided, an elongated elliptical focused spot can be obtained, and the major axis direction of the ellipse can be changed in any direction. Therefore, seam welding and laser patterning can be performed in any direction faster than with conventional circular spots.
第1図はこの発明の実施例によるレーザ集光装置の概略
図、第2図は第1図のレーザ集光装置による楕円形の集
光スポットの軌跡を示す図、第3図は従来例によるレー
ザ集光装置の概略図、第4図は第3図のレーザ集光装置
による円形の集光スポットの軌跡を示す図である。
1;レーザ発振器、2;レーザビーム、7:被加工物、
10:凹形シリンドリカルレンズ、11:凸形シリンド
リカルレンズ、12;円筒、13:ビーム成形光学系。Fig. 1 is a schematic diagram of a laser condensing device according to an embodiment of the present invention, Fig. 2 is a diagram showing the locus of an elliptical focused spot by the laser condensing device of Fig. 1, and Fig. 3 is a diagram according to a conventional example. FIG. 4 is a schematic diagram of a laser condensing device, and is a diagram showing the locus of a circular condensed spot by the laser condensing device of FIG. 3. 1; Laser oscillator, 2; Laser beam, 7: Workpiece,
10: concave cylindrical lens, 11: convex cylindrical lens, 12: cylinder, 13: beam shaping optical system.
Claims (1)
ンズとを円筒に収容してなり、レーザ発振器から発振さ
れた断面円形のレーザビームを、断面楕円形に変形する
とともに、光軸中心に対し回転可能としたビーム成形光
学系を備えたことを特徴とするレーザ集光装置。1) A concave cylindrical lens and a convex cylindrical lens are housed in a cylinder, which transforms a laser beam with a circular cross section emitted from a laser oscillator into an elliptical cross section and makes it rotatable about the optical axis center. A laser focusing device characterized by being equipped with a beam shaping optical system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63292056A JPH02137687A (en) | 1988-11-18 | 1988-11-18 | Laser light condensing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63292056A JPH02137687A (en) | 1988-11-18 | 1988-11-18 | Laser light condensing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02137687A true JPH02137687A (en) | 1990-05-25 |
Family
ID=17776969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63292056A Pending JPH02137687A (en) | 1988-11-18 | 1988-11-18 | Laser light condensing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02137687A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0494171U (en) * | 1990-12-28 | 1992-08-14 | ||
| WO1994013015A1 (en) * | 1992-11-24 | 1994-06-09 | Hitachi Construction Machinery Co., Ltd. | Lead frame manufacturing method |
| JPH06182573A (en) * | 1992-12-21 | 1994-07-05 | Mitsubishi Electric Corp | Laser processing machine |
| WO1996012300A1 (en) * | 1994-10-13 | 1996-04-25 | Hitachi Construction Machinery Co., Ltd. | Device and method for machining dam bar |
| WO2004085108A1 (en) * | 1993-08-05 | 2004-10-07 | Nobuhiko Tada | Lead frame machining method and lead frame machining apparatus |
| WO2005101487A1 (en) * | 2004-04-19 | 2005-10-27 | Eo Technics Co., Ltd. | Laser processing apparatus |
| JP2007185687A (en) * | 2006-01-13 | 2007-07-26 | National Institute Of Advanced Industrial & Technology | Laser processing equipment |
| JP2007229725A (en) * | 2006-02-27 | 2007-09-13 | Laserfront Technologies Inc | Laser processing method |
| JP2007275962A (en) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | Laser processing equipment |
| US7312417B2 (en) * | 2003-09-19 | 2007-12-25 | Daimlerchrysler Ag | Laser beam seam welding with prior laser spot welding |
| JP2008062289A (en) * | 2006-09-11 | 2008-03-21 | Disco Abrasive Syst Ltd | Laser processing method and laser processing apparatus |
| WO2010123035A1 (en) * | 2009-04-22 | 2010-10-28 | 株式会社Ihi検査計測 | Method of hybrid welding and hybrid welding apparatus |
| EP2628564A4 (en) * | 2010-10-15 | 2017-09-27 | Mitsubishi Heavy Industries, Ltd. | Laser cutting device and laser cutting method |
| KR20220056637A (en) * | 2020-10-28 | 2022-05-06 | 삼성에스디아이 주식회사 | Laser welding method and laser welding devicefor secondary battery |
-
1988
- 1988-11-18 JP JP63292056A patent/JPH02137687A/en active Pending
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0494171U (en) * | 1990-12-28 | 1992-08-14 | ||
| WO1994013015A1 (en) * | 1992-11-24 | 1994-06-09 | Hitachi Construction Machinery Co., Ltd. | Lead frame manufacturing method |
| US5548890A (en) * | 1992-11-24 | 1996-08-27 | Hitachi Construction Machinery Co., Ltd. | Lead frame processing method |
| JPH06182573A (en) * | 1992-12-21 | 1994-07-05 | Mitsubishi Electric Corp | Laser processing machine |
| WO2004085108A1 (en) * | 1993-08-05 | 2004-10-07 | Nobuhiko Tada | Lead frame machining method and lead frame machining apparatus |
| WO1996012300A1 (en) * | 1994-10-13 | 1996-04-25 | Hitachi Construction Machinery Co., Ltd. | Device and method for machining dam bar |
| US5662822A (en) * | 1994-10-13 | 1997-09-02 | Hitachi Construction Machinery Co., Ltd. | Dam bar cutting apparatus and dam bar cutting method |
| US7312417B2 (en) * | 2003-09-19 | 2007-12-25 | Daimlerchrysler Ag | Laser beam seam welding with prior laser spot welding |
| US7688492B2 (en) | 2004-04-19 | 2010-03-30 | Eo Technics Co., Ltd. | Laser processing apparatus |
| WO2005101487A1 (en) * | 2004-04-19 | 2005-10-27 | Eo Technics Co., Ltd. | Laser processing apparatus |
| JP2007185687A (en) * | 2006-01-13 | 2007-07-26 | National Institute Of Advanced Industrial & Technology | Laser processing equipment |
| JP2007229725A (en) * | 2006-02-27 | 2007-09-13 | Laserfront Technologies Inc | Laser processing method |
| JP2007275962A (en) * | 2006-04-10 | 2007-10-25 | Disco Abrasive Syst Ltd | Laser processing equipment |
| US8610030B2 (en) | 2006-04-10 | 2013-12-17 | Disco Corporation | Laser beam processing machine |
| JP2008062289A (en) * | 2006-09-11 | 2008-03-21 | Disco Abrasive Syst Ltd | Laser processing method and laser processing apparatus |
| WO2010123035A1 (en) * | 2009-04-22 | 2010-10-28 | 株式会社Ihi検査計測 | Method of hybrid welding and hybrid welding apparatus |
| JPWO2010123035A1 (en) * | 2009-04-22 | 2012-10-25 | 株式会社Ihi検査計測 | Hybrid welding method and hybrid welding apparatus |
| EP2628564A4 (en) * | 2010-10-15 | 2017-09-27 | Mitsubishi Heavy Industries, Ltd. | Laser cutting device and laser cutting method |
| KR20220056637A (en) * | 2020-10-28 | 2022-05-06 | 삼성에스디아이 주식회사 | Laser welding method and laser welding devicefor secondary battery |
| JP2022071860A (en) * | 2020-10-28 | 2022-05-16 | 三星エスディアイ株式会社 | Laser welding method and laser welding equipment for secondary batteries |
| US11806807B2 (en) | 2020-10-28 | 2023-11-07 | Samsung Sdi Co., Ltd. | Laser welding method and laser welding device for secondary battery |
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