JPH0214231Y2 - - Google Patents
Info
- Publication number
- JPH0214231Y2 JPH0214231Y2 JP11652485U JP11652485U JPH0214231Y2 JP H0214231 Y2 JPH0214231 Y2 JP H0214231Y2 JP 11652485 U JP11652485 U JP 11652485U JP 11652485 U JP11652485 U JP 11652485U JP H0214231 Y2 JPH0214231 Y2 JP H0214231Y2
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- layer
- impermeable layer
- plate
- insulating plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010410 layer Substances 0.000 claims description 25
- 239000004033 plastic Substances 0.000 claims description 13
- 229920003023 plastic Polymers 0.000 claims description 13
- 238000007650 screen-printing Methods 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
【考案の詳細な説明】
〔考案の目的〕
（産業上の利用分野）
本考案は、電磁波もしくは磁気から電気回路を
保護するための電磁波シールド板に関し、特に電
気製品に組む込まれる電気絶縁性の電磁波シール
ド板に関する。[Detailed description of the invention] [Purpose of the invention] (Field of industrial application) The present invention relates to an electromagnetic wave shielding plate for protecting electrical circuits from electromagnetic waves or magnetism, and is particularly applicable to electrically insulating materials incorporated into electrical products. Regarding electromagnetic shielding plates.
（従来の技術）
従来、電磁波シールド板としては、アルミニウ
ム、銅、鉄、銀、金等の金属板を加工し、電気絶
縁性を付与するためにこの金属板の一方の面ある
いは両面にプラスチツクフイルムを積層したもの
が知られている。例えば、実開昭59−112998号公
報には、金属板とこの金属板の両面に重ねた絶縁
材からなる２枚のフイルムから構成され、金属板
が除去された周辺部のフイルム同志が熱圧着によ
り接合されている電磁波シールド板が開示されて
いる。(Prior art) Conventionally, electromagnetic shielding plates have been produced by processing metal plates such as aluminum, copper, iron, silver, and gold, and then coating one or both sides of this metal plate with a plastic film to provide electrical insulation. Laminated materials are known. For example, in Japanese Utility Model Application Publication No. 59-112998, it is composed of two films made of a metal plate and an insulating material laminated on both sides of the metal plate, and the films in the peripheral area where the metal plate is removed are bonded together by thermocompression. An electromagnetic shielding plate is disclosed which is bonded by.
また、より薄い金属箔を電磁波不透過性材料と
して使用し、この金属箔の両面を硬質のプラスチ
ツク板で積層することによつて電気絶縁性とした
電磁波シールド板も知られている。 Also known is an electromagnetic shielding plate that uses thinner metal foil as an electromagnetic wave-impermeable material and has hard plastic plates laminated on both sides of the metal foil to provide electrical insulation.
しかしながら、よりコンパクト化を追求される
電気製品、例えば、ビデオデツキ、ビデオカメ
ラ、テレビ、トランシーバー、チユーナー、オー
デイオ機器、コンピユーター等の電気製品に電磁
波シールド板を組み込むような場合には、ターミ
ナルのための穴を加工したり、周辺を複雑な形状
に切断する必要があり、しかも加工した金属板を
絶縁性材上に正確に位置ぎめして張り合わさなけ
ればならないという製造工程上の問題点があつ
た。 However, when incorporating electromagnetic shielding plates into electrical products that are designed to be more compact, such as video decks, video cameras, televisions, transceivers, tuners, audio equipment, and computers, holes for terminals are required. There were problems in the manufacturing process, as it required processing and cutting the periphery into a complicated shape, and the processed metal plate had to be precisely positioned and pasted onto the insulating material.
（問題点を解決するための手段）
本考案は電磁波シールド効果を有する層をシル
クスクリーン印刷により設けることにより、金属
板を加工することの問題点を解決したものであ
る。すなわち、本考案は、絶縁性プラスチツク
板、電磁波不透過性層、接着材層、絶縁性プラス
チツク板からなる所定形状およびスルーホールを
有する積層物であつて、該積層物の周辺部および
該スルーホールの周辺部は、縁から所定の巾だけ
上記電磁波不透過性層が除去されてなり、上記電
磁波不透過性層は、シルクスクリーン印刷により
所定の形状に形成してなることを特徴とする上記
電磁波シールド板である。
(Means for Solving the Problems) The present invention solves the problems of processing metal plates by providing a layer having an electromagnetic wave shielding effect by silk screen printing. That is, the present invention provides a laminate having a predetermined shape and a through hole, comprising an insulating plastic plate, an electromagnetic wave impermeable layer, an adhesive layer, and an insulating plastic plate, the laminate having a predetermined shape and a through hole. The electromagnetic wave impervious layer is formed by removing a predetermined width from the edge of the electromagnetic wave impervious layer, and the electromagnetic wave impermeable layer is formed into a predetermined shape by silk screen printing. It is a shield plate.
