JPH02138435U - - Google Patents

Info

Publication number
JPH02138435U
JPH02138435U JP1989047025U JP4702589U JPH02138435U JP H02138435 U JPH02138435 U JP H02138435U JP 1989047025 U JP1989047025 U JP 1989047025U JP 4702589 U JP4702589 U JP 4702589U JP H02138435 U JPH02138435 U JP H02138435U
Authority
JP
Japan
Prior art keywords
island
resin
semiconductor device
semiconductor chip
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989047025U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989047025U priority Critical patent/JPH02138435U/ja
Publication of JPH02138435U publication Critical patent/JPH02138435U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の断面図、第２図は
従来例の樹脂封止型半導体装置の一例の断面図で
ある。 １……アイランド、２……ＩＣチツプ、３……
ソルダ層、４……内部リード先端部、５……金ワ
イヤ、６……樹脂封止部、７……ＩＣ、８……ア
イランド突起部、９……シリコーン樹脂部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体チツプを載置したアイランドと、該アイ
    ランド周辺に配置された内部リードとを含めた樹
    脂封止型半導体装置において、前記半導体チツプ
    及び前記アイランドの側面部に絶縁性の応力吸収
    部を設けたことを特徴とする樹脂封止型半導体装
    置。
JP1989047025U 1989-04-21 1989-04-21 Pending JPH02138435U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989047025U JPH02138435U (ja) 1989-04-21 1989-04-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989047025U JPH02138435U (ja) 1989-04-21 1989-04-21

Publications (1)

Publication Number Publication Date
JPH02138435U true JPH02138435U (ja) 1990-11-19

Family

ID=31562598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989047025U Pending JPH02138435U (ja) 1989-04-21 1989-04-21

Country Status (1)

Country Link
JP (1) JPH02138435U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288566A (ja) * 2007-04-20 2008-11-27 Nec Electronics Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008288566A (ja) * 2007-04-20 2008-11-27 Nec Electronics Corp 半導体装置

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