JPH02145676A - Adhesive for copper foil for copper-clad laminate - Google Patents
Adhesive for copper foil for copper-clad laminateInfo
- Publication number
- JPH02145676A JPH02145676A JP29999088A JP29999088A JPH02145676A JP H02145676 A JPH02145676 A JP H02145676A JP 29999088 A JP29999088 A JP 29999088A JP 29999088 A JP29999088 A JP 29999088A JP H02145676 A JPH02145676 A JP H02145676A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- copper
- resin
- epoxy resin
- accelerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 8
- 239000011889 copper foil Substances 0.000 title claims description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 6
- 239000013034 phenoxy resin Substances 0.000 claims abstract description 6
- 229920006287 phenoxy resin Polymers 0.000 claims abstract description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 5
- 229930003836 cresol Natural products 0.000 claims abstract description 5
- 229920003986 novolac Polymers 0.000 claims abstract description 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 7
- 239000004202 carbamide Substances 0.000 claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 4
- 239000005011 phenolic resin Substances 0.000 abstract description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 238000013329 compounding Methods 0.000 abstract 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- -1 methyl ether ketone Chemical class 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MGJKQDOBUOMPEZ-UHFFFAOYSA-N N,N'-dimethylurea Chemical compound CNC(=O)NC MGJKQDOBUOMPEZ-UHFFFAOYSA-N 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 description 1
- XXOYNJXVWVNOOJ-UHFFFAOYSA-N fenuron Chemical compound CN(C)C(=O)NC1=CC=CC=C1 XXOYNJXVWVNOOJ-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、フェノール檎脂含浸のプリプレグを使用する
銅張ｆｉ１層版の銅箔接層剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a copper foil adhesive for a copper-clad FI1 layer plate using a prepreg impregnated with phenol resin.
銅張積層機の装造においてＮ４箔用接層剤にエポキシ樹
脂を用いた例は、％開昭５６−１０４９２５号公報に記
載されているが、エポキシ樹脂、アミン系硬化剤、フェ
ノキン樹脂の混合物を用いる方法があり、特公昭６０−
５４８６０号公報に記載されているエポキシ樹脂、ポリ
ビニルブチラール樹脂、メラミン樹脂の混合物を用いる
方法かある。寸だ、こｎら＠陥用接層剤の経日変化を防
止する例としては、特開昭６２−１３２９８６に記載さ
ｔているように、溶剤にシクロへキサノンケ用いる方法
がある。An example of using an epoxy resin as a layering agent for N4 foil in the preparation of a copper clad laminating machine is described in Japanese Patent Publication No. 56-104925. There is a method using
There is a method using a mixture of epoxy resin, polyvinyl butyral resin, and melamine resin, which is described in Japanese Patent No. 54860. As an example of preventing aging of these adhesives, there is a method of using cyclohexanone as a solvent, as described in JP-A-62-132986.
特開昭５６−１０４９２５号公報及び特公昭６０−５４
８６０号公報に記載さｎた例は、接着剤のポットライン
が短く、経日変化ＫＬるゲル化時間の短縮及び粘度の増
大があり、これは銅張積層板の半田耐熱性を低下する原
因となる。Japanese Unexamined Patent Publication No. 56-104925 and Japanese Patent Publication No. 60-54
In the example described in Publication No. 860, the pot line of the adhesive is short, and the gelation time due to aging is shortened and the viscosity increases, which causes a decrease in the soldering heat resistance of the copper-clad laminate. becomes.
また、特開昭６２−１３２９８６号公報に示された例は
、樹脂を溶剤シクロヘキサノンに溶かしてポットライン
を伸ばしているが、接着剤樹脂の濃度が低く、しかも悪
臭有害である。In addition, in the example shown in JP-A-62-132986, the pot line is extended by dissolving the resin in the solvent cyclohexanone, but the concentration of the adhesive resin is low and the odor is harmful.