以下、本考案を図面に基づいて説明する。 Hereinafter, the present invention will be explained based on the drawings.
第１図は本考案の電磁波シールド板の平面図で
あり、第２図は第１図ａ−ａの断面図を示したも
のである。 FIG. 1 is a plan view of the electromagnetic shielding plate of the present invention, and FIG. 2 is a sectional view taken along the line a-a in FIG. 1.
本考案の電磁波シールド板は、絶縁性プラスチ
ツク板１、電磁波不透過性層２、接着材層３およ
び絶縁性プラスチツク板１′からなる積層物であ
る。積層物の所定の位置にはターミナルのため
の、あるいはシールド板取りつけ用のスルーホー
ル４が設けてある。積層物の外周部５およびスル
ーホール周辺部６は、縁から一定の巾で電磁波不
透過性層が除去されている。電磁波不透過性層の
除去部５，６は、導電性である印刷層からの絶縁
を完全にするために設けられ、巾としては２mm〜
１cmが好ましい。除去部５，６は、好ましくは、
絶縁性プラスチツク板１が接着材層３を介して他
の絶縁性プラスチツク板１′と直接的に接合され
る。 The electromagnetic shielding plate of the present invention is a laminate consisting of an insulating plastic plate 1, an electromagnetic wave impermeable layer 2, an adhesive layer 3 and an insulating plastic plate 1'. A through hole 4 for a terminal or for attaching a shield plate is provided at a predetermined position in the laminate. The electromagnetic wave-impermeable layer is removed by a certain width from the edge of the outer circumferential portion 5 of the laminate and the peripheral portion 6 of the through hole. The removed portions 5 and 6 of the electromagnetic wave impermeable layer are provided to completely insulate from the conductive printed layer, and have a width of 2 mm to 2 mm.
1 cm is preferable. The removing units 5 and 6 preferably include:
An insulating plastic board 1 is directly joined to another insulating plastic board 1' via an adhesive layer 3.
また、電磁波シールド板の電位を回路のアース
ラインと等しくするために絶縁性板１もしくは
１′の一部から印刷層２を露出させ、この露出部
７をアースラインに接続するように形成しても良
い。 Further, in order to equalize the potential of the electromagnetic shielding plate with the earth line of the circuit, the printed layer 2 is exposed from a part of the insulating plate 1 or 1', and this exposed portion 7 is formed so as to be connected to the earth line. Also good.
本考案において絶縁性のプラスチツク板１，
１′は、硬質塩化ビニル樹脂、ポリエステル樹脂、
ポリカーボネート樹脂、アクリル樹脂等の樹脂シ
ートであつて、厚さ0.1〜１mm程度のものが使用
される。 In the present invention, an insulating plastic board 1,
1' is hard vinyl chloride resin, polyester resin,
A resin sheet made of polycarbonate resin, acrylic resin, etc. and having a thickness of about 0.1 to 1 mm is used.
本考案において電磁波不透過性層２は、導電性
の皮膜を形成することのできる導電性インキをシ
ルクスクリーン印刷により、所定形状に印刷した
ものである。導電性インキは、ニツケル、銅、炭
素、鉄、銀、金等の導電性の微粉とアクリル樹
脂、ウレタン樹脂、ポリエステル樹脂、ポリアミ
ド樹脂等のバインダー樹脂および溶剤を配合し、
スクリーン印刷適性を持たせたものである。電磁
波不透過性層２は、導電性インキを絶縁性プラス
チツク板１上に直にシルクスクリーン印刷するこ
とにより形成することができる。シルクスクリー
ン印刷層は予め定められたパターンにベタ印刷す
るか、もしくは格子状等の模様に印刷しても良
い。印刷層の厚さは10〜200μが好ましい。 In the present invention, the electromagnetic wave-impermeable layer 2 is printed in a predetermined shape by silk screen printing with conductive ink capable of forming a conductive film. Conductive ink is a mixture of conductive fine powder such as nickel, copper, carbon, iron, silver, and gold, binder resin such as acrylic resin, urethane resin, polyester resin, and polyamide resin, and a solvent.
It is suitable for screen printing. The electromagnetic wave-impermeable layer 2 can be formed by silk-screen printing a conductive ink directly onto the insulating plastic plate 1. The silk screen printing layer may be printed solidly in a predetermined pattern, or may be printed in a pattern such as a grid. The thickness of the printed layer is preferably 10 to 200μ.
