JPH0330437U - - Google Patents

Info

Publication number
JPH0330437U
JPH0330437U JP1989090043U JP9004389U JPH0330437U JP H0330437 U JPH0330437 U JP H0330437U JP 1989090043 U JP1989090043 U JP 1989090043U JP 9004389 U JP9004389 U JP 9004389U JP H0330437 U JPH0330437 U JP H0330437U
Authority
JP
Japan
Prior art keywords
die pad
pad portion
semiconductor device
insulating material
electrically insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989090043U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989090043U priority Critical patent/JPH0330437U/ja
Publication of JPH0330437U publication Critical patent/JPH0330437U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/581—Auxiliary members, e.g. flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図はこの考案の一実施例による半導体装置
のチツプの接続状態を示す平面図、第２図は第１
図の側断面図、第３図は従来の半導体装置のチツ
プの接続状態を示す平面図、第４図は第３図の側
断面図である。 図において、１……半導体チツプ、２……ワイ
ヤボンデイングパツド、３……ダイパツド、４…
…リード、５……ワイヤ、６……電気的絶縁性材
料を示す。なお、図中、同一符号は同一、又は相
当部分を示す。

Claims (1)

    【実用新案登録請求の範囲】
  1. チツプが搭載されるダイパツド部の周辺と、こ
    のダイパツド部周辺のエツジ部を電気的絶縁性材
    料を用いて被覆絶縁した事を特徴とする半導体装
    置。
JP1989090043U 1989-07-31 1989-07-31 Pending JPH0330437U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989090043U JPH0330437U (ja) 1989-07-31 1989-07-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989090043U JPH0330437U (ja) 1989-07-31 1989-07-31

Publications (1)

Publication Number Publication Date
JPH0330437U true JPH0330437U (ja) 1991-03-26

Family

ID=31639587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989090043U Pending JPH0330437U (ja) 1989-07-31 1989-07-31

Country Status (1)

Country Link
JP (1) JPH0330437U (ja)

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