JPH0214191Y2 - - Google Patents
Info
- Publication number
- JPH0214191Y2 JPH0214191Y2 JP7247184U JP7247184U JPH0214191Y2 JP H0214191 Y2 JPH0214191 Y2 JP H0214191Y2 JP 7247184 U JP7247184 U JP 7247184U JP 7247184 U JP7247184 U JP 7247184U JP H0214191 Y2 JPH0214191 Y2 JP H0214191Y2
- Authority
- JP
- Japan
- Prior art keywords
- rising
- resin material
- external lead
- recess
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000000630 rising effect Effects 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 239000003990 capacitor Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 12
- 239000007787 solid Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本案は電子部品に関し、特に固体電解コンデン
サの製造月などの表示機構に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to electronic components, and particularly relates to a display mechanism for displaying the month of manufacture of solid electrolytic capacitors.
一盤にこの種固体電解コンデンサは例えば弁作
用を有する金属粉末を角柱状に加圧成形し焼結し
てなるコンデンサエレメントに予め弁作用を有す
る金属線を陽極リードとして植立し、この陽極リ
ードに板状の第1の外部リード部材を溶接すると
共に、コンデンサエレメントの電極引出し層に板
状の第2の外部リード部材を導電性接着剤を用い
て接続し、コンデンサエレメントの全周面を樹脂
剤にて、下面の中央部に突出部が形成されるよう
にモールド被覆し、かつ第1、第2の外部リード
部材の導出端を樹脂材の下面に沿うように屈曲配
置して構成されている。
This type of solid electrolytic capacitor is made by, for example, press-molding metal powder with a valve action into a prismatic shape and sintering it.A capacitor element is made of metal powder that has a valve action, and is then sintered.A metal wire that has a valve action is installed in advance as an anode lead, and the anode lead A plate-shaped first external lead member is welded to the capacitor element, and a plate-shaped second external lead member is connected to the electrode extraction layer of the capacitor element using a conductive adhesive, and the entire circumferential surface of the capacitor element is covered with resin. The resin material is molded and coated with a resin material so that a protrusion is formed at the center of the lower surface, and the lead-out ends of the first and second external lead members are bent along the lower surface of the resin material. There is.
ところで、この固体電解コンデンサにおいて、
樹脂材の上面には品種、特性、製造月、製造履歴
などを表示する記号が捺印されている関係で、そ
の表示記号を判読することによつてどのような内
容の固体電解コンデンサであるかを容易に知るこ
とができるものである。 By the way, in this solid electrolytic capacitor,
There is a symbol stamped on the top of the resin material that indicates the product type, characteristics, month of manufacture, manufacturing history, etc., and by reading the symbol, you can tell what type of solid electrolytic capacitor it is. It is something that can be easily known.
しかし乍ら、近時、軽薄短小化の傾向に伴ない
固体電解コンデンサに対しても例外なく、小形化
が強く要求されており、例えば2.54×4.57×2.54
mm程度に小形化されたものが実用化されている。 However, in recent years, with the trend towards smaller, lighter, thinner and smaller solid electrolytic capacitors, there has been a strong demand for smaller size, for example 2.54 x 4.57 x 2.54.
Products downsized to about mm have been put into practical use.
このように固体電解コンデンサが小形化される
と、樹脂材の上面にすべての表示記号を捺印する
ことは困難である。かといつて、表示記号を極端
に小さくすれば捺印可能なるも、その判読が困難
になるのみならず、鮮明に捺印し難いという問題
が生ずる。
When solid electrolytic capacitors are miniaturized in this way, it is difficult to stamp all the display symbols on the upper surface of the resin material. On the other hand, if the display symbol is made extremely small, it may be possible to imprint it, but it will not only be difficult to read, but it will also be difficult to imprint clearly.
従つて、従来においては特性など使用上、最も
必要とされる項目についてのみ捺印され、製造月
などについては捺印されない関係で、仮に何らか
の不良事故が生じた場合、その固体電解コンデン
サがどのような製造履歴を有し、かつ何時製造さ
れたものであるかを明らかにすることはできず、
不良の的確な原因を究明することが難しいという
問題がある。 Therefore, in the past, only the most necessary items such as characteristics were stamped, but information such as the month of manufacture was not stamped, so in the event that a defective accident occurred, it would be difficult to identify the manufacturing type of the solid electrolytic capacitor. It has a history and it is not possible to reveal when it was manufactured.
There is a problem in that it is difficult to determine the exact cause of defects.