本発明は、フェノール樹脂含浸のプリプレグを接珊対象
とし、クレゾールノボラック型または脂環型のエポキシ
樹脂、２エノキシ樹脂及び硬化剤ジシアンシアずドを含
有する組成物によって成る銅張積層板用銅箔接層剤であ
る。The present invention targets a prepreg impregnated with a phenolic resin, and the copper foil adhesive for copper-clad laminates is made of a composition containing a cresol novolak type or alicyclic type epoxy resin, a di-enoxy resin, and a curing agent dicyanhydride. It is a layering agent.
本発明に使用する上記エポキシ樹脂によると良好な半田
ｖＪ寸熱性を得ることができるが、その他のエポキシ樹
脂ではこのような効果を得ろことはできない。The above epoxy resin used in the present invention can provide good solder vJ thermal properties, but other epoxy resins cannot provide such effects.
硬化剤は、ジンアンジアミドを用いると＠箔との接着強
度を向よする。When dianediamide is used as the curing agent, it improves the adhesive strength with the foil.
硬化促進剤は、イミダゾールまたはその訪専体と尿素系
促進剤を併用すると、接着剤のゲル化時間の短縮、粘度
の増大による塗布性低下を抑制することができろ。尿素
系促進剤は、例えばＤＣＭＵ（３−（３，４−ジクロロ
フェニル）−１，１−ジメチルウレア）、ＰＭＵ （３
−フェニル−１，１−ジメチルウレア）などの他、芳香
族及び脂環族ジメチルウレアなどがある。When a curing accelerator is used in combination with imidazole or a derivative thereof and a urea-based accelerator, it is possible to shorten the gelation time of the adhesive and suppress a decrease in applicability due to an increase in viscosity. Examples of urea-based accelerators include DCMU (3-(3,4-dichlorophenyl)-1,1-dimethylurea), PMU (3
-phenyl-1,1-dimethylurea), aromatic and alicyclic dimethylureas, and the like.
フェノキシ樹脂は、分子量的１００００〜約８００００
程度の通常用いられるものでよい。Phenoxy resin has a molecular weight of 10,000 to about 80,000
Any commonly used one may be used.
以上の混合比率をエポキシ樹脂５０〜９０部に対してフ
ェノキシ樹脂１０〜５０部とすると、はんだ耐熱性及び
はく離強度の均衡が良くとｎで望ましい。硬化剤はエポ
キシ樹脂に対して１〜１０％、硬化促進剤はエポキシ樹
脂に対して１〜５％としそのうちイミダゾール系３０〜
９０％尿素系１０〜７０％が適当である。用いる溶剤は
、エポキシ樹脂及びフェノキシ樹脂ヲ浴解するもので良
いが、メチルエテルケトンが溶解し易く望ましい。When the above mixing ratio is 10 to 50 parts of phenoxy resin to 50 to 90 parts of epoxy resin, it is desirable to achieve a good balance between solder heat resistance and peel strength. The curing agent is 1 to 10% based on the epoxy resin, and the curing accelerator is 1 to 5% based on the epoxy resin.
90% urea type 10-70% is suitable. The solvent used may be one that dissolves the epoxy resin and phenoxy resin, but methyl ether ketone is preferred because it dissolves easily.
硬化剤及び硬化促進剤はメチルセロソルブとメチルエテ
ルケトンの混合浴剤で溶滌する。The curing agent and curing accelerator are dissolved in a mixed bath agent of methyl cellosolve and methyl ether ketone.
上記の条件で固形分約７０％となるようにａ件混合して
得た接滑剤金銅箔に塗布し約１３０℃、１０分間乾燥し
て接着剤付き銅箔とする。こγＬ全数枚のフェノール樹
脂含浸のプリプレグと京ね会わせて加熱加圧成形し銅張
積層板とする。The lubricant was applied to a gold-copper foil obtained by mixing a mixture under the above conditions so that the solid content was about 70%, and dried at about 130° C. for 10 minutes to obtain an adhesive-coated copper foil. All of this γL is combined with phenol resin-impregnated prepreg and molded under heat and pressure to form a copper-clad laminate.