本考案において接着材層３は、シルクスクリー
ン印刷層２とプラスチツク板１とを強固に接着で
きるものであれば、液状の接着剤あるいは接着性
シート等特に限定はされることなく使用できる。
接着材として両面接着性のシートを使用すれば、
作業性の点で有利である。 In the present invention, the adhesive layer 3 can be used without particular limitation, such as a liquid adhesive or an adhesive sheet, as long as it can firmly bond the silk screen printed layer 2 and the plastic board 1.
If you use a double-sided adhesive sheet as the adhesive,
It is advantageous in terms of workability.
厚さ0.5mmの硬質塩化ビニル樹脂シートの一方
の面に、メチルメタクリレートをバインダーとす
るニツケル粉含有（ニツケル含有率はインキ固形
分の80重量％）の導電性インキを用いて乾燥皮膜
50μになるようにシルクスクリーン印刷法により
ベタ印刷層を形成した。この導電性印刷層の上に
両面粘着テープ（東洋インキ製造株式会社製、商
品名ダブルフエースDF2700）を積層し、次いで
厚さ0.5mmの硬質塩化ビニル樹脂シートを積層し
た。
Dry film is applied to one side of a 0.5 mm thick hard vinyl chloride resin sheet using conductive ink containing nickel powder (nickel content is 80% by weight of ink solids) with methyl methacrylate as a binder.
A solid printing layer was formed using a silk screen printing method to have a thickness of 50 μm. A double-sided adhesive tape (manufactured by Toyo Ink Mfg. Co., Ltd., trade name: Double Face DF2700) was laminated on this conductive printed layer, and then a hard vinyl chloride resin sheet with a thickness of 0.5 mm was laminated.
この構成からなる電磁波シールド板は、500Mz
において50dbの電磁波シールド効果が得られた。 The electromagnetic wave shielding plate with this configuration is 500Mz
An electromagnetic shielding effect of 50db was obtained.
本考案の電磁波シールド板は、電磁波不透過性
層をシルクスクリーン印刷により形成するため、
金属板もしくは金属箔を加工する必要がなく、製
造工程上有利である。また、電磁波不透過性層を
複雑なパターンとすることも容易である。
The electromagnetic wave shielding plate of the present invention has an electromagnetic wave impermeable layer formed by silk screen printing.
There is no need to process the metal plate or metal foil, which is advantageous in terms of the manufacturing process. Furthermore, it is easy to form the electromagnetic wave-opaque layer into a complicated pattern.
第１図は本考案の電磁波シールド板の平面図、
第２図は第１図のａ−a′における断面図である。
１，１′……絶縁性プラスチツク板、２……電
磁波不透過性層、３……接着材層、４……スルー
ホール、５，６……電磁波不透過性層の除去部。
Figure 1 is a plan view of the electromagnetic shielding plate of the present invention.
FIG. 2 is a sectional view taken along line a-a' in FIG. 1, 1'... Insulating plastic plate, 2... Electromagnetic wave impermeable layer, 3... Adhesive layer, 4... Through hole, 5, 6... Removal portion of electromagnetic wave impermeable layer.
Claims (1)
着材層、絶縁性プラスチツク板からなる所定形状
およびスルーホールを有する積層物であつて、該
積層物の周辺部および該スルーホールの周辺部
は、縁から所定の巾だけ上記電磁波不透過性層が
除去されてなり、上記電磁波不透過性層は、導電
性の粉体をバインダー樹脂に配合した導電性イン
キをシルクスクリーン印刷により所定の形状に印
刷してなることを特徴とする上記電磁波シールド
板。 A laminate comprising an insulating plastic plate, an electromagnetic wave-impermeable layer, an adhesive layer, and an insulating plastic plate having a predetermined shape and a through hole, wherein the periphery of the laminate and the periphery of the through hole are edges. The electromagnetic wave impermeable layer is obtained by removing a predetermined width from the electromagnetic wave impermeable layer, and the electromagnetic wave impermeable layer is printed in a predetermined shape by silk screen printing with a conductive ink containing conductive powder mixed with a binder resin. The above-mentioned electromagnetic wave shielding plate is characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11652485U JPH0214231Y2 (en) | 1985-07-31 | 1985-07-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11652485U JPH0214231Y2 (en) | 1985-07-31 | 1985-07-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6226098U JPS6226098U (en) | 1987-02-17 |
| JPH0214231Y2 true JPH0214231Y2 (en) | 1990-04-18 |
Family
ID=31001196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11652485U Expired JPH0214231Y2 (en) | 1985-07-31 | 1985-07-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0214231Y2 (en) |
-
1985
- 1985-07-31 JP JP11652485U patent/JPH0214231Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6226098U (en) | 1987-02-17 |
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