JPH02146140U - - Google Patents
Info
- Publication number
- JPH02146140U JPH02146140U JP1989056581U JP5658189U JPH02146140U JP H02146140 U JPH02146140 U JP H02146140U JP 1989056581 U JP1989056581 U JP 1989056581U JP 5658189 U JP5658189 U JP 5658189U JP H02146140 U JPH02146140 U JP H02146140U
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- band
- adhesive layer
- shaped
- seal piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Description
第１図はこの考案の一実施例の構成を示す断面
図、第２図はその製造説明図、第３図はそれに使
用する複合テープの製造説明図、第４図は複合テ
ープに対する打ち抜き加工の状態を示す説明図、
第５図はそれによつて得られたこの考案のキヤリ
ヤテープ付小形電子部品封止用シール片の使用説
明図、第６図はこの考案のキヤリヤテープ付小形
電子部品封止用シール片で電子部品を封止した状
態を示す説明図である。
１……帯状キヤリヤテープ、２……シール片、
３……粘着層、４……セパレート層、５，６……
離型処理槽、Ｈ……四角枠状の切り込み部。
Figure 1 is a sectional view showing the structure of an embodiment of this invention, Figure 2 is an explanatory diagram of its manufacture, Figure 3 is an explanatory diagram of the manufacture of the composite tape used therein, and Figure 4 is a diagram of the punching process for the composite tape. An explanatory diagram showing the state,
Fig. 5 is an explanatory diagram of the use of the thus obtained seal piece for sealing small electronic parts with a carrier tape of this invention, and Fig. 6 is an illustration of the use of the seal piece for sealing small electronic parts with a carrier tape of this invention to seal electronic parts. It is an explanatory view showing a stopped state. 1... Band-shaped carrier tape, 2... Seal piece,
3... Adhesive layer, 4... Separate layer, 5, 6...
Mold release treatment tank, H...square frame-shaped notch.
Claims (1)
もつ封止用樹脂からなる粘着層が帯状に積層密着
形成され、この粘着層上にセパレート材からなる
セパレート層が帯状に積層密着形成された帯状複
合テープに対して、上記粘着層を通つてセパレー
ト層に達する枠状の切り込みを長手方向に所定間
隔で設けた状態で上記帯状粘着層およびセパレー
ト層を長手方向の一端部から剥離することにより
、帯状キヤリヤテープの表面に、枠状切り込みで
囲われた部分からなるシール片を所定間隔で残し
てなるキヤリヤテープ付小形電子部品封止用シー
ル片。 (2) 粘着層がタツク性を有する熱硬化性樹脂か
ら構成されている請求項(1)記載のキヤリヤテー
プ付小形電子部品封止用シール片。 (3) シール片のキヤリヤテープに対する接着力
が、５〜１００ｇ／２５mmに設定されている請求
項(1)記載のキヤリヤテープ付小形電子部品封止
用シール片。[Claims for Utility Model Registration] (1) An adhesive layer made of a sealing resin with tackiness is laminated and adhered to the surface of the carrier tape in the form of a band, and a separate layer made of a separating material is formed on this adhesive layer in the form of a band. With respect to the band-shaped composite tape formed in close contact with each other, the band-shaped adhesive layer and the separate layer are placed at one end in the longitudinal direction, with frame-shaped cuts reaching the separate layer through the adhesive layer provided at predetermined intervals in the longitudinal direction. A seal piece for encapsulating small electronic components with a carrier tape, which leaves seal pieces consisting of parts surrounded by frame-shaped cuts at predetermined intervals on the surface of a band-shaped carrier tape by peeling it off from the carrier tape. (2) The seal piece for sealing small electronic components with a carrier tape according to claim (1), wherein the adhesive layer is made of a thermosetting resin having tackiness. (3) The seal piece for sealing small electronic components with a carrier tape according to claim (1), wherein the adhesive force of the seal piece to the carrier tape is set to 5 to 100 g/25 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056581U JPH02146140U (en) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989056581U JPH02146140U (en) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146140U true JPH02146140U (en) | 1990-12-12 |
Family
ID=31580537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989056581U Pending JPH02146140U (en) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146140U (en) |
-
1989
- 1989-05-16 JP JP1989056581U patent/JPH02146140U/ja active Pending
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