JPS6373531A - Carrier tape - Google Patents

Abstract

PURPOSE:To obtain the accuracy of electric test and positioning of installation independent of whether the hole of a sprocket has defects or not, and improve the yield in a manufacturing process, by providing positioning holes of exclusive use for electric test and installation independent of sprocket boles as tape carring holes. CONSTITUTION:On an insulative film 1 which is made of polyimide resin and the like and has flexibility, conductive leads 3 are closely contacted. On both edges of a continuous length type insulative film 1, sprocket holes 2 for tape carrying are made at equal intervals. At the central part of the insulative film 1, a device hole 4 is made. correspondingly with the device hole 4, a pair of positioning holes 6 for electric test and istallation is made, and a lot of the same lead pattern are continuously formed on the continuous length type film 1. Applying this carrier tape, projection electrodes arranged on a semiconductor device 5 and the leads 3 are subjected to a thermocompression bonding, and an automatic assembling process is continuously progressed.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a carrier tape for assembling semiconductor devices;
In particular, it relates to carrier tapes used in tape carrier systems.

BACKGROUND ART Conventionally, one of the methods for assembling semiconductor devices is a tape carrier method. This will be explained using drawings.

Figure 3 shows the carrier used in the tape carrier method.
FIG. 3 shows a plan view of the tape.

A conductive lead 3 is closely attached to a visible insulating film 1 made of polyimide resin or the like. Sprocket holes 2 are formed at equal intervals on both sides of a long insulating film 1 as tape feeding holes, and a device hole 4 for inserting a semiconductor device (chip) is formed in the center. A large number of identical lead patterns are successively formed on the long film 1 in correspondence with the device holes 4.

The carrier tape is successively fed through the sprocket holes by a gear or the like having protrusions at the same pitch as the sprocket holes 2 of the carrier tape, and the semiconductor device 5 is
The protruding electrode provided on the lead frame and the tip 3a of the lead are bonded by thermocompression, and the assembly work is performed continuously and automatically.By this, the semiconductor can be assembled by simply bringing the probe into contact with the electrode pad 3b of the lead frame. The electrical characteristics of the device can be measured.

[Problem that the invention seeks to solve]

With the conventional carrier tape mentioned above, the sprocket holes are used as fulcrum points for positioning during electrical tests and when mounting as individual pieces, so if the sprocket holes are damaged or deformed, the positioning during testing or mounting is This method has the disadvantage that not only is it difficult, but also that positioning accuracy cannot be obtained.

In contrast to the conventional carrier tape described above, the present invention has an original content in that a positioning hole dedicated for electrical testing and mounting is provided in addition to the sprocket hole serving as the tape feeding hole.

[Means for solving problems]

The carrier tape of the present invention is a carrier tape in which an electrode lead pattern is formed on a long insulating film, and has feeding holes at both edges of the film.
It is characterized by having a positioning hole other than the feeding hole.

[Example 1] Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view of one embodiment of the present invention. A conductive glue 3 is closely attached to a visible insulating film 1 made of polyimide resin or the like. Sprocket holes 2 for tape feeding are opened at equal intervals on both edges of a long insulating film 1. Further, a device hole 4 is formed in the center of the insulating film 1. One set of positioning holes 6 for electrical testing and mounting are opened corresponding to the device holes 4, and a large number of identical lead patterns are continuously formed on the long film 1.

By using this carrier tape in the same manner as before, the protruding electrodes provided on the semiconductor device 5 and the leads 3 are bonded by thermocompression, and the assembly work is performed continuously and automatically.

[Embodiment 2] FIG. 2 is a plan view of Embodiment 2 of the present invention. Sprocket holes 2 are formed at both edges of the insulating film 1.

One pair of these sprocket holes is larger than the other holes and is opened as a positioning hole 6A. In this embodiment, since the positioning hole 6A is larger than the other holes, there is no contact with gears for tape feeding, etc., and there is an advantage that there is no damage due to shape deformation, cracks, etc.

〔Effect of the invention〕

As explained above, the present invention distinguishes between the sprocket hole used as the feed hole of the carrier tape and the positioning hole during electrical testing and mounting, so that electrical This allows for accurate testing and mounting positioning accuracy, and improves manufacturing yield.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a carrier tape according to one embodiment of the present invention, FIG. 2 is a plan view of a carrier tape according to another embodiment of the present invention, and FIG. 3 is a plan view of a conventional carrier tape. be. 1... Insulator film, 2... Sprocket hole, 3
...Lead, 3a... Lead tip, 3b... Electrode pad, 4... Device hole, 5... Semiconductor device,
6...Positioning hole. \can

Claims (1)

[Claims] A carrier tape in which an electrode lead pattern is formed on a long insulating film, and has feeding holes at both edges of the film, further comprising a positioning hole other than the feeding holes. carrier tape.