JPH0214515A - Jig for semiconductor manufacture use - Google Patents

Abstract

PURPOSE:To obtain a wafer free from a warp and a defect even when a large- diameter wafer is used by a method wherein a wafer-heating means is installed at a jig for semiconductor manufacture use in order to prevent a strong thermal stress from being exerted on the wafer. CONSTITUTION:A wafer 12 which has been placed on a jig 11 is heated gradually by using a heater 18 which has been buried in a part, holding the wafer 11, of the jig 11; it is heated in such a way that a temperature difference between an end edge part and the central part of the wafer 12 becomes zero. While this heating state is maintained, the jig 11 is shifted to the left and the wafer 12 is inserted into a chamber 13. Thereby, since the wafer 12 has already been heated when it is inserted into the chamber 13, a strong thermal stress is not exerted on the wafer 12. Accordingly, the wafer 12 is prevented from being warped heavily by the strong thermal stress and the thermal stress does not cause a defect of the wafer 12.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor manufacturing jig used when manufacturing a semiconductor device.

[Prior Art] FIG. 4 is a schematic cross-sectional view showing a semiconductor manufacturing apparatus using a conventional semiconductor manufacturing jig. In the figure, 1 is a jig for loading and unloading and holding a wafer, 2 is a wafer, 3 is a chamber maintained at a high temperature, and 4 is a heater for controlling the temperature of the chamber.

In conventional manufacturing equipment, the wafer 2 held by a jig 1 is placed into a chamber 3 whose temperature is controlled by a heater 4, thereby subjecting the wafer 2 to necessary oxidation and diffusion treatments.

[Problems to be Solved by the Invention] Conventional semiconductor manufacturing equipment is configured as described above, so when the wafer is placed into or taken out of the chamber using a jig, the edges and center of the wafer are A temperature difference occurs between them. For this reason, especially in a wafer having a large diameter, the thermal stress based on the temperature difference causes warping, and the thermal stress causes defects.

This invention was made to solve the above-mentioned problems, and aims to provide a semiconductor manufacturing jig that can reduce the temperature difference within the wafer when the wafer is placed in the chamber. purpose.

[Means for Solving the Problems] A semiconductor manufacturing jig according to the present invention is a semiconductor manufacturing jig for loading and unloading a wafer into a chamber maintained at a high temperature, and includes a portion that holds the wafer. It has wafer heating means.

[Function] In the semiconductor manufacturing jig according to the present invention, the temperature difference between the chamber and the wafer can be reduced by heating the wafer in advance by the heating means when the wafer is placed in the chamber. As a result, the temperature of the wafer placed in the chamber rises rapidly, creating a large temperature difference between the edges and the center of the wafer, causing the wafer to warp.
Defects no longer occur due to thermal stress.

[Example] An embodiment of the present invention will be described below.

FIG. 1 is a sectional view showing a state when temperature correction is performed before processing a wafer. FIG. 2 is a schematic cross-sectional view of a jig for holding and loading/unloading wafers.

In FIG. 1, a large number of wafers 12 are stood on a jig 11 at intervals. A chamber 13 heated to a high temperature is arranged in front of the jig 11 (on the left side in FIG. 1). The chamber 13 is maintained at a high temperature by a resistance heating type heater 14.

A thermocouple 15 is mounted on the wafer 12 held by the jig 11.
．． 16 are arranged. The thermocouple 15 is a thermocouple for measuring the temperature of the edge of the wafer 12. The thermocouple 16 is a thermocouple for measuring the temperature at the center of the wafer 12.

On the other hand, a cooling gas supply port 1 is located near the entrance of the chamber 13.
7 is provided. An inert gas such as N 2 can be introduced into the chamber 13 through the cooling gas supply port 17 .

In the portion of the jig 11 that holds the wafer 12, a second
As shown in the figure, a heater 18 is embedded. This heater 18 is for heating the wafer 12 placed on the jig 11.

Next, the operation of the above embodiment will be explained.

Before processing the wafer 12, temperature correction is first performed. Thermocouples 15 and 16 are arranged as shown in FIG. Monitor the difference. On the other hand, the wafer 12 is gradually heated by the heater 18 so that the temperature difference between the edge portion and the center portion of the wafer 12 becomes zero. While maintaining the heated state, the jig 11 is moved to the left in FIG. 1 and the wafer 12 is inserted into the chamber 13.

When the processing of the wafer 12 in the chamber 13 is completed, cooling gas is introduced into the chamber 13 from the cooling gas supply port 17 . After cooling the wafer 12 to a certain extent in advance,
Move the jig 11 to the right side in FIG. .

After monitoring for temperature correction as described above, the wafer 12 that actually needs to be processed is placed on the jig 11.
The same operation as described above is performed without using the thermal lightning pairs 15 and 16. As a result, the wafer 12 is already heated when it is inserted into the chamber 13, and no strong thermal stress is applied to the wafer 12. Further, when taking out the wafer 12 from the chamber 13, the wafer 12 is cooled to a certain degree by the action of the cooling gas, so that no strong thermal stress is applied to the wafer 12. Therefore, strong thermal stress does not cause strong warping of the wafer 12, and the thermal stress does not cause defects in the wafer 12.

Note that instead of the heater 18 shown in FIG. 2, a heating lamp 19 may be attached to the jig 11 as shown in FIG. 3, and the wafer 12 may be heated by this lamp 19, in the same manner as in the above embodiment. It is possible to achieve the following effects. Further, the position of the cooling gas supply port 17 is not limited to the inlet side of the chamber 13, and if it is not in a position where the gas is directly applied to the thermocouples 15 and 16, the position of the cooling gas supply port 17 is not limited to the inlet side of the chamber 13. It can be placed anywhere on the mouth side.

[Effects of the Invention] As described above, according to the present invention, since the wafer heating means is provided in the semiconductor manufacturing jig, it is possible to prevent strong thermal stress from being applied to the wafer. Therefore, it becomes possible to process the wafer so that the temperature distribution within the wafer surface becomes uniform even when the wafer is taken in and out, and even when a wafer with a large diameter is used, it becomes possible to obtain a wafer without warpage or defects.

[Brief explanation of the drawing]

FIG. 1 is a schematic vertical cross-sectional view of a semiconductor manufacturing apparatus using a jig according to an embodiment of the present invention. FIG. 2 is a schematic vertical cross-sectional view of a jig according to an embodiment of the present invention. FIG. 3 is a schematic vertical cross-sectional view of a semiconductor manufacturing jig according to another embodiment. FIG. 4 is a diagram corresponding to FIG. 1 of the conventional example. 11 is a jig, 12 is a wafer, 13 is a chamber, and 18 is a heater.

Claims (1)

[Claims] A semiconductor manufacturing jig for loading and unloading a wafer into a chamber maintained at a high temperature, the semiconductor manufacturing jig having a wafer heating means in a wafer holding part.