それ故に、本案の目的は簡単な構成によつて外
装形態が小形化されても所望する表示記号を確実
に表示できる電子部品を提供することにある。 Therefore, an object of the present invention is to provide an electronic component that can reliably display a desired display symbol even if the exterior form is made smaller due to its simple configuration.
従つて、本案はこのような目的を達成するため
に、部品本体より複数の外部リード部材を異なる
方向に導出すると共に、部品本体を含む主要部分
を樹脂材にて、下面の中央部に突出部が形成され
るようにモールド被覆し、かつ外部リード部材の
それぞれの導出端を樹脂材の下面に沿うように配
置したものにおいて、上記突出部にエジエクタピ
ンによる凹部を形成すると共に、凹部に薄肉の立
上り部を放射状に一体的に形成し、この立上り部
を表示記号として利用できるように構成したもの
である。
Therefore, in order to achieve such an objective, the present invention leads out a plurality of external lead members in different directions from the component body, and also makes the main part including the component body a resin material with a protrusion in the center of the lower surface. is molded so that a The parts are integrally formed in a radial shape, and the rising part can be used as a display symbol.
この考案によれば、突出部の凹部に立上り部が
放射状に形成されているので、例えば立上り部を
適宜の組合せによつて残存させたり、或いは削除
したりすることによつて製造月、製造履歴などを
表示させることができる。
According to this invention, since the rising parts of the concave part of the protruding part are formed radially, for example, by leaving the rising parts in an appropriate combination or deleting them, the manufacturing month and manufacturing history can be determined. etc. can be displayed.
次に本案の一実施例について第1図〜第2図を
参照して説明する。
Next, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
図において、1は弁作用を有する金属粉末を角
柱状に加圧成形し焼結してなるコンデンサエレメ
ント(部品本体)であつて、それの中心には弁作
用を有する金属線が陽極リード2として、金属粉
末の加圧成形に先立つて植立されている。尚、こ
の陽極リード2はコンデンサエレメント1の周面
に溶接して導出することもできる。そして、コン
デンサエレメント1の周面には酸化層、半導体
層、グラフアイト層を介して電極引出し層3が形
成されている。一方、陽極リード2には例えば板
状の第1の外部リード部材4が溶接されており、
コンデンサエレメント1の電極引出し層3には例
えば板状の第2の外部リード部材5が銀ペースト
などの導電性接着剤を用いて接続されている。そ
して、コンデンサエレメント1の全周面は樹脂材
6にて、上面6aにおける端部に切欠き状の異形
部7が、下面6bの中央部に角形の突出部8が形
成されるようにモールド被覆されている。特に突
出部8の中央部分にはエジエクタピンによる例え
ば円形の凹部9が形成されており、その凹部9内
には薄肉の立上り部10が放射状に一体的に形成
されている。尚、この立上り部10はエジエクタ
ピンの頂部に放射状のスリツトを付与することに
よつて樹脂モールド時に同時に形成される。 In the figure, 1 is a capacitor element (component body) made by press-molding metal powder with valve action into a prismatic shape and sintering it, and in the center of it is a metal wire with valve action as the anode lead 2. , which is planted prior to pressure molding of metal powder. Note that this anode lead 2 can also be led out by welding to the circumferential surface of the capacitor element 1. An electrode lead layer 3 is formed on the circumferential surface of the capacitor element 1 via an oxide layer, a semiconductor layer, and a graphite layer. On the other hand, for example, a plate-shaped first external lead member 4 is welded to the anode lead 2.
For example, a plate-shaped second external lead member 5 is connected to the electrode lead layer 3 of the capacitor element 1 using a conductive adhesive such as silver paste. Then, the entire circumferential surface of the capacitor element 1 is covered with a resin material 6 by molding so that a notch-like irregularly shaped part 7 is formed at the end of the upper surface 6a and a rectangular protrusion 8 is formed at the center of the lower surface 6b. has been done. In particular, a circular recess 9 formed by an ejector pin is formed in the central portion of the protrusion 8, and thin rising portions 10 are integrally formed radially within the recess 9. Incidentally, this rising portion 10 is formed at the same time as resin molding by providing a radial slit at the top of the ejector pin.
この実施例において、立上り部10を例えば製
造月として利用する場合には立上り部10を6本
ないし12本形成し、製造月に応じて立上り部10
を適宜に削除すればよく、立上り部10のない部
分によつて製造月を簡単に表示できる。 In this embodiment, when the rising portion 10 is used as a manufacturing month, for example, 6 to 12 rising portions 10 are formed, and the rising portion 10 is formed according to the manufacturing month.
can be deleted as appropriate, and the month of manufacture can be easily displayed using the portion without the rising portion 10.
