JPH0213935B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to lead frames, and particularly to tape and lead frames.
The present invention relates to a lead frame used for integrated circuits manufactured by a carrier method.

In the tape carrier method, an electrode of a semiconductor pellet is directly attached to a lead pattern closely attached to a long flexible insulating film made of polyimide resin, etc., and the inner lead is bonded by thermocompression.
This is an assembly method that involves bonding.

FIG. 1 is a plan view of an example of a conventional lead frame.

A sprocket hole 2 for sequentially feeding the tape, a device hole 4 for storing the semiconductor pellet 3, and a bonding hole 6 for performing outer lead bonding are formed in a tape 1 made of polyimide film, and the tape is tightly attached to the tape. Then, the leads 5 are formed. A support frame is suspended between the device hole 4 and the bonding hole 6 by a frame hanger 7, and the tips of the leads 5 are bonded to the electrodes of the semiconductor pellet 3. is connected to a bonding hole 6 for bonding to a ceramic case or the like, and its outer end is connected to a pad 8 for contacting a probe when measuring the electrical characteristics of the semiconductor pellet 3. The semiconductor pellet 3 that was judged to be good after conducting an electrical test using the pad 8 was cut along the broken line of the bonding hole 6, mounted in a ceramic case, and bonded to the pin of the case by thermocompression. Ru.

In recent years, as semiconductor pellet circuit patterns have become denser and the number of electrodes has exceeded 100, the size of the semiconductor pellet has increased and the device holes on the tape have also become larger. Along with this, bonding holes must also be provided outside the center of the pattern.
However, the number of bonding holes is limited by the tape width, and the number of electrodes is also limited. One possible way to solve this problem is to narrow the lead pitch and lead width in the bonding hole, but there are problems such as the lead width and lead pitch of the ceramic case to be mounted cannot be narrowed any further at present. . In addition, the inner lead
As the number of electrodes increases, the lead length between the bonding part and the outer lead/bonding part becomes larger between the center and the edge of one side of the semiconductor pellet. For this reason, there is a drawback that the strain of thermocompression bonding is unevenly applied to the leads, making it easy to cause defects such as deformation and shorting.

The present invention eliminates the above-mentioned drawbacks, allows the lead pitch to be the same as before, and increases the number of electrodes, thereby suppressing the occurrence of defects such as deformation and shorts due to uneven distortion of the leads during thermocompression bonding. This provides a lead frame that can be used to

The present invention is characterized in that in a lead frame in which a lead pattern is formed in close contact with a long flexible insulating film, a bonding hole in the insulating film has an arc band shape.

Further, outer lead bonding portions of the lead frame pattern are formed radially outward.

Next, embodiments of the present invention will be described using the drawings.

FIG. 2 is a plan view of one embodiment of the present invention.

A tape 11 made of an insulating film such as polyimide film has a sprocket hole 12 for sequentially feeding the tape, a device hole 14 for storing semiconductor pellets 13, and a semiconductor pellet 1.
Open a bonding hole 16 in the shape of an arc band centered at lead 1, and attach it tightly to this tape.
form 5. This lead pattern is formed radially around the semiconductor pellet 13 and has a substantially uniform lead length. Device hole 14
A support frame is provided between the lead 15 and the bonding hole 16 by a frame hanger 17, and the tip of the lead 15 is bonded to the electrode of the semiconductor pellet 13. - It is connected to a bonding hole 16 for bonding to a case etc., and its outer end is connected to a pad 18 for contacting a probe when measuring the electrical characteristics of the semiconductor pellet 13.
The pad 18 was used for an electrical test, and the semiconductor pellet 13, which was determined to be a good product, was cut along the broken line of the bonding hole 16, mounted on a ceramic case, etc., and bonded to the pin of the case by thermocompression. Thus, a semiconductor device is obtained.

With the above structure, the number of electrodes that can be used in the prior art was limited due to restrictions such as tape width, but the bonding hole has an arcuate band and the lead pattern faces outward in a radial pattern. This allows the lead pitch to be bonded to the case to be the same as before, and the number of electrodes can be increased. In addition, the lead length, which had been uneven, has become almost uniform, so there is no abnormal deformation and no shot defects.

As explained in detail above, according to the present invention,
The lead pitch can be kept the same as before, and the number of electrodes can be increased, and a lead frame can be obtained that can suppress lead deformation and defects such as shoots, so this is highly effective.

[Brief explanation of drawings]

FIG. 1 is a plan view of an example of a conventional lead frame, and FIG. 2 is a plan view of an embodiment of the present invention. 1,11...Tape, 2,12...Sprocket hole, 3,13...Semiconductor pellet, 4,
14...Device hole, 5,15...Lead, 6,16...Bonding hole, 7,1
7... Frame hanging, 8,18... Padded.

Claims (1)

[Scope of Claims] 1. A lead frame in which a lead pattern is formed in close contact with a long flexible insulating film, characterized in that a bonding hole in the insulating film has an arc band shape. flame. 2 Outer lead of lead frame pattern
The lead frame according to claim 1, wherein the bonding portion is formed radially outward.