エポキシ樹脂に対してシフアンシアばド１０％及びイミ
ダゾール３％、尿素糸Ｕ−ＣＡＴ３５０３Ｎ（脂環族系
ジメチルウレア、サンアプロシ）２％をメチルセロソル
ブで溶解した後、メチルエテルケトンで調製しながらエ
ポキシ樹脂ＹＤＣＮ−７０３（クレゾールノボラック型
、東部化成製）７０部、フェノキシ位（脂ＹＰ−５０Ｃ
（分子′ｊｔ３００００、東部化成勲）６０都全治解し
て得た接着剤全銅箔に塗布し乾燥して接着剤付きｗＪ陥
とした。これ全プリフレグと１ね曾わせ加熱加圧成形し
て鋼張積層ｇｌを得た。After dissolving 10% of Sihuanshiabad, 3% of imidazole, and 2% of urea thread U-CAT3503N (alicyclic dimethylurea, Sun-Aprosy) in epoxy resin with methyl cellosolve, epoxy resin YDCN was prepared while preparing with methyl ether ketone. -703 (cresol novolac type, manufactured by Tobu Kasei) 70 parts, phenoxy position (fatty YP-50C)
(Molecular 'jt30000, Tobu Kasei-Kun) An adhesive obtained by completely curing 60 cities was applied to a full copper foil and dried to form an adhesive-coated wJ. This was mixed with the entire pre-freg and heated and press-molded to obtain a steel-clad laminated GL.
エポキシ樹脂に対してジンアンジアミド１０％及びイミ
ダゾール５％をメチルセロソルブで浴解し、他は実施例
と同様にした。The epoxy resin was bath-dissolved with 10% dianediamide and 5% imidazole with methyl cellosolve, and the rest was the same as in the example.
以上の実施例及び比較従来例で得た接層剤の試験結果を
表１に示す。各試験項目の試験方法は次に依る。Table 1 shows the test results of the adhesives obtained in the above examples and comparative conventional examples. The test method for each test item is as follows.
接着粘度＝Ｂ型粘度＃ｔＫ依る。Adhesive viscosity = Type B viscosity depends on #tK.
半田耐熱性：ＪＩＳ Ｃ６４８１に依る（２６０℃溶
融半田槽）。Soldering heat resistance: According to JIS C6481 (260°C molten solder bath).
はく離強度：ＪＩＳ Ｃ６４８１に依る（２０℃常態
）１゜
表１
〔発明の効果〕
本発明の接着剤によると、半田耐熱性及びはく離強度の
何れも優秀である。Peeling strength: According to JIS C6481 (20° C. normal state) 1° Table 1 [Effects of the invention] According to the adhesive of the present invention, both solder heat resistance and peeling strength are excellent.
さらに硬化促進剤としてイミダゾールと尿素系促進剤を
併用する時は、上記の＆ｎた％注に加えて、接層剤の貯
蔵安定性が向上し、こｎによって接着剤の経日変化によ
る半田耐熱性の低下を防止する結果となる。Furthermore, when imidazole and a urea-based accelerator are used together as a curing accelerator, in addition to the above-mentioned &nta% note, the storage stability of the adhesive improves, and this improves the adhesive's resistance to soldering heat due to aging. This results in prevention of sexual decline.
貯蔵安定性については、従来の約１０日に対して本発明
の接着剤（工約６０日である。Regarding storage stability, the adhesive of the present invention has a storage stability of about 60 days, compared to about 10 days for conventional adhesives.