特に、立上り部10の除去はエジエクタピンと
同等のピンの頂面に除去したい立上り部に対応し
て膨隆部を、除去したくない立上り部に対応して
凹段部をそれぞれ形成しておき、このピンを凹部
9内に強制的に挿入することによつて、所定の立
上り部10のみを押し潰しにより除去できる。 In particular, to remove the rising portion 10, a bulge portion is formed on the top surface of a pin equivalent to the ejector pin, corresponding to the rising portion to be removed, and a recessed portion corresponding to the rising portion not to be removed. By forcibly inserting the pin into the recess 9, only the predetermined raised portion 10 can be crushed and removed.
以上のように本案によれば、突出部の凹部内に
立上り部が放射状に形成されているので、立上り
部を適宜の組合せによつて削除することにより製
造月、製造履歴、特性などを表示でき、外装形態
の小形化に充分に対応できる。特に立上り部が凹
部内に形成されることによつて、プリント板など
への組込み時に消失したりすることがないので、
事故発生時の原因究明を円滑に行うことができ
る。
As described above, according to the present invention, since the rising portions are formed radially within the concave portion of the protruding portion, the manufacturing month, manufacturing history, characteristics, etc. can be displayed by deleting the rising portions in an appropriate combination. , it can fully cope with the miniaturization of the exterior form. In particular, since the rising part is formed within the recess, it will not disappear when it is assembled into a printed board, etc.
It is possible to smoothly investigate the cause when an accident occurs.
尚、本案において、電子部品は固体電解コンデ
ンサにのみ制約されることなく、抵抗、コイルな
どにも適用できるし、凹部は円形の他、角形でも
よい。 In the present invention, the electronic component is not limited to solid electrolytic capacitors, but can also be applied to resistors, coils, etc., and the concave portion may be rectangular in addition to circular.
第1図は本案の一実施例を示す側断面図、第2
図は第1図の下面図である。
図中、1は部品本体(コンデンサエレメント)、
4,5は外部リード部材、6は樹脂材、6aは上
面、6bは下面、8は突出部、9は凹部、10は
立上り部である。
Figure 1 is a side sectional view showing one embodiment of the present invention, Figure 2
The figure is a bottom view of FIG. 1. In the figure, 1 is the component body (capacitor element),
4 and 5 are external lead members, 6 is a resin material, 6a is an upper surface, 6b is a lower surface, 8 is a protruding portion, 9 is a recessed portion, and 10 is a rising portion.
Claims (1)
方向に導出すると共に、部品本体を含む主要部
分を樹脂材にて、下面の中央部に突出部が形成
されるようにモールド被覆し、かつ外部リード
部材のそれぞれの導出端を樹脂材の下面に沿う
ように配置したものにおいて、上記突出部にエ
ジエクタピンによる凹部を形成すると共に、凹
部に薄肉の立上り部を放射状に一体的に形成し
たことを特徴とする電子部品。 (2) 立上り部を凹部から突出しないように形成し
たことを特徴とする実用新案登録請求の範囲第
1項に記載の電子部品。[Claims for Utility Model Registration] (1) A plurality of external lead members are led out in different directions from the component body, and the main portion including the component body is made of resin material, and a protrusion is formed in the center of the lower surface. In the case where the lead-out ends of the external lead members are arranged along the lower surface of the resin material, a recess is formed in the protruding part by an ejector pin, and a thin rising part is formed radially in the recess. An electronic component characterized by being integrally formed. (2) The electronic component according to claim 1 of the utility model registration claim, characterized in that the rising portion is formed so as not to protrude from the recessed portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7247184U JPS60183422U (en) | 1984-05-16 | 1984-05-16 | electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7247184U JPS60183422U (en) | 1984-05-16 | 1984-05-16 | electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183422U JPS60183422U (en) | 1985-12-05 |
| JPH0214191Y2 true JPH0214191Y2 (en) | 1990-04-18 |
Family
ID=30610902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7247184U Granted JPS60183422U (en) | 1984-05-16 | 1984-05-16 | electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183422U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009167441A (en) * | 2008-01-11 | 2009-07-30 | Sumitomo Electric Sintered Alloy Ltd | Molding die, method for imparting indication mark of manufacture month by using the same, and sintered component |
-
1984
- 1984-05-16 JP JP7247184U patent/JPS60183422U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60183422U (en) | 1985-12-05 |
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