JPH02142544U - - Google Patents
Info
- Publication number
- JPH02142544U JPH02142544U JP5171089U JP5171089U JPH02142544U JP H02142544 U JPH02142544 U JP H02142544U JP 5171089 U JP5171089 U JP 5171089U JP 5171089 U JP5171089 U JP 5171089U JP H02142544 U JPH02142544 U JP H02142544U
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- heat pipe
- heat
- hole
- brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims 2
- 238000003466 welding Methods 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
Description
第１図は本考案及び従来一般の半導体用ヒート
パイプ放熱器を示す平面図、第２図は第１図の
矢視図、第３図ないし第７図はベースプレートの
形成過程を示す図、第８図はヒートパイプのベー
スプレートへの取付部分を示す断面図、第９図は
ベースプレートの別の実施例を示す断面図、第１
０図及び第１１図はベースプレートの更に別の実
施例を示す平面図である。１……ヒートパイプ、
２……ベースプレート、３，３ｂ……穴、４……
放熱フイン、５……半導体素子、２１……貫通孔
。
Fig. 1 is a plan view showing the present invention and a conventional heat pipe heat sink for semiconductors; Fig. 2 is a view taken in the direction of the arrow in Fig. 1; Figs. 3 to 7 are views showing the process of forming the base plate; Fig. 8 is a sectional view showing the attachment part of the heat pipe to the base plate, Fig. 9 is a sectional view showing another embodiment of the base plate, and Fig. 1
0 and 11 are plan views showing still another embodiment of the base plate. 1...Heat pipe,
2... Base plate, 3, 3b... Hole, 4...
Heat dissipation fin, 5... semiconductor element, 21... through hole.
Claims (1)
ヒートパイプの他の側の開放端部を、半導体素子
が装着されるベースプレートに形成された複数の
穴にそれぞれ嵌挿し、ベースプレートから突出し
ているヒートパイプの部分にヒートパイプと交差
する多数の放熱フインを取付けた半導体用ヒート
パイプ放熱器において、ベースプレート、ヒート
パイプ、及び放熱フインをアルミニウムで形成し
、ベースプレートの上記穴を、押し出し加工で形
成した貫通孔の一端を溶接又はろう付けで塞いだ
構造とし、ヒートパイプを上記穴の出口の周縁に
溶接又はろう付けしてベースプレートに取付けた
ことを特徴とする半導体用ヒートパイプ放熱器。 A plurality of heat pipes are arranged in parallel and the ends on the same side are closed, and the open ends on the other side are respectively inserted into a plurality of holes formed in a base plate on which a semiconductor element is mounted, and the heat pipes protrude from the base plate. In a heat pipe heat radiator for semiconductors in which a large number of heat dissipation fins are attached to the part of the heat pipe that intersects with the heat pipe, the base plate, the heat pipe, and the heat dissipation fins are made of aluminum, and the holes in the base plate are formed by extrusion processing. A heat pipe radiator for a semiconductor, characterized in that one end of a through hole is closed by welding or brazing, and a heat pipe is attached to a base plate by welding or brazing to the periphery of the outlet of the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5171089U JPH06828Y2 (en) | 1989-05-01 | 1989-05-01 | Heat pipe radiator for semiconductors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5171089U JPH06828Y2 (en) | 1989-05-01 | 1989-05-01 | Heat pipe radiator for semiconductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02142544U true JPH02142544U (en) | 1990-12-04 |
| JPH06828Y2 JPH06828Y2 (en) | 1994-01-05 |
Family
ID=31571384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5171089U Expired - Lifetime JPH06828Y2 (en) | 1989-05-01 | 1989-05-01 | Heat pipe radiator for semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06828Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008210593A (en) * | 2007-02-23 | 2008-09-11 | Matsushita Electric Works Ltd | Lighting device |
-
1989
- 1989-05-01 JP JP5171089U patent/JPH06828Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008210593A (en) * | 2007-02-23 | 2008-09-11 | Matsushita Electric Works Ltd | Lighting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06828Y2 (en) | 1994-01-05 |
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