代理人 弁理士 廣 瀬 章５．）Agent Patent Attorney Hirose Chapter 5. )
Claims (1)
、フェノキシ樹脂及び硬化剤ジシアンジアミドを含有す
る組成物によって成るフェノール樹脂含浸プリプレグ使
用の銅張積層板用銅箔接着剤。 ２、硬化促進剤としてイミダゾールと尿素系促進剤とし
てイミダゾールと尿素系促進剤とを併用添加して成る請
求項１記載のフェノール樹脂含浸プリプレグ使用の銅張
積層横用銅箔接着剤。[Scope of Claims] 1. A copper foil adhesive for copper-clad laminates using a phenolic resin-impregnated prepreg comprising a composition containing a cresol novolac type or alicyclic epoxy resin, a phenoxy resin, and a curing agent dicyandiamide. 2. A copper foil adhesive for horizontal use in copper-clad laminates using a phenolic resin-impregnated prepreg according to claim 1, which comprises a combination of imidazole as a curing accelerator and imidazole and a urea accelerator as a urea accelerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29999088A JPH0692572B2 (en) | 1988-11-28 | 1988-11-28 | Copper foil adhesive for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29999088A JPH0692572B2 (en) | 1988-11-28 | 1988-11-28 | Copper foil adhesive for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02145676A true JPH02145676A (en) | 1990-06-05 |
| JPH0692572B2 JPH0692572B2 (en) | 1994-11-16 |
Family
ID=17879416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29999088A Expired - Lifetime JPH0692572B2 (en) | 1988-11-28 | 1988-11-28 | Copper foil adhesive for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0692572B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999040150A1 (en) * | 1998-02-05 | 1999-08-12 | Minnesota Mining And Manufacturing Company | Adhesive composition and precursor thereof |
| US6228500B1 (en) | 1999-03-08 | 2001-05-08 | 3M Innovative Properties Company | Adhesive composition and precursor thereof |
| US6231959B1 (en) | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
| CN1296450C (en) * | 2000-10-06 | 2007-01-24 | 索尼化学株式会社 | Adhesives and electrical devices |
| JP2010254819A (en) * | 2009-04-24 | 2010-11-11 | Panasonic Electric Works Co Ltd | Epoxy resin composition, prepreg, laminate, and multilayer board |
| CN106893256A (en) * | 2015-12-18 | 2017-06-27 | 比亚迪股份有限公司 | A kind of epoxy resin composition for prepreg and preparation method thereof and prepreg |
| CN108948656A (en) * | 2017-05-23 | 2018-12-07 | 惠展电子材料（上海）有限公司 | A kind of environment-friendly epoxy sealing compositions of AIR COND RLY Air Conditioner Relay |
| JPWO2019098028A1 (en) * | 2017-11-16 | 2019-11-14 | 三菱ケミカル株式会社 | Thermosetting resin composition, prepreg, fiber reinforced composite material and method for producing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6054860B2 (en) | 2013-12-13 | 2016-12-27 | 浩基 石田 | Cultivator blade |
-
1988
- 1988-11-28 JP JP29999088A patent/JPH0692572B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6231959B1 (en) | 1995-02-27 | 2001-05-15 | Matsushita Electric Works, Ltd. | Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
| WO1999040150A1 (en) * | 1998-02-05 | 1999-08-12 | Minnesota Mining And Manufacturing Company | Adhesive composition and precursor thereof |
| US6228500B1 (en) | 1999-03-08 | 2001-05-08 | 3M Innovative Properties Company | Adhesive composition and precursor thereof |
| CN1296450C (en) * | 2000-10-06 | 2007-01-24 | 索尼化学株式会社 | Adhesives and electrical devices |
| JP2010254819A (en) * | 2009-04-24 | 2010-11-11 | Panasonic Electric Works Co Ltd | Epoxy resin composition, prepreg, laminate, and multilayer board |
| CN106893256A (en) * | 2015-12-18 | 2017-06-27 | 比亚迪股份有限公司 | A kind of epoxy resin composition for prepreg and preparation method thereof and prepreg |
| CN108948656A (en) * | 2017-05-23 | 2018-12-07 | 惠展电子材料（上海）有限公司 | A kind of environment-friendly epoxy sealing compositions of AIR COND RLY Air Conditioner Relay |
| JPWO2019098028A1 (en) * | 2017-11-16 | 2019-11-14 | 三菱ケミカル株式会社 | Thermosetting resin composition, prepreg, fiber reinforced composite material and method for producing the same |
| US10988589B2 (en) | 2017-11-16 | 2021-04-27 | Mitsubishi Chemical Corporation | Thermosetting resin composition, prepreg, and fiber-reinforced composite material and production method therefor |
| US11618803B2 (en) | 2017-11-16 | 2023-04-04 | Mitsubishi Chemical Corporation | Thermosetting resin composition, prepreg, and fiber-reinforced composite material and production method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0692572B2 (en) | 1994-11-16 |
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